Abstract: An apparatus includes a test board for testing electrical characteristics of the semiconductor chip; socket pins vertically disposed on the test board to electrically connect the test board, and external terminals of the semiconductor chip; socket springs interposed between the socket pins and the test board and making the socket pins vertically elastic; a plurality of laser beam transmitters vertically penetrating the socket pins, the socket springs, and the test board; and a laser beam source supplying laser beams to the laser beam transmitters.

Abstract: A wafer fixing apparatus is disclosed including a dicing stage structured to fix a semiconductor wafer. A die attach film is disposed on the dicing stage to attach the semiconductor wafer to the dicing stage. The die attach film attaches the semiconductor wafer to the dicing stage due to the tackiness of the die attach film. A wafer ring, which may be of a metallic material, is coupled to the dicing stage using a wafer ring attaching member.

Abstract: A substrate for a semiconductor package and a method of manufacturing the same are provided. More particularly, the substrate for the semiconductor package and the method for manufacturing the same include metal pieces, with some of the metal pieces having one end embedded within an insulating layer for insulating an external connection electrode of the substrate and the other end embedded within a solder. The substrate for the semiconductor package has the effects of preventing or retarding a connection failure in a solder connection portion by blocking or retarding the propagation of a crack, and allowing a solder to be easily permeated under the metal pieces and formed at a desired position.

Abstract: A semiconductor device and a method of forming the same are provided. A semiconductor chip included in the semiconductor device includes a pillar-shaped terminal and a pad-shaped terminal in a terminal region. The pillar-shaped terminal is exposed at a first surface of a chip substrate in the terminal region and the pad-shaped terminal is exposed at a second surface of the chip substrate in the terminal region, where the first surface and the second surface of the chip substrate in the terminal region face oppositely from each other.

Abstract: Example embodiments may provide an apparatus for and method of separating a semiconductor chip. In the example embodiments, a separating plate having an end insertable between a base tape and an adhesive film may move back and forth in a direction perpendicular to an edge of the semiconductor chip so as to separate the semiconductor chip. Example embodiments may allow fragile, thin semiconductor chips to be safely packaged without damage and thus may increase semiconductor chip yield.

Abstract: A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.

Abstract: Example embodiments of the present invention relate to a method of packaging a semiconductor device. Other example embodiments of the present invention relate to a method of fabricating wafer chips for packaging a semiconductor device. Provided is a method of fabricating a wafer chips, which can perform a reliable pick-up process by removing the adhesive component adhering onto the cutting surfaces of the wafer chips, the diced DAF and the first base film. The method includes preparing at least one wafer, attaching at least one film onto a back surface of the wafer to support the wafer, forming wafer chips by dicing the wafer, detaching the at least one film from the wafer chips and attaching at least one base film onto the wafer chips to support the wafer chips.

Abstract: A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance.

Abstract: A wire bonding method may involve forming a bonding ball on a leading end of a wire projected from a capillary. The bonding ball may be transformed to increase an area of the mounting surface of the bonding ball. The transformed bonding ball may be bonded to the bonding pad.

Abstract: An apparatus includes a test board for testing electrical characteristics of the semiconductor chip; socket pins vertically disposed on the test board to electrically connect the test board, and external terminals of the semiconductor chip; socket springs interposed between the socket pins and the test board and making the socket pins vertically elastic; a plurality of laser beam transmitters vertically penetrating the socket pins, the socket springs, and the test board; and a laser beam source supplying laser beams to the laser beam transmitters.

Abstract: An apparatus for cutting tie bars of semiconductor packages unloads the semiconductor packages by continuously blowing air against the side of the packages after the tie bars are cut and the semiconductor packages are separated from lead frames. The packages are blown into a guide track which feeds into a storage tube. As a result, damage to the packages due to mechanical abrasion which may result from unloading with a pusher bar is prevented. Furthermore, the time required for unloading the semiconductor packages is reduced.