Abstract: A light emitting element array includes plural semiconductor stacked structures each including a light emitting unit that is formed on a substrate, and a light amplification unit that extends from the light emitting unit along a substrate surface of the substrate to have a length in an extension direction which is longer than that of the light emitting unit, amplifies light propagating in the extension direction from the light emitting unit, and emits the amplified light from a light emission portion formed along the extension direction, wherein the plural semiconductor stacked structures are arranged such that the extension directions of the respective light amplification units are substantially parallel to each other.

Abstract: The purpose of the present invention is to control the lamination thickness of the laminated core of an axial gap rotating electric machine. The axial gap rotating electric machine is provided with: a stator comprising a plurality of core members arranged circularly about the rotational axis center, said core members each comprising a columnar-laminated core having a flux surface in a rotation axis direction, a coil disposed on the outer perimeter of the core in the radial direction, and a substantially cylindrical bobbin disposed between the core and the coil; and at least one rotor facing the flux surface with a predetermined gap interposed therebetween in the rotation axis direction. The bobbin has an inner cylinder facing the outer perimeter of the core in the radial direction, and at least part of the inner diameter of the inner cylinder becomes gradually smaller along the rotation axis direction and makes contact with the outer perimeter surface of the laminated core in the radial direction.

Abstract: A surface-emitting semiconductor laser includes a first semiconductor multilayer film reflector, an active region, a second semiconductor multilayer film reflector, and a current confinement layer including an oxidized region formed by selective oxidation. The current confinement layer includes a first semiconductor layer having a relatively high Al content, a second semiconductor layer that is adjacent to the first semiconductor layer on an active-region side of the first semiconductor layer and has a lower Al content than the first semiconductor layer, and a composition-gradient layer adjacent to the first semiconductor layer on a side of the first semiconductor layer which is opposite to the active-region side. A portion of the composition-gradient layer which faces the first semiconductor layer has a lower Al content than the first semiconductor layer.

Abstract: A light emitting apparatus includes: a semiconductor layer including a light emitting region that generates modulation light modulated with a first signal, and a feedback region that is configured so that a feedback mode to feed back a part of light generated in the light emitting region to the light emitting region and a monitor mode to monitor a light amount of the light generated in the light emitting region are switchable; and a controller, wherein when the modulation light is generated in the light emitting region, the controller sets the feedback region to the feedback mode, and the controller switches the feedback region to the monitor mode during at least a part of a period in which there is no first signal.

Abstract: A light emitting element array includes plural semiconductor stacked structures each including a light emitting unit that is formed on a substrate, and a light amplification unit that extends from the light emitting unit along a substrate surface of the substrate to have a length in an extension direction which is longer than that of the light emitting unit, amplifies light propagating in the extension direction from the light emitting unit, and emits the amplified light from a light emission portion formed along the extension direction, wherein the plural semiconductor stacked structures are arranged such that the extension directions of the respective light amplification units are substantially parallel to each other.

Abstract: A light emitting element array includes plural semiconductor stacking structures and a light screening portion. The plural semiconductor stacking structures each include a light emitting portion and a light receiving portion that receives light propagated in a lateral direction via a semiconductor layer from the light emitting portion. The light screening portion is provided between the plural semiconductor stacking structures to screen light directed from the light emitting portion of one of the semiconductor stacking structures to the light receiving portion of another semiconductor stacking structure.

Abstract: A light emitting element includes: a semiconductor stack structure that includes a light emitting part, and a light receiving part that receives light propagating in a lateral direction through a semiconductor layer from the light emitting part, wherein the light emitting part and the light receiving part share a quantum layer; and a light reflection layer that covers ? or more of a lateral surface of the quantum layer in the light receiving part.

Abstract: A light emitting device includes: a first mesa structure including a light emitting part; a second mesa structure that is connected to the first mesa structure by a common semiconductor layer and that includes a light receiving part that receives light propagating in a lateral direction through the semiconductor layer from the light emitting part; a detector that detects an amount of the light received by the light receiving part; and an oxide confinement layer that is formed over the first mesa structure and the second mesa structure and that includes an oxidized region and a non-oxidized region.

Abstract: A light emitting element includes: a light emitting part that is formed on a front surface side of a semi-insulating substrate; and a light receiving part that is formed on the front surface side, that shares a semiconductor layer with the light emitting part, and that receives light propagating in a lateral direction through the semiconductor layer from the light emitting part, wherein anode electrodes and cathode electrodes of the light emitting part and the light receiving part are formed on the front surface side in a state in which the anode electrodes are separated from each other and the cathode electrodes are separated from each other.

Abstract: A vertical cavity surface emitting laser array includes a contact layer formed on a substrate; mesa structures formed on the contact layer, each mesa structure including a first semiconductor multilayer reflector of a first conductivity type, an active region on the first semiconductor multilayer reflector, and a second semiconductor multilayer reflector of a second conductivity type on the active region; a first metal layer formed on the contact layer around the mesa structures, a portion of the first metal layer serving as an electrode pad of the first conductivity type; an insulating film formed on the first metal layer; and a second metal layer formed on the insulating film, a portion of the second metal layer serving as an electrode pad of the second conductivity type. The mesa structures are electrically connected in parallel.

Abstract: Provided is a method of manufacturing a surface-emitting semiconductor laser element including a first process of forming, on a substrate, a semiconductor layer that includes a first semiconductor multilayer reflection mirror, a rough surface formation layer, an active region, a second semiconductor multilayer reflection mirror, and a current confining layer, a second process of forming a mesa structure of the semiconductor layer by etching the semiconductor layer until the rough surface formation layer is exposed, a third process of oxidizing a region including the current confining layer and the rough surface formation layer exposed to the circumference of the mesa structure, a fourth process of forming a rough surface region by performing an acid treatment on a region including the oxidized rough surface formation layer, and a fifth process of forming an insulating film on the region including the rough surface region.

Abstract: The present invention ensures reliability while reducing the size of an axial air gap rotating electric machine. An axial air gap rotating electric machine has: a stator comprising a plurality of core members arranged in a ring shape, said core members each having an iron core, a coil wound in an iron core outer periphery direction, and a bobbin disposed between the iron core and the coil; and a rotor plane-facing an end surface of the iron core via an air gap in a rotating shaft radial direction.

Abstract: There is provided a surface emitting semiconductor laser including: a substrate; and a semiconductor layer including: a first semiconductor multilayer film having plural sets of specific layers, a second semiconductor multilayer film having plural sets of specific layers, and an active layer provided between them, so as to constitute a resonator.

Abstract: A method of manufacturing an optical semiconductor element includes: a first step in which a columnar structure of a semiconductor layer formed on a semi-insulating substrate is formed; a second step in which the substrate is exposed in a periphery of the columnar structure; a third step in which a region including exposed surfaces of the first contact layer and the substrate is pretreated; a fourth step in which a first electrode is formed on the exposed surface of the first contact layer; a fifth step in which an interlayer insulating film is formed in a region including a side surface of the columnar structure and the exposed surfaces; a sixth step in which a first electrode wiring is formed on the interlayer insulating film; and a seventh step in which a second electrode wiring is formed on the interlayer insulating film.

Abstract: The purpose of the present invention is to efficiently cope with the plate thickness deviation of a laminated iron core in an axial air gap type electric motor. An axial air gap type electric motor comprises: a stator formed by arranging stator cores around a rotating shaft in a ring shape, said stator cores each including a laminated iron core that is a prismatic body formed by laminating metal plate-like members in a radial direction of the rotating shaft, a tubular bobbin that has an inner diameter into which the laminated iron core is inserted, and a coil that is wound on the extension of the outer diameter of the laminated iron core; and at least one rotor plane-facing the rotating shaft direction end section of the stator with a predetermined air gap interposed therebetween.

Abstract: A vertical cavity surface emitting laser array includes a contact layer formed on a substrate; mesa structures formed on the contact layer, each mesa structure including a first semiconductor multilayer reflector of a first conductivity type, an active region on the first semiconductor multilayer reflector, and a second semiconductor multilayer reflector of a second conductivity type on the active region; a first metal layer formed on the contact layer around the mesa structures, a portion of the first metal layer serving as an electrode pad of the first conductivity type; an insulating film formed on the first metal layer; and a second metal layer formed on the insulating film, a portion of the second metal layer serving as an electrode pad of the second conductivity type. The mesa structures are electrically connected in parallel.

Abstract: Provided is a method of manufacturing a surface-emitting semiconductor laser element including a first process of forming, on a substrate, a semiconductor layer that includes a first semiconductor multilayer reflection mirror, a rough surface formation layer, an active region, a second semiconductor multilayer reflection mirror, and a current confining layer, a second process of forming a mesa structure of the semiconductor layer by etching the semiconductor layer until the rough surface formation layer is exposed, a third process of oxidizing a region including the current confining layer and the rough surface formation layer exposed to the circumference of the mesa structure, a fourth process of forming a rough surface region by performing an acid treatment on a region including the oxidized rough surface formation layer, and a fifth process of forming an insulating film on the region including the rough surface region.

Abstract: A method of manufacturing an optical semiconductor element includes: a first step in which a columnar structure of a semiconductor layer formed on a semi-insulating substrate is formed; a second step in which the substrate is exposed in a periphery of the columnar structure; a third step in which a region including exposed surfaces of the first contact layer and the substrate is pretreated; a fourth step in which a first electrode is formed on the exposed surface of the first contact layer; a fifth step in which an interlayer insulating film is formed in a region including a side surface of the columnar structure and the exposed surfaces; a sixth step in which a first electrode wiring is formed on the interlayer insulating film; and a seventh step in which a second electrode wiring is formed on the interlayer insulating film.

Abstract: Provided is a surface-emitting semiconductor laser including a substrate; a first semiconductor multilayer reflector of a first conductivity type formed on the substrate, the first semiconductor multilayer reflector including plural pairs of a low-refractive-index layer and a high-refractive-index layer; a cavity region formed on the first semiconductor multilayer reflector; a second semiconductor multilayer reflector of a second conductivity type formed on the cavity region, the second semiconductor multilayer reflector including plural pairs of a low-refractive-index layer and a high-refractive-index layer; a columnar structure extending from the second semiconductor multilayer reflector to the cavity region; and a current confinement layer formed inside the columnar structure by selective oxidation of a semiconductor layer containing Al. The cavity region includes an active region; and a cavity extension region interposed between the active region and the first semiconductor multilayer reflector.