Patents by Inventor Jun Zeng

Jun Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11975483
    Abstract: Examples of methods for part packing are described herein. In some examples, a first subset and a second subset of a set of parts are determined. In some examples a first packing of the first subset is determined. In some examples, a second packing of the second subset is determined based on the first packing.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: May 7, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Alyne Gomes Soares Cantal, Juan Carlos Catana Salazar
  • Publication number: 20240145958
    Abstract: A compact card edge connector for providing high-speed interconnections between different components. The card edge connector includes a mating interface configured to receive a card, a second interface configured to mount to a printed circuit board, and a fourth interface configured to mate with a cable component. The mating interface is perpendicular to the second interface and parallel to the fourth interface. For each column of mating ends at the mating interface, the connector includes two rows mounting ends at the second interface and one column of mounting ends at the fourth interface.
    Type: Application
    Filed: October 25, 2023
    Publication date: May 2, 2024
    Applicant: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Jun Fan, Tao Zeng, Ki Ka Lau
  • Publication number: 20240147303
    Abstract: The present disclosure relates to data transmission methods, network devices. One example data transmission method includes: a first network node sends a first indication information to a second network node, the first indication information includes information about an uplink data volume of a buffer of a terminal device, or the first indication information indicates a relationship between an uplink data volume of a buffer of a terminal device and a predefined data volume threshold.
    Type: Application
    Filed: November 2, 2023
    Publication date: May 2, 2024
    Inventors: Xiaoying XU, Jun CHEN, Qufang HUANG, Qinghai ZENG
  • Patent number: 11969949
    Abstract: A method of custom print mode generation in a three-dimensional (3D) printing device may include printing a plurality of parts with a plurality of 3D printing devices, the parts each being printed using different process parameters, and capturing a plurality of images of the parts. The method may also include, with an image analysis module, analyzing the images to classify the parts into a plurality of defect gradings, and adjusting a number of the process parameters based on characteristics of the parts identified by a user as undesirable. The examiner may also include, with a recommending module, creating a custom print mode based on the parts defect gradings and adjusted process parameters.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: April 30, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Kelly Ronk, Anthony Powell, Jun Zeng, Md Abdullah Al Hafiz Khan, Tod Heiles, Goffril Obegi
  • Patent number: 11971689
    Abstract: Examples of methods for object manufacturing visualization by an electronic device are described herein. In some examples, a predicted thermal image of additive manufacturing is determined using a machine learning model. In some examples, a captured thermal image is obtained. In some examples, a graphical overlay of the predicted thermal image with the captured thermal image is presented.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: April 30, 2024
    Assignees: Hewlett-Packard Development Company, L.P., INSTITUTO ATLANTICO
    Inventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, He Luan, Jun Zeng, Scott Alan White, Sebastia Cortes i Herms, Nailson Boaz Costa Leite, Brian Schmitz Tani
  • Patent number: 11971699
    Abstract: Examples of methods for thermal mapping by an electronic device are described herein. In some examples, a map is obtained. In some examples, a first thermal image at a first resolution is obtained. In some examples, a neural network is used to determine a second thermal image at a second resolution based on the map and the first thermal image. The second resolution is greater than the first resolution in some examples.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: April 30, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Publication number: 20240131800
    Abstract: A computing device comprising a controller is disclosed herein. The controller is to access print data of a virtual build volume including a 3D object to be generated by a 3D printer; modify the print data to include a 3D structure at a location within the build volume to encapsulate an amount of build material; receive powder degradation data corresponding to the powder degradation of the encapsulated amount of build material; and calibrate an additive manufacturing parameter based on the powder degradation data.
    Type: Application
    Filed: March 9, 2021
    Publication date: April 25, 2024
    Inventors: Jacob WRIGHT, Maria Fabiola LEYVA MENDIVIL, Sunil KOTHARI, Lei CHEN, Kyle WYCOFF, Jun ZENG
  • Publication number: 20240131793
    Abstract: Disclosed in the disclosure are a method and apparatus for calibrating an exposure surface of an optical system, and a computer device and a storage medium. The method includes: performing flat-field correction on a photographing module; acquiring a grayscale distribution image; segmenting the grayscale distribution image into a mesh image including a plurality of segmented regions, and calculating a fitting grayscale value of each segmented region; selecting, as a reference grayscale value, a minimum fitting grayscale value from all the fitting grayscale values obtained through calculation, and calculating grayscale compensation coefficients corresponding to the other segmented regions, so as to generate a digital mask; and performing mask compensation, by using the digital mask, on a light projection image projected by the optical system, so as to obtain a printed image of which the exposure surface has a uniform irradiance value.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 25, 2024
    Inventors: Peng DING, Jun HU, Hongqing ZENG, Xin WAN, Bin XU
  • Publication number: 20240134344
    Abstract: Examples of design element placement on 3D surfaces are described herein. In some examples, a three-dimensional (3D) mesh of a 3D surface is converted to a two-dimensional (2D) surface. In some examples, placement of design elements on the 2D surface is determined to maximize density of the design elements while satisfying a minimum separation distance between the design elements. In some examples, the design element placement on the 2D surface is converted to the 3D surface.
    Type: Application
    Filed: March 10, 2021
    Publication date: April 25, 2024
    Inventors: Jianmin ZHENG, Weidan XIONG, Jun ZENG, Edward Dale DAVIS
  • Publication number: 20240133281
    Abstract: A calculation system for predicting a proppant embedding depth based on a shale softening effect is provided, including a sampling test terminal, a scheduling module, a monitoring module, and a calculation module, wherein the scheduling module, the monitoring module, and the calculation module are connected in communication, and the monitoring module is connected to an external operating system through a wireless network, wherein the external operating system is configured to perform a hydraulic fracturing operation and receive a first control signal and/or a second control signal from the monitoring module. The sampling test terminal is configured to test the samples and obtain test data. The scheduling module is configured to determine a target construction parameter.
    Type: Application
    Filed: December 23, 2023
    Publication date: April 25, 2024
    Applicant: SOUTHWEST PETROLEUM UNIVERSITY
    Inventors: Cong LU, Qijun ZENG, Jianchun GUO, Jiaxing LIU, Jun WU, Junkai LU, Cheng LUO, Guangqing ZHOU, Xianbo MENG, Jiandong WANG, Yanhui LIU, Xiaoshan WANG, Xin SHAN
  • Patent number: 11967037
    Abstract: Examples of methods for object deformation determination are described herein. In some examples, a method includes aligning a first bounding box of a three-dimensional (3D) object model with a second bounding box of a scan. In some examples, the method includes determining a deformation between the 3D object model and the scan based on the alignment.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: April 23, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Juan Carlos Catana Salazar, Jun Zeng, He Luan
  • Publication number: 20240125966
    Abstract: A transient electromagnetic device with variable shape and turns includes squares, a transmitting coil carrying frame, a transmitting coil, a turns-variable device, a current generator and a working power supply. The transmitting coil carrying frame is arranged inside the transmitting coil; the transmitting coil carrying frame is configured as a carrier of the transmitting coil, and configured for adjusting a side length of the transmitting coil and a shape of the transmitting coil; the square is configured for clamping and connecting the transmitting coil and the transmitting coil carrying frame to fix the transmitting coil to the transmitting coil carrying frame. The current generator is configured for generating transient current; the turns-variable device is configured for changing the turns of the transmitting coil; and the transmitting coil is configured for transmitting the transient current to a target area to be measured.
    Type: Application
    Filed: December 28, 2022
    Publication date: April 18, 2024
    Inventors: Yuesheng LUAN, Shizhong CHEN, Xiaobo WANG, Jikai WANG, Geming ZENG, Gang SHI, Zhijian ZHANG, Liang LI, Jun ZHANG, Tianzhu XU, Liang ZHANG, Xiao PAN, Li XIAO, Zhou'e WANG, Yunfa ZHU, Liangzi YIDU, Yanian ZHANG, Jie LUO
  • Publication number: 20240128667
    Abstract: A card edge connector for providing high-quality, high-speed interconnections between different printed circuit boards. The card edge connector includes a front housing holding a subassembly and providing a mating interface for the connector. The subassembly includes conductors held by a subassembly housing, and a subassembly shield on a side of the subassembly housing. A mating interface shield is coupled to the subassembly shield and extends beyond the subassembly shield into a wall of the front housing. The subassembly shield and mating interface shield may be coupled through compliant members such as spring fingers. The subassembly shield and mating interface shield may be in parallel planes with the mating interface shield offset away from the conductors though still electrically connected through the compliant members.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 18, 2024
    Applicant: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Jun Fan, Tao Zeng, KI Ka Lau
  • Publication number: 20240123689
    Abstract: An example system includes a simulation engine to determine a plurality of thermal states that will be experienced by powder at a voxel of a three-dimensional print volume as a result of printing a particular build. Each thermal state corresponds to a time during the printing or cooling from the printing. The system includes a stress engine to calculate a stress to the powder at the voxel based on the plurality of thermal states. The system includes a degradation engine to determine an amount of degradation of the powder at the voxel based on the stress.
    Type: Application
    Filed: March 9, 2021
    Publication date: April 18, 2024
    Inventors: Jacob WRIGHT, Maria Fabiola LEYVA MENDIVIL, Lei CHEN, Sunil KOTHARI, Jun ZENG
  • Patent number: 11954524
    Abstract: A method for scheduling services in a computing environment includes receiving a service scheduling request corresponding to the computing environment and identifying a resource pool and a set of compliance requirements corresponding to the computing environment. The method continues by identifying target resources within the resource pool, wherein target resources are resources which meet the set of compliance requirements, and subsequently identifying a set of available target resources, wherein available target resources are target resources with scheduling availability. The method further includes analyzing the set of available target resources to determine a risk score for each available target resource and selecting one or more of the set of available target resources according to the determined risk scores. The method continues by scheduling a service corresponding to the service scheduling request on the selected one or more available target resources.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: April 9, 2024
    Assignee: International Business Machines Corporation
    Inventors: Braulio Gabriel Dumba, Jun Duan, Nerla Jean-Louis, Muhammed Fatih Bulut, Sai Zeng
  • Patent number: 11953114
    Abstract: An air valve with a SMA wire for switching is located in an air chamber in which at least two air holes are formed. The air valve comprises a base, an air piston, a driving component, and the SMA wire. The base is provided with two supporting blocks, and two conduction components near one of the two supporting blocks. The air piston determines a ventilation state of one of the two air holes. The air piston comprises a rod body on the two supporting blocks and with a first triggering part, and a spring sleeved on the rod body. The driving component is sleeved on the rod body and with a second triggering part matched with the first triggering part. The SMA wire is connected with the two conduction components and the driving component, and is turned by the supporting block opposite to the two conduction components.
    Type: Grant
    Filed: August 1, 2022
    Date of Patent: April 9, 2024
    Assignee: TANGTRING SEATING TECHNOLOGY INC.
    Inventors: Jian Zeng, Jun Xie, Qing-Yi Feng
  • Publication number: 20240111536
    Abstract: The present disclosure provides a data processing apparatus and related products. The products include a control module including an instruction caching unit, an instruction processing unit, and a storage queue unit. The instruction caching unit is configured to store computation instructions associated with an artificial neural network operation; the instruction processing unit is configured to parse the computation instructions to obtain a plurality of operation instructions; and the storage queue unit is configured to store an instruction queue, where the instruction queue includes a plurality of operation instructions or computation instructions to be executed in the sequence of the queue. By adopting the above-mentioned method, the present disclosure can improve the operation efficiency of related products when performing operations of a neural network model.
    Type: Application
    Filed: December 7, 2023
    Publication date: April 4, 2024
    Applicant: CAMBRICON TECHNOLOGIES CORPORATION LIMITED
    Inventors: Shaoli Liu, Bingrui Wang, Xiaoyong ZHOU, Yimin ZHUANG, Huiying LAN, Jun LIANG, Hongbo ZENG
  • Publication number: 20240099920
    Abstract: A method for controlling a device for automatically adjusting an airway opening body position is provided. The device includes a horizontal base plate, a head support block, a back support plate, a neck support apparatus, a head cover assembly, and a programmable logic controller (PLC). The neck support apparatus is positioned between the head support block and the back support plate. The PLC is configured to controls a stroke of an electric cylinder according to the following equations: ?=1.235?+?, and ?=KX+B+C, where ? is a body position angle, the body position angle is an angle between a positive projection line of a connecting line from a mandibular angle to an external acoustic meatus on a symmetrical surface of a human body and the back support plate, and ? is a preset value ranging from 90° to 100°.
    Type: Application
    Filed: November 14, 2022
    Publication date: March 28, 2024
    Inventors: XIANG-MEI YANG, MIN-YUE SUN, HONG-MEI CHEN, YAN LUO, JUN WU, JUAN HUANG, DONG-MEI LI, QING ZENG, JING ZHOU, JING WEN, JIN-JIN GUO
  • Publication number: 20240103488
    Abstract: Examples of methods for object packings are described herein. In some examples, a method includes loading a first object in a first subset of a volume. In some examples, the method includes determining, using a genetic procedure, an arrangement of second objects in a second subset of the volume to produce a packing that includes the first object and the second objects.
    Type: Application
    Filed: December 21, 2020
    Publication date: March 28, 2024
    Inventors: JUAN CARLOS CATANA SALAZAR, ALYNE GOMES SOARES CANTAL, ANDRE LUIZ LIMA PEDRO, SCOTT ALAN WHTE, JUN ZENG
  • Patent number: 11941844
    Abstract: An object detection model generation method as well as an electronic device and a computer readable storage medium using the same are provided. The method includes: during the iterative training of the to-be-trained object detection model, the detection accuracy of the iteration nodes of the object detection model is sequentially determined according to the node order, and the mis-detected negative samples of the object detection model at the iteration nodes with the detection accuracy less than or equal to a preset threshold are enhanced. Then the object detection model is trained at the iteration node based on the enhanced negative samples and a first amount of preset training samples. After the training at the iteration nodes are completed, it returns to the step of sequentially determining the detection accuracy of the iteration nodes of the object detection model until the training of the object detection model is completed.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: March 26, 2024
    Assignee: UBTECH ROBOTICS CORP LTD
    Inventors: Yepeng Liu, Yusheng Zeng, Jun Cheng, Jing Gu, Yue Wang, Jianxin Pang