Abstract: A lens component 10 comprises K unit lenses 11, each extending in the X direction and having a common structure, arranged in parallel at a minimum period PL in the Y direction. Each unit lens 11 includes two partial lenses 121, 122 sectioned within the minimum period PL in the Y direction and a flat part 13 disposed between the partial lenses 121, 122. The partial lenses 121, 122 have respective optical axes different from each other but parallel to the Z direction and form images of a common point on an object surface onto an image surface A at respective positions different from each other.

Abstract: A lens component 10 comprises K unit lenses 11, each extending in the X direction and having a common structure, arranged in parallel at a minimum period PL in the Y direction. Each unit lens 11 includes two partial lenses 121, 122 sectioned within the minimum period PL in the Y direction and a flat part 13 disposed between the partial lenses 121, 122. The partial lenses 121, 122 have respective optical axes different from each other but parallel to the Z direction and form images of a common point on an object surface onto an image surface A at respective positions different from each other.

Abstract: A three-dimensional optical sheet is arranged between optical elements and a substrate for optically connecting the optical elements and the substrate and includes a sheet section, convex lens sections, and reflecting sections. The sheet section has first and second main surfaces. The convex lens sections are provided on the first main surface for collecting light. The reflecting sections are provided on the second main surface and change the direction of light traveling along the second main surface such that the light enters the convex lens sections.

Abstract: There is provided a light distribution control panel that can suppress reflection on a glass surface in a mobile unit when the light distribution control panel is applied to a display device mounted on the mobile unit, and a display device for mounting on a mobile unit in which the light distribution control panel is used. A light distribution control panel includes a base body serving as a plate-like or sheet-like base material made of a translucent material, and the base body has a plurality of convex portions for light distribution control formed on one surface opposite to the backlight side of the base body. The plurality of convex portions are positioned to extend in parallel to one another.

Abstract: A three-dimensional optical sheet is arranged between optical elements and a substrate for optically connecting the optical elements and the substrate and includes a sheet section, convex lens sections, and reflecting sections. The sheet section has first and second main surfaces. The convex lens sections are provided on the first main surface for collecting light. The reflecting sections are provided on the second main surface and change the direction of light traveling along the second main surface such that the light enters the convex lens sections.

Abstract: In a processing method of a fine structure according to the present invention, an opposed platen (211) is moved from a retreat position to a molding/processing position, so that a film (1) is pressed against a mold (5) and processed. Thereafter a second block (211b) is separated from a first block (211a). Thus, improvement of the cooling rate for the opposed platen (211) can be attained by reducing the total thermal capacity of the opposed platen (211) by reducing the volume of the opposed platen (211) in cooling and physically discharging heat stored in the opposed platen (211). Thus, cooling efficiency for the opposed platen (211) is improved, and the heat cycle of the opposed platen (211) can be reduced.

Abstract: In a processing method of a fine structure according to the present invention, an opposed platen (211)is moved from a retreat position to a molding/processing position, so that a film (1) is pressed against a mold (5) and processed. Thereafter a second block (211b) is separated from a first block (211a). Thus, improvement of the cooling rate for the opposed platen (211) can be attained by reducing the total thermal capacity of the opposed platen (211) by reducing the volume of the opposed platen (211) in cooling and physically discharging heat stored in the opposed platen (211). Thus, cooling efficiency for the opposed platen (211) is improved, and the heat cycle of the opposed platen (211) can be reduced.

Abstract: An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 ?m-20 ?m when a contact probe is mounted.

Abstract: In order to provide a processing method according to which a highly precise microstructure can be easily formed with low manufacturing cost, the present invention is characterized by comprising the steps of: placing a thin film made of a resin between a pressing die and a facing base; heating the thin film made of a resin between a pressing die and a facing base to a temperature that is no lower than the temperature at which the resin starts being liquefied; and applying pressure to the thin film made of a resin between a pressing die and a facing base at a temperature that is no lower than the temperature at which the resin starts being liquefied, so that a through hole is formed.

Abstract: A method of manufacturing a metal microstructure (1) by using a resin mold (13).

Abstract: A method of producing a fine metal component where a plated coating is deposited on a conductive film exposed at fine through-hole pattern portions in a mold to produce a fine metal component, wherein the conductive film is made using a conductive paste comprised of a metal powder in which the metal particles are magnetically linked together in a chain shape.

Abstract: A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film (522) to form a metal layer (526), a tip end shaping step of obliquely removing and sharpening that part of the metal layer (526) which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer (526) from the pattern frame.

Abstract: A method of manufacturing a metal microstructure (1) by using a resin mold (13).

Abstract: A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film (522) to form a metal layer (526), a tip end shaping step of obliquely removing and sharpening that part of the metal layer (526) which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer (526) from the pattern frame.

Abstract: A method of manufacturing a metal microstructure by using a resin mold.

Abstract: An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 ?m-20 ?m when a contact probe is mounted.

Abstract: A method of manufacturing a columnar contact having a spiral spring structure for attaining electrical continuity with an electrode of electronic equipment or inspection equipment, the method comprising the steps of forming a plastic mold (resist structure) with a metal mold; forming a layer consisting of metallic material on the plastic mold (resist structure) by means of electroforming. With such method, an inspection contact or coupling contact having high reliability and capable of attaining electrical continuity of large electric current can be produced at low cost.

Abstract: A method of manufacturing a metal microstructure by using a resin mold.

Abstract: A conductive paste capable of further reducing the electrical resistance of a conductive film or the like, a conductive film having an anisotropic conductivity, a plating method for forming a plated coating having a uniform crystal structure, and a method of producing a fine metal component having good characteristics. A conductive paste is such that metal powder in the form of many fine metal particles being linked in a chain form is blended. A conductive film is such that chain-form metal powder having paramagnetism is oriented in a constant direction by applying a magnetic field to a coating formed by the application of conductive paste. A plating method grows a plated coating by electroplating on a conductive film formed from a conductive paste. A method of producing a fine metal component which selectively grows a plated coating (4′) on a conductive film (1) exposed at fine pass-hole pattern portions in a mold (3) to produce a fine metal component.

Abstract: A circuit board comprising a first metal layer formed in patterns on a ceramic substrate, a second metal layer formed in patterns on the first metal layer, and a third metal layer formed covering the top surface of the second metal layer and the majority of the side surface, wherein the first and partial second metal layers not covered by the third metal layer are reduced in width by etching. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon.