Abstract: Disclosed is a resin composition for a printed circuit board, composed of a complex epoxy resin including 41˜80 wt % of a naphthalene-modified epoxy resin having an average epoxy resin equivalent of 100˜200 and 20˜59 wt % of a phosphorus-based epoxy resin having an average epoxy resin equivalent of 400˜800, a bisphenol A curing agent used in an equivalent ratio of 0.3˜1.5 with respect to a total epoxy group equivalent of the complex epoxy resin, a curing accelerator used in an amount of 0.1˜1 part by weight based on 100 parts by weight of the complex epoxy resin and an inorganic filler used in an amount of 10˜40 parts by weight based on 100 parts by weight of the complex epoxy resin. A printed circuit board using the resin composition is also provided.

Abstract: Disclosed is a resin composition for a printed circuit board, which includes a complex epoxy resin including a bisphenol A epoxy resin obtained by dispersing silicone elastomer particles having a core-shell structure in a diglycidyl ether of bisphenol A epoxy resin, a cresol novolac epoxy resin, and a phosphorus-based epoxy resin; a bisphenol A curing agent; a curing accelerator; and an inorganic filler. A printed circuit board using the resin composition is also provided.

Abstract: Disclosed is a heat radiation substrate, which includes a hybrid layer made of a thermoplastic resin, in particular, a liquid crystal polymer, and thus is lightweight and small thanks to the inherent properties of plastic and also is able to be mass produced, thus reducing the material and process costs.

Abstract: It relates to a norbornene-based polymer having low dielectric constant which is thus suitable for a low loss dielectric material, an insulating material using the same, an embedded printed circuit board and a functional device, in which the norbornene-based polymer includes at least one repeat unit of formula 1: wherein, at least one of R1 to R4 may be independently selected from the group consisting of hydrogen, in which R5, R6 and R7 are each independently selected from the group consisting of hydrogen, substituted or unsubstituted C1-C6 alkyl, C1-C6 alkyl substituted with an aliphatic bicyclo or multicyclo compound, substituted or unsubstituted C2-C6 alkenyl and substituted or unsubstituted C4-C31 arylalkyl, L is C1-C3 alkyl.

Abstract: A method of manufacturing a chip capacitor according to an aspect of the invention may include: preparing a capacitor lamination including a dielectric sheet formed of a composite having ceramic powder and a polymer mixed with each other, and first and second internal electrodes formed on both surfaces of the dielectric sheet at predetermined intervals; forming covering layers formed of an insulating material on both surfaces of the capacitor lamination; forming at least one first opening and at least one second opening in the capacitor lamination having the covering layers formed thereon to expose the first and second internal electrodes, respectively; forming plating layers in the first and second openings, the plating layers connected to the first and second internal electrodes; and dicing the result into chips on the basis of the first and second openings so that the plating layers formed in the first and second openings are provided as first and second external terminals.

Abstract: A method of manufacturing a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board manufactured by the method of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon.

Abstract: The present invention relates to a to a norbornene-based polymer having a low dielectric constant and low-loss properties, and an insulating material, a printed circuit board and a functional device using the same. More particularly, it relates to a norbornene-based polymer expressed by the following formula (1): wherein, at least one of R1 to R4 is independently substituted or unsubstituted linear C4-C31 arylalkyl or substituted or unsubstituted branched C4-C31 arylalkyl; the rest of R1 to R4 are each and independently H, substituted or unsubstituted linear C1-C3 alkyl, or substituted or unsubstituted branched C1-C3 alkyl; and n is an integer of 250 to 400.

Abstract: The present invention relates to a poly(p-xylylene)-based polymer having a low dielectric constant suitable for low loss dielectrics (LLD), and an insulating material, a printed circuit board and a functional element using the same. More particularly, the poly(p-xylylene)-based polymer includes at least one repeat unit expressed by the following formula (1): wherein, at least one of R1, R2, R7 and R8 is independently substituted or unsubstituted C6-C20 aryl; the rest of R1 to R8 are each and independently H, substituted or unsubstituted linear C1-C3 alkyl, or substituted or unsubstituted branched C1-C3 alkyl; and n is an integer of 400 to 900.

Abstract: The present invention relates to a glass composition having a low thermal expansion coefficient, a glass fiber, an insulating layer of printed circuit board and a printed circuit board. A glass fiber, an insulating layer of printed circuit board and a printed circuit board may be obtained by employing a glass composition including 40 to 60 parts by weight of silicon oxide, 20 to 40 parts by weight of aluminum oxide and 5 to 20 parts by weight of lithium oxide.

Abstract: Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from ?300 to +300 ppm/° C. in the temperature range of ?55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.

Abstract: A backlight unit is disclosed. The backlight unit may include a thermoplastic resin board in which cavities may be formed, a light emitting diode (LED) component which may be mounted on a bottom surface of the cavity, and a molding resin which may be filled in the cavity and which may secure the light emitting diode component. The thermoplastic resin board may include a light-reflective filler, to improve reflection efficiency, dispersed within the thermoplastic resin board. According to certain embodiments of the invention, a simple process can be utilized to reduce the thickness of the backlight unit, making it applicable to compact devices.

Abstract: Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin.

Abstract: Disclosed is a light emitting diode unit, more particularly, a light emitting diode unit including a thermoplastic substrate, a light emitting diode, mounted on one surface of the thermoplastic substrate and a heat sink, directly adhered to the other surface of the thermoplastic substrate. With the present invention, the manufacturing cost and the manufacturing time of the light emitting diode unit can be reduced by allowing the heat sink, discharging the heat generated by the light emitting diode, to be directly adhered to the substrate on which the light emitting diode is mounted. Also, the heat discharging ability of the light emitting diode unit by using the heat sink directly adhered to the thermoplastic substrate.

Abstract: Disclosed are an array light source using a light-emitting diode and a backlight unit including the same. In accordance with an embodiment of the present invention, the array light source can include a plurality of light-emitting diodes (LED); and a wiring board on which wires for transferring signals to each of the LEDs are formed. Here, the wiring board can include a plurality of sublayers, and the wires can be divided into at least two wiring groups and separately formed on different sublayers of the wring board per wiring group.

Abstract: Disclosed is a probe card using thermoplastic resin. The probe card includes: a printed circuit board; a probe head that includes a plurality of terminals disposed on one surface thereof, the terminals being electrically connected to the printed circuit board; and a plurality of probe tips electrically connected to a plurality of the terminals and disposed on the other surface of the probe head, whereas the other surface of the probe head is formed of thermoplastic resin. According to the probe card, it is possible to reduce an inferior goods rate by protecting the probe head even during an etching process.

Abstract: A manufacturing method of a printed circuit board is disclosed. The method may include: forming a circuit pattern on a surface of an insulation layer, made primarily from a thermoplastic resin, such that the circuit pattern protrudes from the surface of the insulation layer, and burying the circuit pattern in the insulation layer by pressing the circuit pattern.

Abstract: The present invention relates to a flame retardant resin composition for a printed circuit board and a printed circuit board using the same, in more detail, to a flame retardant resin composition which includes a complex epoxy resin, photo acid generator, a curing agent, a curing accelerator, and an inorganic filler, so that UV curable and property-maintainable insulating material can be manufactured, and to a printed circuit board using the same. The flame retardant resin composition according to the present invention contains a photo acid generator instead of an acrylate reactive diluent which is included UV curable insulating material so that fine patterned printed circuit board can be manufactured through UV curing and post thermal curing.

Abstract: The present invention relates a eucryptite ceramic filler and an insulating composite material containing the eucryptite ceramic filler. In particular, the invention provides a eucryptite ceramic filler of formula (I): xLiO2-yAl2O3-zSiO2 ??(I) wherein x, y and z represent a molar ratio, x and y are each independently from 0.9 to 1.1, and z is from 1.9 to 2.1; and the eucryptite ceramic filler is used to reduce a coefficient of thermal expansion of an insulating composite material.

Abstract: A capacitor embedded printed circuit board (PCB), the PCB including: a multilayer polymer capacitor layer where a plurality of polymer sheets is laminated; one or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets and alternately disposed to form a pair; a plurality of first extended electrodes and second extended electrodes connected to the first inner electrodes and second inner electrodes, respectively; one or more insulating layers laminated on one or both surfaces of the multilayer polymer capacitor, where a plurality of conductive patterns and conductive via holes, forming an interlayer circuit are formed; a plurality of first via holes for capacitor, penetrating the multilayer polymer capacitor layer to be connected to the first extended electrodes; and a plurality of second via holes for capacitor, penetrating the multilayer polymer capacitor layer to be connected to the second extended electrodes, wherein the plurality of the first and

Abstract: Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from ?300 to +300 ppm/° C. in the temperature range of ?55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.