Patents by Inventor Jun Urakawa

Jun Urakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring substrate, method of producing the same, and electronic device using the same
    Publication number: 20030011999
    Abstract: A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.
    Type: Application
    Filed: February 21, 2001
    Publication date: January 16, 2003
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Jun Urakawa, Mitsuyoshi Nishide, Isao Kato, Norio Yoshida, Tomonori Ito
  • Insulating thick film composition, ceramic electronic device using the same, and electronic apparatus
    Patent number: 6452264
    Abstract: An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: September 17, 2002
    Assignee: Murata Manufacturing Co. Ltd
    Inventors: Mitsuyoshi Nishide, Jun Urakawa, Yukinobu Sato
  • Insulating thick film composition, ceramic electronic device using the same, and electronic apparatus
    Publication number: 20020011659
    Abstract: An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.
    Type: Application
    Filed: March 2, 2001
    Publication date: January 31, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Mitsuyoshi Nishide, Jun Urakawa, Yukinobu Sato