Patents by Inventor Jun Zeng

Jun Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220288854
    Abstract: Examples disclosed herein relate to 3D printer fresh and recycled powder supply management. In one implementation, a processor estimates fresh and recycled powder use and recycled powder creation by a 3D printer based on a set of print jobs.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 15, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Wesley R. Schalk, Jun Zeng, Francisco Oblea, Gary Dispoto
  • Patent number: 11440260
    Abstract: Examples disclosed herein relate to 3D printer fresh and recycled powder supply management. In one implementation, a processor estimates fresh and recycled powder use and recycled powder creation by a 3D printer based on a set of print jobs. The processor may coordinate fresh and recycled powder resources based on the powder estimate and stored information about powder resources.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: September 13, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Wesley R. Schalk, Jun Zeng, Francisco Oblea, Gary Dispoto
  • Patent number: 11426943
    Abstract: A control and feedback technique to determine the proper location of powder control temperature regions includes detecting solid parts having specified shape and thermal characteristics. The solid parts are generated by a 3D printer. The solid parts include powder material fused on a layer by layer basis. A powder control temperature region is selected in each layer of powder material, wherein the region is located in unfused powder material adjacent to the solid parts, and wherein the region is selected based on characteristics of the shape of a build area and thermal imaging associated with any of a structural formation of the solid parts adjacent to the region, and an amount of thermal energy radiated by the solid parts adjacent to the region. The amount of thermal energy to cause fusing of the powder material on each subsequent layer is modified based on location of the powder control temperature region.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: August 30, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Tod Heiles, Juan Carlos Salazar, Goffril Obegi, Jun Zeng, Gary J. Dispoto
  • Patent number: 11420396
    Abstract: According to examples, a three-dimensional (3D) fabrication system may include fabrication components and a controller. The controller may control the fabrication components to fabricate parts of a 3D object in a build envelope, the parts to be assembled together to form the object, and in which the parts are fabricated at locations corresponding to relative positions of the parts with respect to each other in the assembled object. The controller may also control the fabrication components to fabricate a cage around the parts in the build envelope.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: August 23, 2022
    Assignees: Hewlett-Packard Development Co., L.P., Instituto Atlantico
    Inventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, Thiago Barbosa Lima De Moura, Ana Patricia Del Angel, Jun Zeng, Scott White, Sebastia Cortes I Herms
  • Patent number: 11409261
    Abstract: In some examples, a distribution of values of a property of a given layer to be printed as part of three-dimensional (3D) printing is predicted, wherein the predicting is based on a distribution of values of the property in a previous layer that has been printed as part of the 3D printing. 3D printing of an object is controlled based on the predicted distribution of values of the property of the given layer.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: August 9, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Kristopher Li, Viseth Sean, Jun Zeng, Lihua Zhao, Goffril Obegi, Gary J. Dispoto, Tod Heiles
  • Publication number: 20220215528
    Abstract: An example three-dimensional (3D) printer may include a camera to capture a low-resolution thermal image of a build material bed. The 3D printer may include an interpolation engine to generate an interpolated thermal image based on the low-resolution thermal image. The 3D printer may also include a correction engine to enhance fine details of the interpolated thermal image without distorting thermal values from portions of the interpolated thermal image without fine details to produce an enhanced thermal image.
    Type: Application
    Filed: September 26, 2019
    Publication date: July 7, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: HE LUAN, Jun Zeng
  • Patent number: 11376793
    Abstract: A system and method for providing three dimensional printing production quality prediction is described herein. The system may include logic to scan a region of interest associated with a layer of a plurality of parts during printing to obtain an input for the region of interest and compute an input metric associated with the layer based on the input. In response to an initial set of print jobs, at least a portion of the plurality of parts is mechanically tested to determine at least one output. In response to a production print job, a likelihood of a part of the plurality of parts to satisfy a quality specification is predicted by inputting the input metric to at least one machine learning function comprising the at least one output, wherein the at least one machine learning function is trained during the initial set of print jobs.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: July 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Jun Zeng, Gary J. Dispoto, Viseth Sean
  • Patent number: 11376796
    Abstract: A printing device for adapting a printing parameter in relation to the height of a layer of material deposited during an additive manufacturing process is disclosed. The printing device comprises a printing component to deposit a layer of material that is to be solidified so as to form at least a portion of an object, a controller to determine the height of the layer of material at various positions across the layer and to select voxels of a data model of the object, the selected voxels correspond to the height of the layer of material at said various positions, and the controller is further to use the selected voxels as input for calculating a printing parameter.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: July 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jordi Roca Vila, Sergio Gonzalez Martin, Daniel Mosher, David A. Champion, Jun Zeng
  • Publication number: 20220171903
    Abstract: Examples of methods for adapting simulations are described herein. In some examples, a method may include simulating three-dimensional (3D) manufacturing. In some examples, the method may include adapting a boundary condition of the simulation of the 3D manufacturing based on a measurement from a thermal sensor at a point of a build enclosure.
    Type: Application
    Filed: July 19, 2019
    Publication date: June 2, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Marliere, He Luan
  • Patent number: 11338521
    Abstract: In an example of a method for parts packing, at least one part to be printed is identified. A placement and an orientation of the at least one identified part in a build volume of a three-dimensional (3D) printer is determined that optimizes a thermal uniformity inside the build volume.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: May 24, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, David James Tucker
  • Patent number: 11340597
    Abstract: 3-D printing batch analysis is disclosed. A disclosed example apparatus includes a processor to generate a plurality of batches, wherein each of the batches represent an arrangement of a plurality of parts to be printed in a volume, discretize the batches into slices, and determine risk values of the slices based on the respective geometric primitives. The processor is to also determine aggregate risk values corresponding to the batches based on the risk values of the slices of the respective batches, and select a batch of the plurality of batches based on the aggregate risk values. The example apparatus also includes a printer to print the selected batch in the volume.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: May 24, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Juan Carlos Catana, Sam A. Stodder
  • Patent number: 11335073
    Abstract: Examples disclosed herein relate to selecting a 3D printing parameter based on voxel property association and conflict resolution. In one implementation, a processor assigns properties to a voxel of a 3D print object based on a first and second zone including the voxel and a condition of a first property associated with the first zone and a condition of a second property associated with the second zone. The processor may update the assigned properties to resolve conflicts between the properties and select a 3D printing parameter based on the assigned properties.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Scott White, Federico Martinez, Ana Del Angel, Gary J. Dispoto, Sebastia Cortes I Herms
  • Patent number: 11335074
    Abstract: According to an example, an apparatus may include a memory that may store instructions to cause a processor to generate, for each part to be fabricated in a build envelope of a 3D fabricating device, first level descriptions and second level descriptions for the part. The processor may determine, using the first level descriptions, whether there is an arrangement that results in the parts jointly fitting within the build envelope while providing certain thermal decoupling spaces between the parts. In response to a determination that the arrangement using the first level descriptions for the parts has not been determined, the processor may determine, using the second level descriptions, whether there is an arrangement that results in the parts jointly fitting within the build envelope while providing the certain thermal decoupling spaces.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ning Ge, Steven J. Simske, Chandrakant Patel, Jun Zeng, Paul J. Benning, Lihua Zhao
  • Patent number: 11316021
    Abstract: A vertical transistor structure in which a recessed field plate trench surrounds multiple adjacent gate electrodes. Thus the specific on-state conductance is increased, since the ratio of recessed field plate area to channel area is reduced. Various versions use two, three, or more distinct gate electrodes within the interior of a single RFP or RSFP trench's layout.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: April 26, 2022
    Assignee: MaxPower Semiconductor Inc.
    Inventors: Mohamed N. Darwish, Jun Zeng, Richard A. Blanchard
  • Patent number: 11289596
    Abstract: A split gate power device is disclosed having a trench containing a U-shaped gate that, when biased above a threshold voltage, creates a conductive channel in a p-well. Below the gate is a field plate in the trench, coupled to the source electrode, for spreading the electric field along the trench to improve the breakdown voltage. The top gate poly is initially formed relatively thin so that it can be patterned using non-CMP techniques, such as dry etching or wet etching. As such, the power device can be fabricated in conventional fabs not having CMP capability. In one embodiment, the thin gate has vertical and lateral portions that create conductive vertical and lateral channels in a p-well. In another embodiment, the thin gate has only vertical portions along the trench sidewalls for minimizing surface area and gate capacitance.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: March 29, 2022
    Assignee: MaxPower Semiconductor, Inc.
    Inventors: Jun Zeng, Kui Pu, Mohamed N. Darwish, Shih-Tzung Su
  • Publication number: 20220088878
    Abstract: Examples of methods for adapting a simulation of three-dimensional (3D) manufacturing are described herein. In some examples, a method includes determining, using a machine learning model, a predicted thermal image based on a thermal imaging stream of 3D manufacturing. In some examples, a method includes adapting a simulation of the 3D manufacturing based on the predicted thermal image.
    Type: Application
    Filed: June 11, 2019
    Publication date: March 24, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Marliere, He Luan
  • Publication number: 20220088879
    Abstract: Systems and methods of predicting temperature during a build of a three-dimensional (3D) part include determining a temperature profile at a plurality of layers of a part based on geometric characteristics of the 3D part as defined by a 3D part file, and adjusting a process parameter of the build based on the determined temperature.
    Type: Application
    Filed: January 23, 2019
    Publication date: March 24, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Tod Heiles, Juan Carlos Catana Salazar, Jun Zeng, Gary J. Dispoto
  • Publication number: 20220080672
    Abstract: A method of custom print mode generation in a three-dimensional (3D) printing device may include printing a plurality of parts with a plurality of 3D printing devices, the parts each being printed using different process parameters, and capturing a plurality of images of the parts. The method may also include, with an image analysis module, analyzing the images to classify the parts into a plurality of defect gradings, and adjusting a number of the process parameters based on characteristics of the parts identified by a user as undesirable. The examiner may also include, with a recommending module, creating a custom print mode based on the parts defect gradings and adjusted process parameters.
    Type: Application
    Filed: January 10, 2019
    Publication date: March 17, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Kelly Ronk, Anthony Powell, Jun Zeng, Md Abdullah Al Hafiz Khan, Tod Heiles, Goffril Obegi
  • Publication number: 20220083712
    Abstract: Examples of methods for simulating three-dimensional (3D) manufacturing of an object are described herein. In some examples, a method includes simulating 3D manufacturing of an object based on a value. In some examples, the value indicates a sub-voxel proportion of a voxel that is occupied by the object. Some examples of the methods may include determining the value for the voxel.
    Type: Application
    Filed: June 7, 2019
    Publication date: March 17, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Martiere, Maria Fabiola Leyva Mendivil, Jose Israel Figueroa Angulo
  • Patent number: 11275353
    Abstract: An example technique for creating a voxel representation of a three dimensional (3-D) object can include obtaining a shape specification of a 3-D object and a number of 3-D objectives. The example technique for creating a voxel representation of the 3-D object can also include creating a voxel representation of the 3-D object by assigning a material type from a number of material types to each voxel of the voxel representation that defines the 3-D object. The example technique creating a voxel representation of a 3-D object can also include evaluating the voxel representation to determine whether the number of objectives are met.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: March 15, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Sebastia Cortes, Scott A. White