Patents by Inventor Jun Seok Son

Jun Seok Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad
    Patent number: D852601
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: July 2, 2019
    Assignee: EHWA Diamond Ind. Co., Ltd.
    Inventors: Jun Seok Son, Jang Hyuk Ahn