Abstract: A paste for electroless plating 1′ comprises (a) a minute catalytic powder 11 at least the surface of which is formed by a catalytic metal or a metal capable of substituting for the catalytic metal and (b) a vehicle 10 in which the catalytic powder 11 is dispersed. The paste is used to form a film. A method that plates the film by electroless plating produces a metallic structured body, a micrometallic component, and a conductor circuit, all having a uniform crystal structure unattainable by electroplating using a conductive paste.

Abstract: A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film (522) to form a metal layer (526), a tip end shaping step of obliquely removing and sharpening that part of the metal layer (526) which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer (526) from the pattern frame.

Abstract: A circuit board comprising a patterned first metal layer 14 formed on a ceramic substrate 11, a patterned second metal layer 16 formed on the first metal layer, and a third metal layer 17 formed covering the entire upper surface and side surfaces of the second metal layer and a part of the upper surface of the first metal layer, wherein portions of the first metal layer not covered by the third metal layer are reduced in width by etching. The circuit board has thick-film fine wiring patterns with high bonding strength between the wiring patterns and the substrate and high reliability and enables realization of high-output modules which are small in size and high in performance, by mounting at least one high-output semiconductor element thereon.

Abstract: A circuit board comprising a first metal layer formed in patterns on a ceramic substrate, a second metal layer formed in patterns on the first metal layer, and a third metal layer formed covering the top surface of the second metal layer and the majority of the side surface, wherein the first and partial second metal layers not covered by the third metal layer are reduced in width by etching. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon.

Abstract: A cable and cable system is provided having a conductor and an insulation layer on an outer circumference of a conductor. The insulation layer is impregnated with a medium-viscosity insulating oil that has a viscosity of 10 centistokes (cst) to less than 500 cst at 60° C. The insulation layer includes an insulating tape that may be one or a combination of composite tape having a polyolefin resin film laminated with a kraft paper on both its sides and an insulating tape including a polyolefin resin film. The cable includes a metal sheath provided on an outer circumference of the insulation layer, and a reinforcing layer formed on an outer circumference of the metal sheath. The reinforcing layer reinforces the metal sheath by absorbing hoop stress exerted on the metal sheath. The cable system includes a submarine-portion cable and a land-portion cable, an oil stop joint box, and an oil feeding tank.

Abstract: A solid cable provided with an insulation layer on the outer circumference of a conductor, and impregnated with insulating oil in this insulation layer. Medium-viscosity insulating oil the viscosity of which is between not less than 10 cst and less than 500 cst at 60° C. is used as the insulating oil.

Abstract: Disclosed is an electrical insulating laminated paper prepared by a process which comprises the steps of melt-extruding a polyolefin resin as a binder onto one or two sheets of a kraft insulating paper by means of a extruder to obtain a laminated paper, and calendering or supercalendering the laminated paper so that the total thickness thereof is from 30 to 200 &mgr;m and the proportion of a polymer comprising the polyolefin resin is from 40 to 90%. The laminated paper is excellent in dielectric properties, dielectric strength, and mechanical properties such as adhesive strength.

Abstract: A solid DC cable is made of a conductor having multilayered insulating layer around the outer circumference of the conductor.