Abstract: A training sequence and digital linearization process for a power amplifier are provided. In particular, a system for maintaining linear operation of an amplifier is includes an estimation component configured to determine compensation coefficients. The system further includes a digital pre-distorter configured to compensate for non-linear operation of the amplifier based on the compensation coefficients. The compensation coefficients are determined based on a training sequence signal having a time synchronization portion and a linearization sequence portion.

Abstract: Transparent conducting oxide thin films having a reduced indium content and/or an increased tin content are provided. In addition, processes for producing the same, precursors for producing the same, and transparent electroconductive substrate for display panels and organic electroluminescence devices, both including the transparent conducting oxide thin films, are provided.

Abstract: A direct-metal deposition (DMD) processing stage and a 5DOF (degree of freedom) dry micro-EDM (mEDM) stage are integrated to provide the submicron scale resolution necessary for the ultra-precision processing of work pieces. The DMD processing stage includes optical feedback for dimensional control utilizing a high-power, fiber-coupled diode laser with fast response time and small beam parameter product. The electrical discharge machining (EDM) stage is a dry EDM stage using an inert gas with appropriate dielectric properties to perform the surface finishing operations. The system further includes one or more surface treatment operations to obtain a desired level of surface hardness or wear resistance and/or to minimize the distortion induced in treating the surface.

Abstract: A multiprocessor system according to this invention comprises a main board, an expansion board, and at least a connection card. The main board comprises a plurality of first processors, such as four (4) CPUs, and at least a first socket. The expansion board comprises a plurality of second processors, such as four (4) CPUs, and at least a second socket. The plurality of first processors selectively communicates with each other by way of a plurality of first processor buses, which may be dual unidirectional point-to-point buses such as HT buses. The plurality of second processors selectively communicates with each other by way of a plurality of second processor buses, which may be dual unidirectional point-to-point buses such as HT bus. The connection card(s) electronically connect(s) to the first socket(s) and the second socket(s) for providing connection between at least one of the first processor of the main board and at least one of the second processor of the expansion board.

Abstract: A multiprocessor system is disclosed, which comprises a plurality of processor unit, such as eight processor units, and a plurality of interconnection bus that may be a dual unidirectional point-to-point bus. Every interconnection bus connects predetermined two of the processor units. Particularly, at least two of the interconnection buses are crossed to each other.

Abstract: Transparent conducting oxide compositions having enhanced work function, for use with anode structures and light-emitting diode devices.

Abstract: A high resolution, compact size and low cost multi-degree-of-freedom geometric error measurement system for simultaneously measuring four geometric errors, horizontal straightness, vertical straightness, pitch and yaw. The pitch and yaw error measurements are based on a new method of angle measurement in turn based on the internal reflection effect at an air/glass boundary. The method uses a differential detection scheme to largely reduce the inherent non-linearity of the reflectance versus the angle of incidence in internal reflection. With non-linearity reduced, the displacement of the angle of incidence can be determined accurately by measuring the reflectance. The resolution and measurement range are determined by the initial angle of incidence, the polarization state of light, and the number of reflections. Compared with interferometers and autocollimators, this method has the advantage of a simple sensor design for applications ranging from very wide measurement range to extremely high resolution.