Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes.

Abstract: A substrate including an ESD protection function includes an insulating substrate, at least one of circuit elements or a wiring pattern and an ESD protection portion. In the ESD protection portion, facing portions of at least one pair of discharge electrodes are disposed in a cavity provided in the insulating substrate so that the ends face each other. The discharge electrodes are electrically connected to the circuit elements and or the wiring pattern.

Abstract: An ESD protection device has a structure that allows ESD characteristics to be easily adjusted and stabilized. The ESD protection device includes a ceramic multilayer substrate, at least a pair of discharge electrodes located in the ceramic multilayer substrate and facing each other with a space disposed therebetween, and external electrodes located on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode disposed in a region that connects the pair of discharge electrodes. The supporting electrode is made of a conductive material coated with an inorganic material having no conductivity.

Abstract: A dielectric ceramic composition includes about 10% to about 40% by weight of BaO, about 20% to about 65% by weight of SiO2, about 6% to about 40% by weight of Al2O3, about 1% to about 15% by weight of B2O3, about 0.3% to about 3% by weight of Cr2O3, and about 1% to about 40% by weight of ZrO2. A multilayer ceramic substrate has a laminated structure including an inner layer portion and outer layer portions that have a smaller thermal expansion coefficient than that of the inner layer portion. The use of the dielectric ceramic composition for the outer layer portions enables the ceramic to be resistant to erosion caused by a plating liquid used for plating external conductive films, thus maintaining good adhesiveness between the external conductive films and the outer layer portions.

Abstract: To provide a ceramic composition not only having little compositional variation after burning, but a high flexural strength of the sintered body, and a high Q value in a microwave band, a ceramic composition used for forming a ceramic layer of a multi-layer ceramic substrate contains 47.0 to 67.0 wt. % of SiO2, 21.0 to 41.0 wt. % of BaO, and 10.0 to 18.0 wt. % of Al2O3, and contains as a first additive, 1.0 to 5.0 parts by weight of CeO2, relative to a total of 100 parts of SiO2, BaO and Al2O3, and as a second additive, 2.5 to 5.5 parts by weight of MnO, relative to a total of 100 parts by weight of SiO2, BaO, Al2O3 and CeO2, and is substantially free of Cr. As a third additive, at least one of Zr, Ti, Zn, Nb, Mg and Fe, and as a fourth additive, a Co component and/or a V component, may be contained.

Abstract: An ESD protection device includes a ceramic multilayer board, a cavity disposed in the ceramic multilayer board, at least one pair of discharge electrodes having ends, edges of the ends being opposed to each other at a predetermined distance in the cavity, and external electrodes disposed on outer surfaces the ceramic multilayer board and connected to the discharge electrodes. The ceramic multilayer board includes a composite portion, which is disposed in the vicinity of the surface on which the discharge electrodes are disposed and is at least disposed adjacent to the opposed ends of the discharge electrodes and to a space between the opposed ends. The composite portion includes a metal material and a ceramic material.

Abstract: An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range, in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers (included in the multilayer ceramic substrate in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.

Abstract: An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers included in the multilayer ceramic substrate in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.

Abstract: An ESD protection device includes a ceramic multilayer board, a cavity disposed in the ceramic multilayer board, at least one pair of discharge electrodes having ends, edges of the ends being opposed to each other at a predetermined distance in the cavity, and external electrodes disposed on outer surfaces the ceramic multilayer board and connected to the discharge electrodes. The ceramic multilayer board includes a composite portion, which is disposed in the vicinity of the surface on which the discharge electrodes are disposed and is at least disposed adjacent to the opposed ends of the discharge electrodes and to a space between the opposed ends. The composite portion includes a metal material and a ceramic material.

Abstract: A dielectric ceramic composition includes about 10% to about 40% by weight of BaO, about 20% to about 65% by weight of SiO2, about 6% to about 40% by weight of Al2O3, about 1% to about 15% by weight of B2O3, about 0.3% to about 3% by weight of Cr2O3, and about 1% to about 40% by weight of ZrO2. A multilayer ceramic substrate has a laminated structure including an inner layer portion and outer layer portions that have a smaller thermal expansion coefficient than that of the inner layer portion. The use of the dielectric ceramic composition for the outer layer portions enables the ceramic to be resistant to erosion caused by a plating liquid used for plating external conductive films, thus maintaining good adhesiveness between the external conductive films and the outer layer portions.

Abstract: A glass ceramic composition is used for a multilayer ceramic substrate 2 including glass ceramic layers 3 laminated, the multilayer ceramic substrate 2 being used for a multilayer ceramic module 1. The glass ceramic composition includes a first ceramic powder mainly composed of forsterite, a second ceramic powder mainly composed of at least one component selected from CaTiO3, SrTiO3 and TiO2, and a borosilicate glass powder containing Li2O, MgO, B2O3, SiO2, ZnO and Al2O3. The glass ceramic composition contains 3 percent by weight or more of the borosilicate glass powder and further contains at least one additive selected from the group consisting of CaO, BaO and SrO.

Abstract: A glass ceramic composition for glass ceramic layers laminated in multilayer ceramic substrate included in multilayer ceramic module is provided. The glass ceramic composition contains a first ceramic powder mainly composed of forsterite, a second ceramic powder mainly composed of at least one material selected from CaTiO3, SrTiO3 and TiO2, and a borosilicate glass powder containing Li2O, MgO, B2O3, SiO2, ZnO and possibly Al2O3. The content of the borosilicate glass powder is about 3 percent by weight or more. The borosilicate glass powder further contains at least one additive selected from the group consisting of CaO, BaO and SrO.

Abstract: A glass-ceramic composition contains first ceramic particles principally containing forsterite; second ceramic particles principally containing at least one selected from the group consisting of calcium titanate, strontium titanate, and titanium oxide; and borosilicate glass particles containing about 3% to 15% lithium oxide, about 20% to 50% magnesium oxide, about 15% to 30% boron oxide, about 10% to 45% silicon oxide, about 6% to 20% zinc oxide, 0% to about 15% aluminum oxide, and at least one additive selected from the group consisting of calcium oxide, barium oxide, and strontium oxide on a weight basis. The content of the borosilicate glass particles is about 3% or more; the lower limit of the content of the additive is about 2%; and the upper limit of the additive content is about 15%, about 25%, or about 25% when the additive is calcium oxide, barium oxide, or strontium oxide, respectively, on a weight basis.

Abstract: An insulating ceramic composition forming insulating ceramic layers (3) stacked in a multilayer ceramic substrate (2) used in a monolithic ceramic electronic component, such as a multilayer ceramic module (1). The insulating ceramic composition contains a first ceramic powder mainly containing forsterite, a second ceramic powder mainly containing at least one compound selected from the group consisting of CaTiO3, SrTiO3, and TiO2, and a borosilicate glass powder. The borosilicate glass powder contains 3 to 15 percent by weight of lithium in terms of Li2O, 30 to 50 percent by weight of magnesium in terms of MgO, 15 to 30 percent by weight of boron in terms of B2O3, 10 to 35 percent by weight of silicon in terms of SiO2, 6 to 20 percent by weight of zinc in terms of ZnO, and 0 to 15 percent by weight of aluminum in terms of Al2O3. The insulating ceramic composition can be fired at a temperature of 1000° C.

Abstract: A glass ceramic composition is used for a multilayer ceramic substrate 2 including glass ceramic layers 3 laminated, the multilayer ceramic substrate 2 being used for a multilayer ceramic module 1. The glass ceramic composition includes a first ceramic powder mainly composed of forsterite, a second ceramic powder mainly composed of at least one component selected from CaTiO3, SrTiO3 and TiO2, and a borosilicate glass powder containing Li2O, MgO, B2O3, SiO2, ZnO and Al2O3. The glass ceramic composition contains 3 percent by weight or more of the borosilicate glass powder and further contains at least one additive selected from the group consisting of CaO, BaO and SrO.

Abstract: A glass ceramic composition for glass ceramic layers laminated in multilayer ceramic substrate included in multilayer ceramic module is provided. The glass ceramic composition contains a first ceramic powder mainly composed of forsterite, a second ceramic powder mainly composed of at least one material selected from CaTiO3, SrTiO3 and TiO2, and a borosilicate glass powder containing Li2O, MgO, B2O3, SiO2, ZnO and possibly Al2O3. The content of the borosilicate glass powder is about 3 percent by weight or more. The borosilicate glass powder further contains at least one additive selected from the group consisting of CaO, BaO and SrO.

Abstract: An electrically conductive paste used for forming wiring conductors, such as via holes (15) disposed on a multilayer ceramic substrate (11), is provided, wherein the temperature range, in which sintering is effected in a firing step, can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a grass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers (12) included in the multilayer ceramic substrate (11) in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.

Abstract: An insulating ceramic composition forming insulating ceramic layers (3) stacked in a multilayer ceramic substrate (2) used in a monolithic ceramic electronic component, such as a multilayer ceramic module (1). The insulating ceramic composition contains a first ceramic powder mainly containing forsterite, a second ceramic powder mainly containing at least one compound selected from the group consisting of CaTiO3, SrTiO3, and TiO2, and a borosilicate glass powder. The borosilicate glass powder contains 3 to 15 percent by weight of lithium in terms of Li2O, 30 to 50 percent by weight of magnesium in terms of MgO, 15 to 30 percent by weight of boron in terms of B2O3, 10 to 35 percent by weight of silicon in terms of SiO2, 6 to 20 percent by weight of zinc in terms of ZnO, and 0 to 15 percent by weight of aluminum in terms of Al2O3. The insulating ceramic composition can be fired at a temperature of 1000° C.

Abstract: A glass-ceramic composition contains first ceramic particles principally containing forsterite; second ceramic particles principally containing at least one selected from the group consisting of calcium titanate, strontium titanate, and titanium oxide; and borosilicate glass particles containing about 3% to 15% lithium oxide, about 20% to 50% magnesium oxide, about 15% to 30% boron oxide, about 10% to 45% silicon oxide, about 6% to 20% zinc oxide, 0% to about 15% aluminum oxide, and at least one additive selected from the group consisting of calcium oxide, barium oxide, and strontium oxide on a weight basis. The content of the borosilicate glass particles is about 3% or more; the lower limit of the content of the additive is about 2%; and the upper limit of the additive content is about 15%, about 25%, or about 25% when the additive is calcium oxide, barium oxide, or strontium oxide, respectively, on a weight basis.

Abstract: A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.