Polishing pad
Latest EHWA Diamond Ind. Co., Ltd. Patents:
Description
The broken line showings in
Claims
The ornamental design for a polishing pad, as shown and described.
Referenced Cited
U.S. Patent Documents
7147548 | December 12, 2006 | Mehrabi |
D579296 | October 28, 2008 | Popov |
D592029 | May 12, 2009 | Tano |
D592030 | May 12, 2009 | Tano |
D678745 | March 26, 2013 | Nguyen |
D684739 | June 18, 2013 | Arnold |
D732917 | June 30, 2015 | Valentini |
D795666 | August 29, 2017 | Tchakarov |
D803652 | November 28, 2017 | Umbrell |
D804923 | December 12, 2017 | Umbrell |
D804925 | December 12, 2017 | Umbrell |
D808236 | January 23, 2018 | Schumacher |
D813634 | March 27, 2018 | Umbrell |
D837015 | January 1, 2019 | Tchakarov |
20070254568 | November 1, 2007 | Park |
20100144253 | June 10, 2010 | Umbrell |
20110300784 | December 8, 2011 | Tchakarov |
20130225051 | August 29, 2013 | Vankouwenberg |
20130324021 | December 5, 2013 | Ryan |
20170014974 | January 19, 2017 | Luna |
Patent History
Patent number: D852601
Type: Grant
Filed: Oct 23, 2017
Date of Patent: Jul 2, 2019
Assignee: EHWA Diamond Ind. Co., Ltd. (Osan-si)
Inventors: Jun Seok Son (Hwaseong-si), Jang Hyuk Ahn (Hwaseong-si)
Primary Examiner: Darlington Ly
Application Number: 29/623,145
Type: Grant
Filed: Oct 23, 2017
Date of Patent: Jul 2, 2019
Assignee: EHWA Diamond Ind. Co., Ltd. (Osan-si)
Inventors: Jun Seok Son (Hwaseong-si), Jang Hyuk Ahn (Hwaseong-si)
Primary Examiner: Darlington Ly
Application Number: 29/623,145
Classifications
Current U.S. Class:
D8/70