Abstract: An electrode plate is provided. The electrode plate includes a substrate and a coating coated on the substrate plate, wherein the coating includes fluoride oxide graphene materials. The fluoride oxide graphene material has excellent conductivity, so that the electrode material which is made of the graphene material has high energy density and electrical conduction efficiency. A preparing method for the electrode plate, and a super capacitor and a lithium ion battery both prepared with the electrode plate are also provided.

Abstract: An electrode sheet is provided. The electrode sheet includes a substrate and a coating layer coated on the substrate. The coating layer includes a graphene fluoride stuff, the graphene fluoride stuff has excellent conductivity. An electrode material produced by the graphene fluoride stuff has higher energy density and higher conductivity. Furthermore, a preparation method of the electrode sheet, a super capacitor and a lithium ion battery used the electrode sheet are provided.

Abstract: A protection circuit includes first and second electronic switches. When a CPU socket does not contain a CPU, a signal pin of the CPU socket outputs a high level signal. The first and second electronic switches are turned on. A data transmitting line of a SMBus is connected to a digital integrated chip. The parameters of the digital integrated chip can thus be regulated. When the CPU socket contains the CPU, the signal pin of the CPU socket outputs a low level signal. The first and second electronic switches are turned off. The data transmitting line of the SMBus is disconnected from the digital integrated chip, to prevent damage to the digital integrated chip.

Abstract: Provided are a lithium iron phosphate composite material, the production method thereof and the use thereof The lithium iron phosphate composite material has a micro-size particle structure, which contains nano-size grains of lithium iron phosphate and graphene inside, and bears nano-carbon particulates outside. The lithium iron phosphate composite material has the properties of high conductivity, high-rate charge/discharge performance and high tap density.

Abstract: A motherboard includes a central processing unit (CPU), a drive, and a voltage-state display system to display a voltage mode of the CPU. The voltage-state display system includes a power management chip, a first transistor, a second transistor, a first light emitting diode (LED), and a second LED. A first phase output terminal of the power management chip is connected to the first LED through the first transistor. A second phase output terminal of the power management chip is connected to the second LED through the second transistor. The LEDs indicate the voltage mode of the CPU.

Abstract: A server includes an enclosure made of conductive material defining a first through hole and a second through hole, a power supply unit (PSU) converting alternating current power into direct current voltages, a motherboard, and first and second fasteners. The PSU includes a first power connector and a ground connector, and defines a screw hole. The ground connector is coupled to a shell of the PSU and a ground line of a plug of the PSU that receives the alternating current power. The motherboard includes a second power connector connected to the first power connector, and defines a fixing hole coated with conductive material electrically connected to a ground layer of the motherboard. The first fastener extends through the first through hole to engage in the screw hole of the PSU, and the second fastener extends through the second through hole to engage in the fixing hole.

Abstract: An illumination brightness control apparatus receives an input voltage from a light dimmer and produces a control signal to regulate a drive signal to a power conversion switch of a switching mode power converter. The apparatus includes a voltage conditioning circuit to condition the dimmer input voltage to provide a conditioned voltage signal; an ADC circuit to sample analog data of the conditioned voltage signal at a sampling rate that is high relative to a nominal variation rate of the dimmer input voltage and to provide digital data corresponding to the sampled analog data; a digital signal processing circuit to produce a running data average of the digital data; and a controller to produce a signal corresponding to the running data average as the control signal to regulate the drive signal.

Abstract: A lithium salt-graphene-containing composite material and its preparation method are provided. The composite material has the microstructure which comprises carbon nanoparticles, lithium salt nanocrystals and graphene, wherein the surface of lithium salt nanocrystals is coated with carbon nanoparticles and graphene. The preparation method comprises concentrating and drying a mixed solution, then calcinating the solid. The lithium salt-graphene-containing composite material has excellent electric performance and stability since the problem of low electric performance resulted from carbon coating on the surface of lithium salt or coating imperfection resulted from graphene coating on the surface of lithium salt is effectively solved. For the more uniform and compacted combination between graphene and lithium salt nanocrystals, the graphene will not fall off and the composite material has a high capacity ratio, energy density and conductivity.

Abstract: An exemplary infrared control system includes an infrared control unit and a computer. The infrared control unit is capable of transmitting an infrared signal. The computer includes an infrared response unit, and the infrared response unit includes an infrared receiving circuit and a control circuit electrically connected to the infrared receiving circuit. The infrared receiving circuit is capable of receiving the infrared signal from the infrared control unit. Accordingly the control circuit is capable of processing the infrared signal from the infrared receiving circuit to generate a corresponding command signal to control the computer to power on/off or reset.

Abstract: A CPU power testing apparatus includes a CPU power supplying circuit; a first A/D converter connected with an input of the CPU power supplying circuit. The first A/D converter obtains an input voltage of the CPU power supplying circuit and converts the input voltage into digital values Vin. A second A/D converter connected with an output of the CPU power supplying circuit obtains an output voltage of the CPU power supplying circuit and converts the output voltage into digital values Vout. A single-chip microcontroller obtains Vin from the first A/D converter, and Vout from the second A/D converter, and the system parameters of an application platform, and calculates and displays an amount of the power being consumed by the CPU according to a predetermined formula.

Abstract: An electrical parameter detection device is configured for detecting electrical parameters of a peripheral component interconnect (PCI) connector including a plurality of power pins. The electrical parameter detection device includes a processor module, a first detection module, and a second detection module. The processor module continuously detects voltage values of electric potentials provided by each of the power pins of the PCI connector using the first detection module, and determines time sequences of the electric potentials according to the voltage values of the electric potentials. Furthermore, the processor module detects the amount of power provided by each of the power pins of the PCI connector using the second detection module.

Abstract: Disclosed herein are a method for implementing switching between layer-2 multicast route tracing and layer-3 multicast route tracing, and a method, a system, a router and an apparatus for differentiating between a layer-2 property and a layer-3 property. One of the methods includes: The query apparatus judges whether to perform layer-2 multicast route tracing, and adds an IP option of layer-2 multicast route tracing into the IGMP Tracert Query packet if layer-2 multicast route tracing needs to be performed. The last-hop router receives the IGMP Tracert Query packet, judges whether the packet carries the IP option of layer-2 multicast route tracing, and transmits the IGMP Tracert Query packet to a downstream layer-2 node transparently if the packet carries the IP option, or initiates layer-3 multicast route tracing if the packet carries no such IP option.

Abstract: A power adapter includes a processing circuit converting mains power to another alternating current (AC) power or a direct current (DC) power, a first output outputting the converted AC or DC power, a sense resistor connected between the processing circuit and the first output for sampling current flowing through the first output and converting the sampled current to a sampled voltage, an amplifying circuit connected to the sense resistor for amplifying the sampled voltage, and a metallic oxide semiconductor field effect transistor (MOSFET). A gate of the MOSFET is connected to the amplifying circuit. A drain of the MOSFET is connected to the first output through a first resistor and grounded through a second resistor. A source of the MOSFET is grounded. A node between the first and second resistors is connected to the processing circuit. The amplifying circuit makes the MOSFET work in a variable resistance region.

Abstract: A voltage converting circuit includes a power supply, a buck circuit a buck circuit electronically connected to the power supply, a current detection circuit electronically connected to the buck circuit and a PWM controller electronically connected to the buck circuit and the current detection circuit. The buck circuit is configured for converting a source voltage and a source current of the power supply to an output voltage and an output current driven by the PWM controller. The current detection circuit is configured for detecting a current variation of the output current. The PWM controller configuring for receiving the current variation of the output current, and driving the buck circuit to increase the output voltage when the output current is decreased, and driving the buck circuit to decrease the output voltage when the output current is increased.

Abstract: A power supply circuit for providing a voltage to a memory slot group with one or more memory slots includes a platform controller hub (PCH), a basic input/output system (BIOS), and a control circuit. The PCH detects whether any of the memory slots are occupied, and notifies the BIOS. If there are any memory slots are occupied, the BIOS enables a general purpose input/output (GPIO) terminal of the PCH. The control circuit controls a power supply to provide or not provide power to the memory slot group based on whether the GPIO terminal of the PCH is enabled.

Abstract: A power supply unit includes a storage unit, a temperature detecting unit, a ripple voltage detecting unit, and a processor. The storage unit stores a conversion relationship between ripple voltages V in different temperature ranges and equivalent ripple voltages Vs at a standard temperature Ts. The temperature detecting unit and the ripple voltage detecting unit detects a temperature T and a ripple voltage V of an electrolytic capacitor of the power supply unit respectively. The processor acquires an initial ripple voltage Vi of the electrolytic capacitor at an initial temperature Ti, acquires a working ripple voltage Vw at a working temperature Tw, converts Vi and Vw to equivalent ripple voltages Vis and Vws at the standard temperature Ts according to the relationship, compares Vws with Vis, and determines whether service life of the power supply unit is nearing its end.

Abstract: A heat sink is used to cool electronic components, and includes a metal base portion, a motherboard and a heat conducting sheet. The motherboard and the heat conducting sheet are positioned on the metal base portion. The motherboard includes a copper foil. The electronic components are electrically connected on the copper foil; the heat conducting sheet is positioned between the metal base portion and the motherboard, and contacts the metal base portion and the motherboard. The heat of the electronic components is conducted to the metal base portion through the copper foil, the motherboard and the heat conducting sheet.

Abstract: An overheating protection circuit for an electronic device includes a detection circuit, a switch element, and a control element. The detection circuit is positioned adjacent to an integrated circuit (IC) peripheral circuit of the electronic device and detects a temperature of the IC peripheral circuit. The switch element is electrically connected to the detection circuit, and the control element is electrically connected to the switch element and a heat dissipation device of the electronic device. The detection circuit generates a detection signal to turn on the switch element in response to detecting that a temperature of the IC peripheral circuit increases, and the control element controls the heat dissipation device to dissipate heat generated by the IC peripheral circuit in response to detecting that the switch element is turned on.

Abstract: A power supply system for a central processing unit (CPU) mounted on a motherboard includes a power supply unit, a conducting layer, and a number of conducting foils. The conducting layer is set on the motherboard. The conducting foils are connected to the conducting layer in parallel. The power supply unit supplies power to the CPU through the conducting layer and the conducting foils.

Abstract: A test system includes a motherboard and a test card. The motherboard includes a number of electronic components and a first connector. The test card includes a second connector and a number of indicating circuits. The first connector includes a number of signal pins. Each signal pin of the first connector is connected to a corresponding signal terminal of the electronic components, to receive a power good signal. The second connector includes a number of signal pins. Each signal pin of the second connector is connected to a corresponding signal pin of the first connector, to receive a corresponding power good signal. Each indicating circuit is connected to a corresponding signal pin of the second connector, and indicates whether the corresponding signal pin of the second connector outputs a power good signal.