Abstract: A flexible display device including a touch sensor is disclosed. In one aspect, the display device includes a flexible substrate, a light emission layer formed over the flexible substrate, and an encapsulation layer formed over the light emission layer and comprising a plurality of encapsulating thin films and a touch detecting layer configured to detect a touch input. The encapsulating thin films include at least one inorganic film and at least one organic film and the touch detecting layer is interposed between a selected one of the at least one inorganic film and a selected one of the at least one organic film that are adjacent to each other.

Abstract: A touch sensing display device including a first substrate with a display unit, a second substrate disposed on the first substrate, a window cover disposed on the second substrate, and a touch force sensor. The touch force sensor includes a first electrode disposed between the first substrate and the second substrate or on a bottom surface of the first substrate, and a second electrode disposed under the first substrate.

Abstract: The present invention provides an LED bulb using heat dissipating LED driver capable of reducing heat influence by disposing an electrolytic capacitor in an output part at a low temperature region through disposing a section receiving an external power close to a light generating module and disposing a section controlling a light emitting diode dose to a power source base.

Abstract: A flat panel display with an integrated touch screen panel includes upper and lower substrates each including a display area and first and second non-display areas around an outside of the display area. A plurality of sensing patterns are in the display area of the upper substrate. A plurality of sensing lines are in the first non-display area of the upper substrate and connected to the sensing patterns. A sealing member is between the second non-display areas of the upper and lower substrates. The upper substrate is a window substrate positioned as an uppermost one of a plurality of substrates provided in the flat panel display.

Abstract: A touch display device including: a plurality of first sensing electrodes; a plurality of second sensing electrodes forming a mutual capacitance with the plurality of first sensing electrodes; an oscillation circuit connected with the plurality of second sensing electrodes and supplying energy so as to generate a first sinusoidal wave signal; a first electrode plate forming a parasitic capacitance with the first and second sensing electrodes and receiving a second sinusoidal wave signal corresponding to the first sinusoidal wave signal; and a scanning driver configured to sequentially select the plurality of first sensing electrodes one-by-one, apply a reference voltage to the selected first sensing electrode, and float the first sensing electrodes which are not selected.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: A magazine includes a main body unit having a front side and a rear side, at least one of which is open, a plurality of slots formed inside two sidewalls of the main body unit, and at least one support member extending to the two sidewalls of the main body unit in a first direction.

Abstract: A test apparatus for a semiconductor package comprising an X-ray analyzer acquiring an X-ray image of the semiconductor package and detecting a thickness of the semiconductor package from the X-ray image, and a thermal reaction analyzer applying a voltage to the semiconductor package and detecting a failure position of the semiconductor package using a surface temperature of the semiconductor package and the thickness of the semiconductor package may be provided.

Abstract: Provided are a system and method for manufacturing a semiconductor package. The system includes: a laser marker configured to irradiate a first laser beam on a strip to make a mark on the strip; and a laser saw configured to irradiate a second laser beam on the strip to cut the strip into individual semiconductor packages.

Abstract: A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device mounting region; a conductive pattern group that is provided on the top surface of the base substrate and includes an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; and a solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads.

Abstract: The present invention provides an LED bulb using heat dissipating LED driver capable of reducing heat influence by disposing an electrolytic capacitor in an output part at a low temperature region through disposing a section receiving an external power close to a light generating module and disposing a section controlling a light emitting diode dose to a power source base.

Abstract: Disclosed herein is an apparatus for inspecting a touch panel and a method thereof, the apparatus includes a capacitance measuring unit measuring capacitance value of a number of regions set on a touch panel, and a defect determining unit determining whether or not a specific region is defective, by comparing the capacitance value of the specific region with the capacitance value of an adjacent region. According to the present embodiments, a touch panel having an improved defect detection ability and a method thereof, by comparing with capacitance of regions adjacent to each other, are provided.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: A flexible display device including a touch sensor is disclosed. In one aspect, the display device includes a flexible substrate, a light emission layer formed over the flexible substrate, and an encapsulation layer formed over the light emission layer and comprising a plurality of encapsulating thin films and a touch detecting layer configured to detect a touch input. The encapsulating thin films include at least one inorganic film and at least one organic film and the touch detecting layer is interposed between a selected one of the at least one inorganic film and a selected one of the at least one organic film that are adjacent to each other.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: A method of fabricating a semiconductor device comprises loading a circuit board including a semiconductor chip into underfill equipment, positioning the circuit board on a depositing chuck of the underfill equipment, filling an underfill material in a space between the semiconductor chip and the circuit board placed on the depositing chuck; transferring the circuit board including the underfill material so that it is positioned on a post-treatment chuck of the underfill equipment; heating the underfill material of the circuit board placed on the post-treatment chuck in a vacuum state, and unloading the circuit board, of which the underfill material has been heated in the vacuum state, from the underfill equipment.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: Disclosed herein is an apparatus for inspecting a touch panel and a method thereof, the apparatus includes: a capacitance measuring unit measuring capacitance value of a number of regions set on a touch panel, and a defect determining unit determining whether or not a specific region is defective, by comparing the capacitance value of the specific region with the capacitance value of an adjacent region. According to the present embodiments, a touch panel having an improved defect detection ability and a method thereof, by comparing with capacitance of regions adjacent to each other, are provided.