Patents by Inventor Jun Zhu

Jun Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200279966
    Abstract: The disclosure discloses a solder strip applied to a shingled solar cell module, including a flat portion, and an upper cell slice connecting portion and a lower cell slice connecting portion located at two sides of the flat portion; a plurality of fine grid lines are arranged in parallel on front/back surfaces of lower/upper cell slices; cutting directions of the lower cell slice and the upper cell slice are parallel to the fine grid lines; the solder strip is arranged perpendicular to the fine grid lines or parallel to busbars; and the upper cell slice partially overlaps with the lower cell slice, the flat portion is soldered to the fine grid lines/busbars on the front surface of the lower cell slice and the fine grid lines/busbars on the back surface of the upper cell slice to form an overlapped region, the upper cell slice connecting portion is soldered to the fine grid lines/busbars on the back surface of the upper cell slice, and the lower cell slice connecting portion is soldered to the fine grid lines
    Type: Application
    Filed: November 20, 2017
    Publication date: September 3, 2020
    Applicant: LONGI SOLAR TECHNOLOGY (TAIZHOU) CO., LTD.
    Inventors: Jun LYU, Chen ZHU, Qiangzhong ZHU
  • Publication number: 20200269628
    Abstract: The invention relates to the field of optical anti-counterfeiting, and discloses an optical anti-counterfeiting element and an optical anti-counterfeiting product. The optical anti-counterfeiting element comprises: a substrate which is at least partially pervious to light, comprising a first surface and a second surface opposite each other; an anti-counterfeiting image formed on the first surface of the substrate, wherein the anti-counterfeiting image comprises a plurality of imaging pixel groups, and the imaging pixel groups are arranged aperiodically and/or without an axis of symmetry; and a sampling-synthesis layer with optical characteristics formed on the second surface of the substrate, wherein target visual images corresponding to the imaging pixel groups can be presented through a light-pervious part of the substrate and the sampling-synthesis layer.
    Type: Application
    Filed: March 16, 2020
    Publication date: August 27, 2020
    Applicants: ZHONGCHAO SPECIAL SECURITY TECHNOLOGY CO., LTD, CHINA BANKNOTE PRINTING AND MINTING CORP.
    Inventors: Baoli Zhang, Kai Sun, Jun Zhu, Xiaoli Wang
  • Publication number: 20200274375
    Abstract: A power electronics assembly for a mobile application includes a first power electronics component selectively coupled to a high source on a first side and coupled to a high voltage battery on a second side, a second power electronics component selectively coupled to one of a low load or a low voltage battery on a first side and coupled to the high voltage battery on a second side; and a controller, including an operating mode circuit structured to determine a discharge operating mode for the mobile application, a power electronics configuration circuit structured to provide a switch state value for the first power electronics component and the second power electronics component in response to the discharge operating mode, and wherein the first power electronics component and the second power electronics component are responsive to the switch state value to coupled selected ones of the high source, low load, and low voltage battery to the high voltage battery.
    Type: Application
    Filed: March 23, 2020
    Publication date: August 27, 2020
    Inventors: Justin Keith Griffiths, Nilesh Surase, Ritika Shetty, Shalini Tripathy, Somdut Dey, Madhavi Gupta, Mayura Madane, Sadiya Qureshi, Toseed Khan, Amit Chavan, Kumar Prasad Telikepalli, Atul Solvande, Hao Wang, Jiong Chen, Yueyue Deng, Jason Carroll, Srinivasan Arjun Tekalur, Jacob William Green, Chakravarthi Kandru, Cheng Luo, Tianyang Jiang, Cheng Wan, Ye Zhu, John Trublowski, Robert Stephen Douglass, Rajen Modi, Nilay Mehta, Laura Natali Valencia Fritsch, Han Li, Dongxin Jin, Lewei Qian, Jun Li, Hongrae Kim, Daniel R. Ouwenga, Patrick Herranz, Miroslav Horejs, Rohit Baranwal, Zhe Zhang, Martin Wayne Mensch, Brandon William Fisher, Austin Robert Zurface, Jeff Howard Urian, James David, Bharath Kumar Suda, Asheesh Kumar Soni, Rene Guy Gallet, Michael Scott Sullivan, Karsten Gerving, Guido Völlmar, Gerd Schmitz, Christoph Bausch, Ute Molitor, Lutz Friedrichsen, Kai Schroeder, Julia Otte, Madeline Philipsohn, Norbert Roesner, Volker Lang, Johannes Meissner, Paolo D'Amico, Jalpa Shah, Meng Wang, Damrongrit Piyabongkarn, Niles Stephen Ramseyer, Dennis Dukaric, Matt Haylock, Anvaya R. Hingangave, Devendra Patil
  • Publication number: 20200270630
    Abstract: Compositions and methods for controlling pests are provided. The methods involve transforming organisms with a nucleic acid sequence encoding an insecticidal protein. In particular, the nucleic acid sequences are useful for preparing plants and microorganisms that possess insecticidal activity. Thus, transformed bacteria, plants, plant cells, plant tissues and seeds are provided. Compositions are insecticidal nucleic acids and proteins of bacterial species. The sequences find use in the construction of expression vectors for subsequent transformation into organisms of interest, as probes for the isolation of other homologous (or partially homologous) genes. The insecticidal proteins find use in controlling, inhibiting growth or killing lepidopteran, coleopteran, dipteran, fungal, hemipteran, and nematode pest populations and for producing compositions with insecticidal activity.
    Type: Application
    Filed: March 9, 2020
    Publication date: August 27, 2020
    Applicant: PIONEER HI-BRED INTERNATIONAL, INC.
    Inventors: DAVID CHARLES CERF, JAMES J ENGLISH, CAROL A HENDRICK, LU LIU, JARRED KENNETH ORAL, PHILLIP A PATTEN, BARBARA ROSEN, UTE SCHELLENBERGER, INGRID UDRANSZKY, JUN-ZHI WEI, GENHAI ZHU
  • Patent number: 10757069
    Abstract: The present invention provides an IP address allocation method for a master-slave network, an apparatus, and a system. A master device generates an IP address sub-segment group, and separately sends at least one IP address sub-segment in the IP address sub-segment group to at least one slave device, so that the slave device can use a received IP address sub-segment as a DHCP server address and allocate an IP address to a user device. In this way, the slave device can directly allocate the IP address to the user device, so that an IP address allocation time is reduced.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: August 25, 2020
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Chong Zhu, Xin Lv, Jun Yang
  • Patent number: 10752239
    Abstract: One or more sensors associated with a vehicle detect a roadway condition of a first roadway and an evasive maneuver is performed by the vehicle to avoid the detected roadway condition. In response to one or more processors determining that the evasive maneuver was successful, a record of the successful maneuver and the roadway condition are stored in a database. Subsequent to storing the record in the database, one or more computers associated with one or more vehicles is trained to execute the evasive maneuver, in response to determining that the one or more vehicles is exposed to the roadway condition experienced by the vehicle.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: August 25, 2020
    Assignee: International Business Machines Corporation
    Inventors: Ning Duan, Guoqiang Hu, Jing Chang Huang, Junchi Yan, Jun Zhu
  • Publication number: 20200267817
    Abstract: System and method for voltage conversion to drive one or more light emitting diodes with at least a TRIAC dimmer. For example, the system includes: a phase detector configured to receive a first rectified voltage generated based at least in part on an AC input voltage processed by at least the TRIAC dimmer, the phase detector being further configured to generate a digital signal representing phase information associated with the first rectified voltage; a voltage generator configured to receive the digital signal and generate a DC voltage based at least in part on the digital signal; and a driver configured to receive the DC voltage and affect, based at least in part on the DC voltage, a current flowing through the one or more light emitting diodes; wherein the current changes with the phase information according to a predetermined function.
    Type: Application
    Filed: February 14, 2020
    Publication date: August 20, 2020
    Inventors: JIQING YANG, ZHUOYAN LI, LIQIANG ZHU, JUN ZHOU
  • Publication number: 20200266147
    Abstract: Embodiments of methods and structures for forming a 3D integrated wiring structure are disclosed. The method can include forming an insulating layer on a front side of a first substrate; forming a semiconductor layer on a front side of the insulating layer; patterning the semiconductor layer to expose at least a portion of a surface of the insulating layer; forming a plurality of semiconductor structures over the front side of the first substrate, wherein the semiconductor structures include a plurality of conductive contacts and a first conductive layer; joining a second substrate with the semiconductor structures; performing a thinning process on a backside of the first substrate to expose the insulating layer and one end of the plurality of conductive contacts; and forming a conductive wiring layer on the exposed insulating layer.
    Type: Application
    Filed: May 6, 2020
    Publication date: August 20, 2020
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jifeng ZHU, Jun CHEN, Si Ping HU, Zhenyu LU
  • Publication number: 20200262765
    Abstract: Disclosed herein are superabsorbent hydrogels formed using okara particles and polymeric chains. The hydrogel contains crosslinks, which are provided by crosslinking groups between the polymeric chains or by a plurality of polymer chains being bonded to each okara particle (with each of these chains being bonded to at least one further okara particle too). The resulting superabsorbent hydrogels are useful in aiding plant growth, nutrition and hydration, and may be mixed with soil to form a composite material for such purposes.
    Type: Application
    Filed: August 27, 2018
    Publication date: August 20, 2020
    Inventors: Jun LI, Jingling ZHU, Xia SONG, Choon Nam ONG, Chiang Shiong LOH, Wee Kee TAN
  • Publication number: 20200266925
    Abstract: Systems and methods which provide for accurate decoding of a received channel signal when station identifier information is unknown. Embodiments accurately decode a physical downlink control channel (PDCCH), such as to obtain downlink control information (DCI), without knowing radio network temporary identifier (RNTI) information. An unknown station identifier information (USII) of embodiments uses redundancy reduction-based error checking (performing error checking between data decoded from a candidate control channel data block containing redundant data and a portion of that candidate control channel data block containing redundancy reduced data) for implementing decoding when station identifier information is unknown. Embodiments of a USII decoder may use a power detection technique for identifying candidate control channel data blocks used in redundancy reduction-based error checking operation.
    Type: Application
    Filed: February 14, 2019
    Publication date: August 20, 2020
    Inventors: Xiangyu Liu, Lu Yang, Eddy Chiu, Chenggang Lyu, Jun Zhu, Ching Hong Chris Leung, Man Wai Victor Kwan, Kong Chau Eric Tsang
  • Publication number: 20200262874
    Abstract: Compositions and methods for controlling pests are provided. The methods involve transforming organisms with a nucleic acid sequence encoding an insecticidal protein. In particular, the nucleic acid sequences are useful for preparing plants and microorganisms that possess insecticidal activity. Thus, transformed bacteria, plants, plant cells, plant tissues and seeds are provided. Compositions are insecticidal nucleic acids and proteins of bacterial species. The sequences find use in the construction of expression vectors for subsequent transformation into organisms of interest including plants, as probes for the isolation of other homologous (or partially homologous) genes. The pesticidal proteins find use in controlling, inhibiting growth or killing Lepidopteran, Coleopteran, Dipteran, fungal, Hemipteran and nematode pest populations and for producing compositions with insecticidal activity.
    Type: Application
    Filed: February 10, 2020
    Publication date: August 20, 2020
    Applicant: PIONEER HI-BRED INTERNATIONAL, INC.
    Inventors: HEATHER KOZY, JARRED KENNETH ORAL, UTE SCHELLENBERGER, JUN-ZHI WEI, WEIPING XIE, XIAOHONG ZHONG, GENHAI ZHU
  • Publication number: 20200267513
    Abstract: A multicast service transmission method includes: a management device that receives a first message; the management device based on the first message, instructs a gateway device to send a data packet of the first multicast service to the terminal device or the access network device, or the management device instructs a gateway device to stop sending a data packet of the first multicast service to the terminal device or the access network device.
    Type: Application
    Filed: May 7, 2020
    Publication date: August 20, 2020
    Inventors: Yuanping ZHU, Yada HUANG, Jun WANG
  • Patent number: 10748851
    Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first and a second semiconductor structures. The first semiconductor structure includes a first interconnect layer including first interconnects. At least one first interconnect is a first dummy interconnect. The first semiconductor structure further includes a first bonding layer including first bonding contacts. Each first interconnect is in contact with a respective first bonding contact. The second semiconductor structure includes a second interconnect layer including second interconnects. At least one second interconnect is a second dummy interconnect. The second semiconductor structure further includes a second bonding layer including second bonding contacts. Each second interconnect is in contact with a respective second bonding contact. The semiconductor device further includes a bonding interface between the first and second bonding layers.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: August 18, 2020
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen, Zi Qun Hua
  • Patent number: 10747605
    Abstract: Provided are a method and apparatus for providing a host memory controller write credits for write commands. A host memory controller coupled to a memory module over a bus determines whether a read data packet returned from the memory module indicates at least one write credit and increments a write credit counter in response to determining that the read data packet indicates at least one write credit.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: August 18, 2020
    Assignee: INTEL CORPORATION
    Inventors: Bill Nale, Jun Zhu, Tuan M. Quach
  • Patent number: 10748554
    Abstract: Embodiments facilitating audio source identification are provided. A computer-implemented method comprises: receiving, by a device operatively coupled to one or more processors, an audio signal under inspection; generating, by the device, an image of time-frequency spectrum of low frequency component and high frequency component of the audio signal; and identifying, by the device, a source of the audio signal based on the generated image and one or more patterns of time-frequency spectrum, wherein each of the one or more patterns is corresponding to low frequency feature and high frequency feature of a specific audio source.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: August 18, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jing Chang Huang, Guo Qiang Hu, Peng Ji, Jun Zhu
  • Patent number: 10750072
    Abstract: The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly comprises includes a circuit board, a photosensitive chip, and a packaging body. The photosensitive chip is connected to the circuit board. The packaging body is formed on the circuit board. A through hole is formed in the packaging body. The through hole is opposite to the photosensitive chip to provide a light channel of for the photosensitive chip. An inner side surface of the through hole comprises includes a first cambered surface, a connection surface, and a second cambered surface, and the first cambered surface and the second cambered surface are respectively connected to two ends of the connection surface.
    Type: Grant
    Filed: September 15, 2018
    Date of Patent: August 18, 2020
    Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.
    Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
  • Publication number: 20200258837
    Abstract: Embodiments of semiconductor structures including word line contact structures for three-dimensional memory devices and fabrication methods for forming word line contact structures are disclosed. The semiconductor structures include a staircase structure having a plurality of steps, and each step includes a conductive layer disposed over a dielectric layer. The semiconductor structures further include a barrier layer disposed over a portion of the conductive layer of each step. The semiconductor structures also include an etch-stop layer disposed on the barrier layer and an insulating layer disposed on the etch-stop layer. The semiconductor structures also include a plurality of conductive structures formed in the insulating layer and each conductive structure is formed on the conductive layer of each step.
    Type: Application
    Filed: May 1, 2020
    Publication date: August 13, 2020
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jifeng ZHU, Zhenyu LU, Jun CHEN, Si Ping HU, Xiaowang DAI, Lan YAO, Li Hong XIAO, A Man ZHENG, Kun BAO, Haohao YANG
  • Publication number: 20200258857
    Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first semiconductor structure, a second semiconductor structure, and a bonding interface between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure includes a substrate, a first device layer disposed on the substrate, and a first bonding layer disposed above the first device layer and including a first bonding contact. The second semiconductor structure includes a second device layer and a second bonding layer disposed below the second device layer and including a second bonding contact. The first bonding contact is in contact with the second bonding contact at the bonding interface. At least one of the first bonding contact or the second bonding contact is made of an indiffusible conductive material.
    Type: Application
    Filed: March 4, 2019
    Publication date: August 13, 2020
    Inventors: Zongliang Huo, Jun Liu, Jifeng Zhu, Jun Chen, Zi Qun Hua, Li Hong Xiao
  • Patent number: 10743185
    Abstract: Embodiments of the present invention provide a data transmission method and an apparatus. In the method, a communications node receives N spatial reuse parameters SRPs; the communications node determines, based on the received N SRPs, that the communications node can perform spatial reuse link transmission; and the communications node transmits data by using a spatial reuse link, and processes data transmission based on the spatial reuse link. Whether spatial reuse link transmission can be performed is determined based on the received SRPs, so as to reduce mutual interference between a primary link and the spatial reuse link during data transmission, and improve transmission quality.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: August 11, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zhengzheng Xiang, Jiyong Pang, Jun Zhu
  • Patent number: D894212
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: August 25, 2020
    Assignee: Shanghai Yu Wa Information Technology Co. Ltd.
    Inventors: Jun Wu, Weigang Zhu