Patents by Inventor Jun Utsumi

Jun Utsumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240146580
    Abstract: An estimation system generates, from a value of a time series of an estimation object in a past period, a plurality of patterns of a transition of a value of the estimation object. Based on the plurality of generated patterns and a value of a time series of a factor in the past period, the estimation system specifies a dependency relationship between a transition pattern and a value of the factor and a transition pattern at a past (or future) time point and identifies a model in accordance with the specified dependency relationship. By inputting a value of a time series of the factor in a future period to the estimation model, the estimation system specifies a time series of a value in the future period of the estimation object using at least one transition pattern.
    Type: Application
    Filed: March 8, 2022
    Publication date: May 2, 2024
    Inventors: Masato UTSUMI, Tohru WATANABE, Kazuki NAMBA, Ikuo SHIGEMORI, Hiroshi IIMURA, Hiroaki OGAWA, Daisuke HAMABA, Jun YAMAZAKI
  • Patent number: 10486263
    Abstract: Provided is a semiconductor device formed by performing bonding at room temperature with respect to a wafer in which bonded electrodes and insulating layers and are respectively exposed to front surfaces, including a bonding interlayer which independently exhibits non-conductivity and exhibits conductivity by being bonded to the bonded electrodes, between the front surfaces.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: November 26, 2019
    Assignee: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
    Inventors: Jun Utsumi, Takayuki Goto, Takenori Suzuki, Kensuke Ide
  • Publication number: 20190172813
    Abstract: Provided is a substrate bonding method for bonding a first substrate (11) and a second substrate (12) by sputter-etching, the substrate bonding method comprising: an activation step in which the surface of a first substrate (11) is irradiated with a beam (2) of ion particles of a gas (1) such as Ar and sputter-etched to thereby deposit sputtered particles (Ms) from the first substrate (11) on the surface of a second substrate (12), the first substrate (11) comprising at least one among a semiconductor material, a compound semiconductor material, and a metal material; and a bonding step in which the surface of the second substrate (12), on which the sputtered particles (Ms) from the first substrate (11) are deposited, and the surface of the substrate (11), which is sputter-etched, are overlapped and bonded with each other.
    Type: Application
    Filed: May 15, 2017
    Publication date: June 6, 2019
    Applicants: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Jun UTSUMI, Kensuke IDE, Takenori SUZUKI, Takayuki GOTO, Hideki TAKAGI, Yuuichi KURASHIMA
  • Patent number: 10112376
    Abstract: An inter-substrate material layer is formed between a first substrate and a second substrate to generate a bonding strength. A plurality of metal elements are present in the inter-substrate material layer. An interface element existence ratio of the plurality of metal elements is 0.07 or above. A device can be obtained in which substrates difficult to bond (for example, SiO2 substrates) are bonded at room-temperature to have practical bonding strength.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: October 30, 2018
    Assignees: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL, CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Jun Utsumi, Takayuki Goto, Kensuke Ide, Masahiro Funayama, Hideki Takagi
  • Publication number: 20170355040
    Abstract: Provided is a semiconductor device formed by performing bonding at room temperature with respect to a wafer in which bonded electrodes and insulating layers and are respectively exposed to front surfaces, including a bonding interlayer which independently exhibits non-conductivity and exhibits conductivity by being bonded to the bonded electrodes, between the front surfaces.
    Type: Application
    Filed: October 7, 2015
    Publication date: December 14, 2017
    Applicant: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
    Inventors: Jun UTSUMI, Takayuki GOTO, Takenori SUZUKI, Kensuke IDE
  • Patent number: 9580306
    Abstract: A room temperature bonding apparatus includes a first beam source, a second beam source, and a press bonding mechanism. The first beam source emits a first activation beam that irradiates a first surface of a first substrate. Independently from the first beam source, the second beam source emits a second activation beam that irradiates a second surface of a second substrate. The press bonding mechanism bonds between the first substrate and the second substrate by contacting between the first surface and the second surface after the first surface is irradiated with the first activation beam and the second surface is irradiated with the second activation beam. Thus, a plurality of the substrates made of different materials is appropriately bonded.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: February 28, 2017
    Assignees: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki, Keiichiro Tsutsumi, Hideki Takagi, Yuuichi Kurashima
  • Patent number: 9575053
    Abstract: A novel method that enables prostate cancer testing that is noninvasive and more accurate than conventional methods is disclosed. The present inventors intensively analyzed urine samples from prostate cancer patients, and non-cancer subjects, who are free of prostate cancer, and, as a result, newly discovered urinary peptides that can be used as indicators in prostate cancer testing. Use of these urinary peptides as indicators enables various prostate cancer-related tests including detection of prostate cancer, discrimination between prostate cancer and benign prostatic hyperplasia, monitoring of a therapeutic effect of prostate cancer therapy and monitoring of postoperative recurrence.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: February 21, 2017
    Assignee: KYOTO UNIVERSITY
    Inventors: Kenji Nakayama, Kazuharu Shimizu, Jun Utsumi, Takahiro Inoue, Osamu Ogawa
  • Publication number: 20160250838
    Abstract: An inter-substrate material layer is formed between a first substrate and a second substrate to generate a bonding strength. A plurality of metal elements are present in the inter-substrate material layer. An interface element existence ratio of the plurality of metal elements is 0.07 or above. A device can be obtained in which substrates difficult to bond (for example, SiO2 substrates) are bonded at room-temperature to have practical bonding strength.
    Type: Application
    Filed: May 9, 2016
    Publication date: September 1, 2016
    Applicants: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Jun UTSUMI, Takayuki GOTO, Kensuke IDE, Masahiro FUNAYAMA, Hideki TAKAGI
  • Publication number: 20150251904
    Abstract: A room temperature bonding apparatus includes a first beam source, a second beam source, and a press bonding mechanism. The first beam source emits a first activation beam that irradiates a first surface of a first substrate. Independently from the first beam source, the second beam source emits a second activation beam that irradiates a second surface of a second substrate. The press bonding mechanism bonds between the first substrate and the second substrate by contacting between the first surface and the second surface after the first surface is irradiated with the first activation beam and the second surface is irradiated with the second activation beam. Thus, a plurality of the substrates made of different materials is appropriately bonded.
    Type: Application
    Filed: September 25, 2013
    Publication date: September 10, 2015
    Applicants: MITSUBISHI HEAVY INDUSTRIES, LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki, Keiichiro Tsutsumi, Hideki Takagi, Yuuichi Kurashima
  • Publication number: 20150249026
    Abstract: A room-temperature bonding apparatus includes a vacuum chamber; a first holding mechanism; a second holding mechanism; a beam source; and a pressure bonding mechanism which bonds first and second substrates. At least one of the above members is formed of a first material which is difficult to be sputtered or which does not obstruct a function of a device obtained by bonding the first and second substrates even if the first material is in the bonding surfaces, or a surface of the at least one is covered with the first material.
    Type: Application
    Filed: July 30, 2013
    Publication date: September 3, 2015
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Jun Utsumi, Kensuke Ide, Takenori Suzuki
  • Patent number: 9005390
    Abstract: A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 14, 2015
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
  • Patent number: 8985175
    Abstract: A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus cleans first and second substrates in the chamber when said pressure is at a predetermined degree of vacuum. The pressure controller controls both of the evacuation apparatus and the gas supply apparatus so that the pressure is regulated to a target pressure. The pressing mechanism presses and bonds the first and second substrates when the pressure is set to said target pressure.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: March 24, 2015
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
  • Publication number: 20150065373
    Abstract: A novel method that enables prostate cancer testing that is noninvasive and more accurate than conventional methods is disclosed. The present inventors intensively analyzed urine samples from prostate cancer patients, and non-cancer subjects, who are free of prostate cancer, and, as a result, newly discovered urinary peptides that can be used as indicators in prostate cancer testing. Use of these urinary peptides as indicators enables various prostate cancer-related tests including detection of prostate cancer, discrimination between prostate cancer and benign prostatic hyperplasia, monitoring of a therapeutic effect of prostate cancer therapy and monitoring of postoperative recurrence.
    Type: Application
    Filed: March 28, 2013
    Publication date: March 5, 2015
    Applicant: KYOTO UNIVERSITY
    Inventors: Kenji Nakayama, Kazuharu Shimizu, Jun Utsumi, Takahiro Inoue, Osamu Ogawa
  • Patent number: 8936998
    Abstract: A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: January 20, 2015
    Assignees: Mitsubishi Heavy Industries, Ltd., National Institute of Advanced Industrial Science and Technology
    Inventors: Jun Utsumi, Takayuki Goto, Kensuke Ide, Hideki Takagi, Masahiro Funayama
  • Patent number: 8906175
    Abstract: A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: December 9, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
  • Patent number: 8857487
    Abstract: A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: October 14, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
  • Patent number: 8608048
    Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: December 17, 2013
    Assignees: Mitsubishi Heavy Industries, Ltd., National Institute of Advanced Industrial Science and Technology
    Inventors: Takayuki Goto, Jun Utsumi, Kensuke Ide, Hideki Takagi, Masahiro Funayama
  • Patent number: 8602289
    Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. Preferably, the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: December 10, 2013
    Assignees: Mitsubishi Heavy Industries, Ltd., National Institute of Advanced Industrial Science and Technology
    Inventors: Takayuki Goto, Jun Utsumi, Kensuke Ide, Hideki Takagi, Masahiro Funayama
  • Publication number: 20130213561
    Abstract: A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.
    Type: Application
    Filed: March 12, 2013
    Publication date: August 22, 2013
    Inventors: Jun UTSUMI, Takayuki Goto, Kensuke Ide, Hideki Takagi, Masahiro Funayama
  • Patent number: 8338442
    Abstract: A therapeutic drug for psychoneurotic disorders, which is useful for therapies of psychoneurotic disorders, especially restless legs syndrome is disclosed. The therapeutic drug for psychoneurotic disorders according to the present invention comprises as an effective ingredient an opioid ? receptor agonist compound (excluding pentazocine) such as (?)-17-(cyclopropylmethyl)-3,14?-dihydroxy-4,5?-epoxy-6?[N-methyl-trans-3-(3-furyl)acrylamide]morphinan hydrochloric acid salt.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: December 25, 2012
    Assignee: Toray Industries, Inc.
    Inventors: Hiroo Kumagai, Jun Utsumi