Polishing pad
Description
The broken line showings in
Claims
The ornamental design for a polishing pad, as shown and described.
Referenced Cited
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Patent History
Patent number: D852601
Type: Grant
Filed: Oct 23, 2017
Date of Patent: Jul 2, 2019
Assignee: EHWA Diamond Ind. Co., Ltd. (Osan-si)
Inventors: Jun Seok Son (Hwaseong-si), Jang Hyuk Ahn (Hwaseong-si)
Primary Examiner: Darlington Ly
Application Number: 29/623,145
Type: Grant
Filed: Oct 23, 2017
Date of Patent: Jul 2, 2019
Assignee: EHWA Diamond Ind. Co., Ltd. (Osan-si)
Inventors: Jun Seok Son (Hwaseong-si), Jang Hyuk Ahn (Hwaseong-si)
Primary Examiner: Darlington Ly
Application Number: 29/623,145
Classifications
Current U.S. Class:
D8/70