Polishing pad

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Description

FIG. 1 is a front perspective view of a polishing pad, showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view of a plurality thereof in their intended environment.

The broken line showings in FIG. 8 are for the purpose of illustrating environmental structure and form no part of the claimed design.

Claims

The ornamental design for a polishing pad, as shown and described.

Referenced Cited
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Patent History
Patent number: D852601
Type: Grant
Filed: Oct 23, 2017
Date of Patent: Jul 2, 2019
Assignee: EHWA Diamond Ind. Co., Ltd. (Osan-si)
Inventors: Jun Seok Son (Hwaseong-si), Jang Hyuk Ahn (Hwaseong-si)
Primary Examiner: Darlington Ly
Application Number: 29/623,145
Classifications
Current U.S. Class: D8/70