Abstract: A backside illumination image sensor is provided. The backside illumination image sensor includes a plurality of different types of pixels, each pixel including a photodiode configured to accumulate photogenerated charges corresponding to light incident on a backside of a semiconductor substrate and a transfer transistor configured to transfer the photogenerated charges to a floating diffusion node; and a plurality of transfer lines disposed at a front side of the semiconductor substrate, the plurality of transfer lines connected to a gate of the transfer transistor of a respective one of the pixels, wherein transfer control signals respectively transmitted through the transfer lines produce different effective integration times in the pixels.

Abstract: A unit pixel for an image sensor includes an accumulation circuit configured to generate an accumulated dark current by accumulating a charge corresponding to a dark current during a time of flight (TOF), the accumulation circuit being optically shaded to generate the dark current, an output voltage generation circuit configured to generate and output an output voltage corresponding to the TOF based on a charge corresponding to the accumulated dark current, a control circuit configured to control an operation of the output voltage generation circuit based on a light signal that is input to the unit pixel after being reflected by an object, the light signal being emitted by a light source, and an initialization circuit configured to initialize the accumulation circuit at a predetermined cycle.

Abstract: A backside illuminated image sensor includes a semiconductor substrate having a front side and a backside facing each other, a light receiving element in the semiconductor substrate, the light receiving element being configured to convert light incident on the backside of the semiconductor substrate to an electrical signal, a first semiconductor layer on the front side of the semiconductor substrate, and a second semiconductor layer on the backside of the semiconductor substrate, the second semiconductor layer being connected to a voltage source.

Abstract: In one embodiment, the image sensor includes a first photodiode configured to convert an optical signal into a photocharge, a sensing node configured to store the photocharge of the first photodiode, and a circuit configured to selectively output an electrical signal corresponding to the photocharge at the sensing node on an output line. The circuit is connected to at least a first conductive contact, and the output line is disposed between the sensing node and the first conductive contact.

Abstract: An image sensor, an image processing apparatus including the same and an interpolation method of the image processing apparatus are provided. The image sensor includes a plurality of pixels that include a low-luminance pixel including a first photoelectric conversion device that accumulates a charge less than a predetermined reference value and a high-luminance pixel including a second photoelectric conversion device that accumulates a charge more than the predetermined reference value. Interpolation is carried out giving more weight to the low-luminance pixel at low luminance and giving more weight to the high-luminance pixel at high luminance, so that a higher SNR is obtained.

Abstract: A color filter array is provided. The color filter array includes a plurality of basic filter blocks arranged in all directions. Each of the basic filter blocks include one or more color filters. The color filters include a first type color filter that passes through all light without filtering it or has a higher light transmittance than a second type color filter, a third type color filter, and a fourth type color filter. The second through fourth color filters being a red, green or blue filter. Accordingly, the color filter array increases sensitivity to incident light or increases brightness of outgoing light.

Abstract: A unit pixel of a CMOS image sensor include a photodiode that transforms light to an electric charge, and accumulates the electric charge, and a plurality of transistors that generate an electric signal based on the accumulated electric charge. The photodiode has a slope shape based on incident angle of the light in a semiconductor substrate.

Abstract: A unit pixel of a CMOS image sensor include a photodiode that transforms light to an electric charge, and accumulates the electric charge, and a plurality of transistors that generate an electric signal based on the accumulated electric charge. The photodiode has a slope shape based on incident angle of the light in a semiconductor substrate.

Abstract: An image sensor includes a semiconductor substrate, a plurality of photo detecting elements and a backside protection pattern. The plurality of photo detecting elements may be formed in an upper portion of the semiconductor substrate. The plurality of photo detecting elements may be separate from each other. The backside protection pattern may be formed in a lower portion of the semiconductor substrate between the plurality of photo detecting elements.

Abstract: A pedestal level compensation method includes calculating a dark level difference error depending on temperature, calculating a pedestal level offset depending on an analog gain, and compensating a pedestal level according to the dark level difference error and the pedestal level offset.

Abstract: An image sensor including a deep guard ring and a noise blocking area and a method of manufacturing the same. The image sensor includes the deep guard ring and a deep P well surrounding the noise blocking area, thereby preventing crosstalk between adjacent pixels. In addition, an ion implantation layer is divided by the noise blocking area, so that substrate crosstalk is effectively eliminated.

Abstract: A backside-illuminated active pixel sensor array in which crosstalk between adjacent pixels is prevented, a method of manufacturing the backside-illuminated active pixel sensor array, and a backside-illuminated image sensor including the backside-illuminated active pixel sensor array are provided. The backside-illuminated active pixel sensor array includes a semiconductor substrate of a first conductive type that comprises a front surface and a rear surface, light-receiving devices for generating charges in response to light incident via the rear surface, and one or more pixel isolating layers for forming boundaries between pixels by being disposed between the adjacent light-receiving devices, a wiring layer disposed on the front surface of the semiconductor substrate, and a light filter layer disposed on the rear surface of the semiconductor substrate, wherein a thickness of the one or more pixel isolating layers decreases from a point in the semiconductor substrate toward the rear surface.

Abstract: A pixel cell includes a substrate, an epitaxial layer, and a photo converting device in the epitaxial layer. The epitaxial layer has a doping concentration profile of embossing shape, and includes a plurality of layers that are stacked on the substrate. The photo converting device does not include a neutral region that has a constant potential in the vertical direction. Therefore, the image sensor including the pixel cell has high quantization efficiency, and a crosstalk between photo-converting devices is decreased.

Abstract: An image sensor is provided. The image sensor includes an active pixel configured to pass wavelengths of light and generate an image signal corresponding to the passed wavelengths of light, a first optical black pixel configured to generate a first optical black signal by blocking the light by metal, and a second optical black pixel configured to generate a second optical black signal by blocking the light by a light blocking element.

Abstract: In a method of driving an image sensor, incident light is converted into electric charges in a photoelectric conversion region during a first operation mode. At least one of collected electric charges and overflowed electric charges is accumulated in a floating diffusion region based on illuminance of the incident light. The collected electric charges indicate electric charges that are collected in the photoelectric conversion region. The overflowed electric charges indicate electric charges that have overflowed from the photoelectric conversion region.

Abstract: An image pickup device includes a pixel array including a plurality of photo sensitive devices and a color filter array including a plurality of color filters each disposed above a corresponding one of the plurality of photo sensitive devices. The color filters include a first type color filter formed on a glass substrate to filter light to pass a first spectrum and a second type color filter stacked on at least part of the first type color filter to filter light to pass a second spectrum. Accordingly, fabrication of a color filter array can be simplified and a color filter array having a small lay out can be fabricated.

Abstract: A pixel of an image sensor includes a color filter configured to pass visible wavelengths, and an infrared cut-off filter disposed on the color filter configured to cut off infrared wavelengths.

Abstract: An image sensor cell, wherein at least one of a plurality of transistors included in image sensor cell is a recess transistor having a channel region recessed into a substrate. The image sensor cell includes an image charge generating unit for generating an image charge corresponding to an image signal, and an image charge converting unit for converting the image charge into an electrical signal, wherein at least one of a plurality of transistors included in the image charge converting unit is a recess transistor including a channel region that is recessed into a substrate.

Abstract: A unit pixel array of an image sensor includes a semiconductor substrate having a plurality of unit pixels, an interlayer insulating layer disposed on a front side of the semiconductor substrate, a plurality of color filters disposed on a back side of the semiconductor substrate, a plurality of light path converters, each of the light path converters being disposed adjacent to at least one color filter and having a pair of slanted side edges extending from opposing ends of a horizontal bottom edge, and a plurality of micro lenses disposed on the color filters.

Abstract: A method of manufacturing a backside illuminated image sensor, including forming a first isolation layer in a first semiconductor layer, such that the first isolation layer defines pixels of a pixel array in the first semiconductor layer, forming a second semiconductor layer on a first surface of the first semiconductor layer, forming a second isolation layer in the second semiconductor layer, such that the second isolation layer defines active device regions in the second semiconductor layer, forming photo detectors and circuit devices by implanting impurities into a first surface of the second semiconductor layer, the first surface of the second semiconductor layer facing away from the first semiconductor layer, forming a wiring layer on the first surface of the second semiconductor layer, and forming a light filter layer on a second surface of the first semiconductor layer.