Patents by Inventor Jun Zeng

Jun Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220196102
    Abstract: A formation method for liquid rubber composite nodes with a tubular flow channel is provided. The formation method includes adding a middle spacer sleeve between an outer sleeve and a mandrel, bonding the middle spacer sleeve and the mandrel together through rubber vulcanization and assembling the integrated middle spacer sleeve and the mandrel into the outer sleeve; installing a tubular flow channel in the mandrel; hollowing the middle spacer sleeve to form a plurality of spaces; after vulcanization, forming a plurality of interdependent liquid cavities by using rubber and the plurality of spaces; and arranging liquid in the plurality of liquid cavities and communicating the plurality of liquid cavities through the tubular flow channel.
    Type: Application
    Filed: August 18, 2020
    Publication date: June 23, 2022
    Applicant: ZHUZHOU TIMES RUIWEI ANTI-VIBERATION EQUIPMENT LIMITED
    Inventors: Jun LUO, Wensong LIU, Sheng LIN, Zhongsan JIANG, Junhui CHEN, Yuxiang ZHANG, Xianhui ZENG, Jing LI, Juan ZHOU
  • Publication number: 20220186909
    Abstract: A lens has a light source setting location, first portion and second portion, the second portion has a first light inlet surface, first connection surface, first total reflection surface, second total reflection surface, third total reflection surface, and first light outlet surface being connected to the free end of the first total reflection surface and the third total reflection surface, and emitting the reflected light emitted from the third total reflection surface, and the maximum optical intensity direction of the second light beam emitted from the first light outlet surface intersects with the main optical axis. The lens and the lamp with the lens realizes uniform lighting in a large area on one side, and has small volume and high light efficiency.
    Type: Application
    Filed: August 25, 2021
    Publication date: June 16, 2022
    Inventors: Zuping He, Guoqing Zeng, Xiaoyun Liu, Kai Xu, Jun Yang
  • Patent number: 11361089
    Abstract: Provided is a method for blockchain-based recordkeeping and implementable by a terminal device. The method comprises: obtaining target data; computing a data digest of the target data, and extracting a key segment from the target data; signing, in a secure operation environment included in the terminal device, the data digest and/or the key segment based on a private key associated with the terminal device to generate a signature; and submitting to a blockchain the data digest, the key segment, and the signature, for one or more nodes in the blockchain to verify the signature based on a public key corresponding to the private key, and to record the data digest and the key segment in the blockchain in response to the signature being verified to be valid.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: June 14, 2022
    Assignee: ADVANCED NEW TECHNOLOGIES CO., LTD.
    Inventors: Hong Zhang, Haitao Jiang, Linqing Wang, Xinyu Weng, Fuqiang Li, Feng Lin, Jun Wu, Xiaodong Zeng, Lei Yang
  • Publication number: 20220173537
    Abstract: A card edge connector for providing high-speed interconnections between different printed circuit boards. The card edge connector may include a plurality of wafers, each having a plurality of conductors. The conductors may include tails at one end and mating contact portions at an opposing end. The connector may have more rows of tails than columns of mating contact portions, so that the tails extend less distance from an edge of a PCB toward its center. The connector may be formed from multiple wafers of different sizes. Shorter wafers may have mating contact portions in columns and tails in rows. Taller wafers may have mating contact portions in the same column as a respective shorter wafer and tails in a row parallel to and offset from the row of tails of the respective shorter wafer.
    Type: Application
    Filed: November 24, 2021
    Publication date: June 2, 2022
    Applicant: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Jun Fan, Tao Zeng, Ki Ka Lau
  • Publication number: 20220171903
    Abstract: Examples of methods for adapting simulations are described herein. In some examples, a method may include simulating three-dimensional (3D) manufacturing. In some examples, the method may include adapting a boundary condition of the simulation of the 3D manufacturing based on a measurement from a thermal sensor at a point of a build enclosure.
    Type: Application
    Filed: July 19, 2019
    Publication date: June 2, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Marliere, He Luan
  • Patent number: 11343881
    Abstract: The present disclosure provides a method for controlling a power of an electromagnetic cooking appliance and an electromagnetic cooking appliance. The electromagnetic cooking appliance includes a first coil disk and a second coil disk. Each of the first coil disk and the second coil disk corresponds to an independent resonance circuit. After obtaining a target power of the electromagnetic cooking appliance, a heating period of the electromagnetic cooking appliance is determined based on the target power, each heating period including at least one first heating time period and at least one second heating time period. The first coil disk is controlled to heat in the first heating time period, and the second coil disk to heat in the second heating time period, such that the first coil disk and the second coil disk are heated alternately to reduce an interference of harmonic current and voltage flicker.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: May 24, 2022
    Assignee: FOSHAN SHUNDE MIDEA ELECTRICAL HEATING APPLIANCES MANUFACTURING CO., LTD.
    Inventors: Jun Lei, Jaeeun Byun, Yunfeng Wang, Lutian Zeng, Deyong Jiang, Fan Zhang, Shufeng Huang, Wenhua Liu, Yuehong Qu
  • Patent number: 11338521
    Abstract: In an example of a method for parts packing, at least one part to be printed is identified. A placement and an orientation of the at least one identified part in a build volume of a three-dimensional (3D) printer is determined that optimizes a thermal uniformity inside the build volume.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: May 24, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, David James Tucker
  • Patent number: 11339194
    Abstract: The invention relates to a truncated rotavirus VP4 protein, a sequence encoding the same, a method for preparing the same, and a pharmaceutical composition and a vaccine comprising the protein, wherein the protein, the pharmaceutical composition and the vaccine are useful for preventing, alleviating or treating rotavirus infection and a disease caused by rotavirus infection, such as rotavirus gastroenteritis and diarrhea. The invention further relates to use of the protein in the manufacture of a pharmaceutical composition or a vaccine for preventing, alleviating or treating rotavirus infection and a disease caused by rotavirus infection, such as rotavirus gastroenteritis and diarrhea.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: May 24, 2022
    Assignees: Xiamen University, Xiamen Innovax Biotech Co., Ltd.
    Inventors: Shengxiang Ge, Tingdong Li, Lianzhi Jia, Yijian Li, Miaoge Xue, Yuanjun Zeng, Huirong Pan, Jun Zhang, Ningshao Xia
  • Patent number: 11340597
    Abstract: 3-D printing batch analysis is disclosed. A disclosed example apparatus includes a processor to generate a plurality of batches, wherein each of the batches represent an arrangement of a plurality of parts to be printed in a volume, discretize the batches into slices, and determine risk values of the slices based on the respective geometric primitives. The processor is to also determine aggregate risk values corresponding to the batches based on the risk values of the slices of the respective batches, and select a batch of the plurality of batches based on the aggregate risk values. The example apparatus also includes a printer to print the selected batch in the volume.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: May 24, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Juan Carlos Catana, Sam A. Stodder
  • Patent number: 11340021
    Abstract: A heat exchanger module includes a condenser unit and an evaporator unit. The evaporator unit includes N pieces of parallel-flow heat exchangers arranged adjacently, and the coolant temperatures reduce gradually from the first to Nth parallel-flow heat exchangers along an air flow direction in the evaporator unit. A counter-current mounting method is adopted in the parallel-flow heat exchangers of the evaporator unit in the heat exchanger module provided by the present invention. The coolant temperature of each parallel-flow heat exchanger is lower than that of the previous one, the temperature difference between air and coolant is relatively uniform by using the counter-current method so as to reach a better heat exchange effect.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: May 24, 2022
    Assignee: SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
    Inventors: Wenqiang Cao, Qingzhen Zeng, Jun Liu
  • Patent number: 11335073
    Abstract: Examples disclosed herein relate to selecting a 3D printing parameter based on voxel property association and conflict resolution. In one implementation, a processor assigns properties to a voxel of a 3D print object based on a first and second zone including the voxel and a condition of a first property associated with the first zone and a condition of a second property associated with the second zone. The processor may update the assigned properties to resolve conflicts between the properties and select a 3D printing parameter based on the assigned properties.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Scott White, Federico Martinez, Ana Del Angel, Gary J. Dispoto, Sebastia Cortes I Herms
  • Patent number: 11335074
    Abstract: According to an example, an apparatus may include a memory that may store instructions to cause a processor to generate, for each part to be fabricated in a build envelope of a 3D fabricating device, first level descriptions and second level descriptions for the part. The processor may determine, using the first level descriptions, whether there is an arrangement that results in the parts jointly fitting within the build envelope while providing certain thermal decoupling spaces between the parts. In response to a determination that the arrangement using the first level descriptions for the parts has not been determined, the processor may determine, using the second level descriptions, whether there is an arrangement that results in the parts jointly fitting within the build envelope while providing the certain thermal decoupling spaces.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ning Ge, Steven J. Simske, Chandrakant Patel, Jun Zeng, Paul J. Benning, Lihua Zhao
  • Publication number: 20220150203
    Abstract: Systems and method for determining a topic cohesion measurement between a content item and a hyperlinked landing page are presented. In one embodiment, a plurality of content item signals is generated for the content item and a corresponding plurality of signals are generated for the hyperlinked landing page. An analysis of the corresponding signals is conducted to determine a measurement of topic cohesion, a topic cohesion score, between the content item and the hyperlinked landing page. A cohesion predictor model is trained to generate the predictive topic cohesion score between an input content item and a hyperlinked landing page. Upon a determination that the topic cohesion score is less than a predetermined threshold, remedial actions are taken regarding the hyperlink of the content item. Alternatively, positive actions may be carried out, including promoting the content item to others, associating advertisements with the content item, and the like.
    Type: Application
    Filed: January 19, 2022
    Publication date: May 12, 2022
    Inventors: Andrey Dmitriyevich Gusev, Wenke Zhang, Hsiao-Ching Chang, Qinglong Zeng, Peter John Daoud, Jun Liu, Grace Chin, Zhuoyuan Li, Jacob Franklin Hanger, Vincent Bannister
  • Patent number: 11316021
    Abstract: A vertical transistor structure in which a recessed field plate trench surrounds multiple adjacent gate electrodes. Thus the specific on-state conductance is increased, since the ratio of recessed field plate area to channel area is reduced. Various versions use two, three, or more distinct gate electrodes within the interior of a single RFP or RSFP trench's layout.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: April 26, 2022
    Assignee: MaxPower Semiconductor Inc.
    Inventors: Mohamed N. Darwish, Jun Zeng, Richard A. Blanchard
  • Patent number: 11289596
    Abstract: A split gate power device is disclosed having a trench containing a U-shaped gate that, when biased above a threshold voltage, creates a conductive channel in a p-well. Below the gate is a field plate in the trench, coupled to the source electrode, for spreading the electric field along the trench to improve the breakdown voltage. The top gate poly is initially formed relatively thin so that it can be patterned using non-CMP techniques, such as dry etching or wet etching. As such, the power device can be fabricated in conventional fabs not having CMP capability. In one embodiment, the thin gate has vertical and lateral portions that create conductive vertical and lateral channels in a p-well. In another embodiment, the thin gate has only vertical portions along the trench sidewalls for minimizing surface area and gate capacitance.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: March 29, 2022
    Assignee: MaxPower Semiconductor, Inc.
    Inventors: Jun Zeng, Kui Pu, Mohamed N. Darwish, Shih-Tzung Su
  • Publication number: 20220088878
    Abstract: Examples of methods for adapting a simulation of three-dimensional (3D) manufacturing are described herein. In some examples, a method includes determining, using a machine learning model, a predicted thermal image based on a thermal imaging stream of 3D manufacturing. In some examples, a method includes adapting a simulation of the 3D manufacturing based on the predicted thermal image.
    Type: Application
    Filed: June 11, 2019
    Publication date: March 24, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Marliere, He Luan
  • Publication number: 20220088879
    Abstract: Systems and methods of predicting temperature during a build of a three-dimensional (3D) part include determining a temperature profile at a plurality of layers of a part based on geometric characteristics of the 3D part as defined by a 3D part file, and adjusting a process parameter of the build based on the determined temperature.
    Type: Application
    Filed: January 23, 2019
    Publication date: March 24, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Tod Heiles, Juan Carlos Catana Salazar, Jun Zeng, Gary J. Dispoto
  • Publication number: 20220083712
    Abstract: Examples of methods for simulating three-dimensional (3D) manufacturing of an object are described herein. In some examples, a method includes simulating 3D manufacturing of an object based on a value. In some examples, the value indicates a sub-voxel proportion of a voxel that is occupied by the object. Some examples of the methods may include determining the value for the voxel.
    Type: Application
    Filed: June 7, 2019
    Publication date: March 17, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Martiere, Maria Fabiola Leyva Mendivil, Jose Israel Figueroa Angulo
  • Publication number: 20220080672
    Abstract: A method of custom print mode generation in a three-dimensional (3D) printing device may include printing a plurality of parts with a plurality of 3D printing devices, the parts each being printed using different process parameters, and capturing a plurality of images of the parts. The method may also include, with an image analysis module, analyzing the images to classify the parts into a plurality of defect gradings, and adjusting a number of the process parameters based on characteristics of the parts identified by a user as undesirable. The examiner may also include, with a recommending module, creating a custom print mode based on the parts defect gradings and adjusted process parameters.
    Type: Application
    Filed: January 10, 2019
    Publication date: March 17, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Kelly Ronk, Anthony Powell, Jun Zeng, Md Abdullah Al Hafiz Khan, Tod Heiles, Goffril Obegi
  • Patent number: 11275353
    Abstract: An example technique for creating a voxel representation of a three dimensional (3-D) object can include obtaining a shape specification of a 3-D object and a number of 3-D objectives. The example technique for creating a voxel representation of the 3-D object can also include creating a voxel representation of the 3-D object by assigning a material type from a number of material types to each voxel of the voxel representation that defines the 3-D object. The example technique creating a voxel representation of a 3-D object can also include evaluating the voxel representation to determine whether the number of objectives are met.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: March 15, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Sebastia Cortes, Scott A. White