Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer including resin and inorganic particles, a second conductor layer including a seed layer and an electrolytic plating layer on the seed layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and via conductor are formed such that the seed layer includes an alloy including copper, aluminum and a metal including one or more metals selected from nickel, zinc, gallium, silicon and magnesium, and the resin insulating layer is formed such that the inorganic particles include first inorganic particles forming an inner wall surface in the opening and second inorganic particles embedded in the resin insulating layer and that shapes of the first inorganic particles are different from shapes of the second inorganic particles.

Abstract: A printed wiring board includes a base substrate, an electronic component accommodated in a cavity formed in the substrate, a resin insulating layer formed on the substrate such that the insulating layer is covering the electronic component, a conductor layer formed on the insulating layer, and via conductors formed in the insulating layer and each including a seed layer and an electrolytic plating layer formed on the seed layer such that the via conductors are connecting the conductor layer and electrodes of the electronic component. The insulating layer includes resin and inorganic particles and has via holes in which the via conductors is formed respectively such the inorganic particles include first inorganic particles having smooth surfaces and second inorganic particles embedded in the insulating layer and that an inner wall surface of each of the via holes includes the resin and the smooth surfaces of the first inorganic particles.

Abstract: A printed wiring board includes a conductor layer including wirings, a resin insulating layer having openings, a mounting conductor layer including first and second electrodes, first via conductors including a seed layer and an electrolytic plating layer such that the first via conductors connect the first electrodes and the wirings, and second via conductors including the seed layer and electrolytic plating layer such that the second via conductors connect the second electrodes and the wirings. The first electrodes are positioned to mount a first electronic component. The second electrodes are positioned to mount a second electronic component. The first and second via conductors are formed such that the seed layer is covering an inner wall surface of each opening in the insulating layer and has a first portion and a second portion connected to the first portion and having a part of the first portion formed on the second portion.

Abstract: The present invention aims to provide a humanized antibody or an antigen-binding fragment thereof having stable physical property, superior in tumor accumulation, and capable of binding to mucin subtype 5AC. The above-mentioned problem is solved by the present invention that provides a humanized antibody or an antigen-binding fragment thereof having a heavy chain variable region consisting of the amino acid sequence shown in SEQ ID NO: 1-4 or a mutated amino acid sequence thereof, and a light chain variable region consisting of the amino acid sequence shown in SEQ ID NO: 5-8 or a mutated amino acid sequence thereof, and capable of binding to mucin subtype 5AC.

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer, and a via conductor formed in the opening of the resin insulating layer and including the seed layer and the electrolytic plating layer formed on the seed layer. The via conductor is connecting the first conductor layer and the second conductor layer. The seed layer has a first portion formed on the surface of the resin insulating layer, a second portion formed on an inner wall surface in the opening of the resin insulating layer, and a third portion formed on a portion of the first conductor layer exposed by the opening of the resin insulating layer such that a thickness of the first portion is greater than a thickness of the second portion and a thickness of the third portion.

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.

Abstract: A radio wave abnormality detection system, a radio wave abnormality detection method, and a radio wave abnormality detection program that are capable of accurately detecting a radio wave abnormality are provided. The radio wave abnormality detection system includes: a determination unit that determines an extraction period, based on a transmission duration estimated from first received data of a radio wave received at a first timing; a learning unit that generates a learned model in which a feature value extracted in the extraction period from second received data of a radio wave received at a second timing is machine-learned; and a detection unit that detects a radio wave abnormality by using a feature value extracted in the extraction period from third received data of a radio wave received at a third timing, and the learned model.

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed and electrolytic plating layers and connecting the first and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second and third portions, and the insulating layer includes resin and inorganic particles including first particles forming the inner wall surface and second particles embedded in the insulating layer and having shapes different from shapes of the first particles.

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer, a second conductor layer, and a via conductor formed in an opening of the insulating layer and connecting the first conductor and second conductor layers. The second conductor layer and via conductor include a seed layer having a first portion formed on the surface of the insulating layer, a second portion formed on an inner wall surface in the opening, and a third portion formed on a portion of the first conductor layer exposed by the opening. A thickness of the first portion is greater than a thickness of the second portion and a thickness of the third portion. The seed layer includes a first layer including an alloy including copper, aluminum and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium, and a second layer formed on the first layer and including copper.

Abstract: A fundus imaging apparatus includes two or more curved mirrors, an illumination optical system, and an image sensor. The illumination optical system includes a slit with an opening configured to be disposed at a fundus conjugate position. Here, the fundus conjugate position is substantially conjugate optically to a fundus of an eye to be examined. The illumination optical system is configured to irradiate slit-shaped illumination light, that is generated by irradiating light from a light source onto the slit, onto the fundus through the two or more curved mirrors. The image sensor is configured to be disposed at the fundus conjugate position and to receive returning light from the eye to be examined. At least one of both ends of the opening in a longitudinal direction is displaced in a shorter direction of the opening with reference to the longitudinal direction passing through a center of the opening.

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer and including resin material and inorganic particles, a second conductor layer formed on a first surface of the insulating layer such that the first conductor layer is facing a second surface of the insulating layer, and a via conductor formed in an opening extending through the insulating layer and connecting the first and second conductor layers. The insulating layer is formed such that the inorganic particles include first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin, the first inorganic particles have first portions protruding from the resin and second portions embedded in the resin respectively, and the first surface of the resin insulating layer includes a surface of the resin and surfaces of the first portions exposed from the surface of the resin.

Abstract: A medical system of an aspect example includes a data acquiring unit and a data processor. The data acquiring unit is configured to acquire data from an eye fundus of a patient using at least one optical method. The data processor is configured to process the data acquired by the data acquiring unit in order to generate information on the circulatory system of the patient.

Abstract: A medical system of an aspect example includes a data acquiring unit and a data processor. The data acquiring unit is configured to acquire data from an eye fundus of a patient using at least one optical method. The data processor is configured to process the data acquired by the data acquiring unit in order to generate information on the circulatory system of the patient.

Abstract: A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the insulating layer and including a conductor circuit, and a via conductor formed in an opening formed in the insulating layer and connecting the first and second conductor layers. The second conductor layer and via conductor include a seed layer and an electrolytic plating layer formed on the seed layer such that the seed layer has a first layer and a second layer formed on the first layer, the first layer has a width greater than a width of the second layer in cross section of the conductor circuit in the second conductor layer and that the electrolytic plating layer has a width greater than the width of the first layer in cross section of the conductor circuit in the second conductor layer.

Abstract: A wiring substrate includes an insulating layer including inorganic particles and resin, a seed layer formed on a surface of the insulating layer, and a conductor layer including a conductor pattern and formed on the seed layer. The surface of the insulating layer is a roughened surface formed such that the roughened surface of the insulating layer has exposed portions of the inorganic particles and resin with gaps at interfaces where the inorganic particles and the resin are in contact, and the seed layer is formed on the roughened surface of the insulating layer such that the seed layer is formed along the exposed portions of the inorganic particles and resin exposed on the roughened surface of the insulating layer and is not formed in the gaps at the interfaces where the inorganic particles and the resin are in contact.

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.

Abstract: A method for manufacturing a printed wiring board includes forming a resin insulating layer on a first conductor layer, forming a protective film on a surface of the insulating layer, forming an opening through the film and the resin insulating layer, removing the film, treating the surface of the insulating layer, forming a second conductor layer on the surface of the resin insulating layer, and forming a via conductor connecting the first and second conductor layers. The insulating layer includes resin and inorganic particles including first and second particles. The surface of the insulating layer includes a surface of the resin and substantially flat exposed portions of the first particles, and the forming the second conductor layer includes forming a seed layer by sputtering, forming a plating resist using DI exposure, forming an electrolytic plating layer, removing the resist, and removing the seed layer exposed from the electrolytic plating layer.

Abstract: An ophthalmic apparatus includes an optical system having an illumination and imaging optical systems, a movement mechanism, and a controller. The illumination optical system may illuminate a fundus of a subject's eye with illumination light. The movement mechanism may relatively move the subject's eye and the optical system in an optical axis direction of the imaging optical system. When a corneal curvature radius is R and a distance from a corneal apex position to an imaging aperture conjugate position substantially conjugate optically to the imaging aperture is d, the controller may control the movement mechanism so that light amount of the returning light passing through the imaging aperture becomes less than when a distance in the optical axis direction between the imaging aperture conjugate position and a position of a corneal reflection image of the illumination light is (R/2?d).

Abstract: An abnormality detection apparatus according to an example embodiment includes a reception unit for receiving radio waves, a feature amount extraction unit for extracting a plurality of feature amounts in a predetermined frequency band from the received radio waves, a recording unit for recording the plurality of extracted feature amounts and the frequency band in association with each other, and a processing unit for acquiring a plurality of feature amounts in a predetermined range from the plurality of accumulated feature amounts, determining whether or not the acquired feature amounts fall within a preset normal range, and generating, based on a result of the determination, an abnormality determination mask, threshold values for the plurality of feature amounts, in order to detect an abnormality of the radio waves being set in the abnormality determination mask.

Abstract: A printed wiring board includes an uppermost conductor layer having an electrode that mounts an electronic component, an upper build-up part including conductor layers and resin insulating layers such that the uppermost conductor layer is formed on the upper build-up part, and a lower build-up part including conductor layers and resin insulating layers and formed such that the lower build-up part is formed below the upper build-up part. The upper build-up part is formed such that each of the conductor layers includes a seed layer formed by sputtering, and an electrolytic plating layer formed below the seed layer, and the lower build-up part is formed such that each of the conductor layers includes a seed layer formed by electroless plating, and an electrolytic plating layer formed below the seed layer.