Patents by Inventor Jung-chan Lee
Jung-chan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240146006Abstract: This disclosure relates to a connector comprising a first RF contact; a second RF contact spaced apart from the first RF contact in a first axis direction; an insulation part; and a cover shell, wherein the first RF contact includes a (1-1)th RF linker member for connecting with an RF contact of the other connector; a (1-2)th RF linker member spaced apart from the (1-1)th RF linker member on the basis of a second axis direction perpendicular to the first; and a first RF linker member arranged between the (1-1)th RF linker member and the (1-2)th RF linker member on the basis of the second axis direction, the insulation part includes a first RF inspection window arranged between the (1-1)th RF linker member and the (1-2)th RF linker member on the basis of the second axis direction, and the first RF linker member is exposed through the first RF inspection window.Type: ApplicationFiled: March 20, 2022Publication date: May 2, 2024Inventors: Su Chan LEE, Kyung Hae CHOI, Jung Hoon CHOI, Hyun Joo HWANG
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Publication number: 20240141118Abstract: A surface-treated inorganic nanoparticle includes a core including Mania (TiO2); a shell surrounding the core, and including zirconia(ZrO2); and a dispersant including a phosphate functional group, and connected to the shell,Type: ApplicationFiled: February 7, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Chan PARK, Chang Hyun YOON, Jung Hyun LEE, Eun Jung LIM, Young O KIM
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Publication number: 20240134478Abstract: A method of driving an electronic device includes displaying a plurality of fingerprint recognition icons on a display device configured to perform fingerprint recognition, and releasing a lock state of the display device through a fingerprint authentication process upon determining at least one first fingerprint recognition icon among the plurality of fingerprint recognition icons is touched. The plurality of fingerprint recognition icons include at least one first fingerprint recognition icon configured to support the fingerprint recognition and at least one second fingerprint recognition icon configured to not support the fingerprint recognition.Type: ApplicationFiled: September 7, 2023Publication date: April 25, 2024Inventors: Byung Han YOO, Jung Woo PARK, Hyang A PARK, Dae Young LEE, Hyun Dae LEE, Kang Bin JO, Sang Hwan CHO, Sung-Chan JO
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Patent number: 11967862Abstract: In a driving system, first and second inverters are connected to a driving motor, one end of a stator winding through which 3-phase current flows is connected to an output line of the first inverter, and the other end of the stator winding is connected to an output line of the second inverter. A winding pattern of the driving motor includes: coils wound in slots defined in the stator and to which 3-phase current is applied; coils wound on innermost and outermost sides based on a direction toward a rotating shaft of the driving motor in the slots, and being energized by different AC phases; and coils disposed between a first coil located on the outermost side and a second coil located on the innermost side, and being energized by the same AC phases as those of the first and second coils.Type: GrantFiled: November 16, 2021Date of Patent: April 23, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Woong Chan Chae, Jung Shik Kim, Jong Hoon Lee, Byung Kwan Son, Sang Hoon Moon, Young Jin Shin
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Patent number: 11955531Abstract: An integrated circuit device includes a fin-type active region protruding from a top surface of a substrate and extending in a first direction parallel to the top surface of the substrate, a gate structure intersecting with the fin-type active region and extending on the substrate in a second direction perpendicular to the first direction, a source/drain region on a first side of the gate structure, a first contact structure on the source/drain region, and a contact capping layer on the first contact structure. A top surface of the first contact structure has a first width in the first direction, a bottom surface of the contact capping layer has a second width greater than the first width stated above in the first direction, and the contact capping layer includes a protruding portion extending outward from a sidewall of the first contact structure.Type: GrantFiled: February 27, 2023Date of Patent: April 9, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Dae-young Kwak, Ji-ye Kim, Jung-hwan Chun, Min-chan Gwak, Dong-hyun Roh, Jin-wook Lee, Sang-jin Hyun
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Publication number: 20240009381Abstract: Provided is a drug hypersensitivity prevention system. A drug hypersensitivity prevention system according to an embodiment of the present application may comprise: a first fluid storage unit 10; a second fluid storage unit 20; a control device 30 including a first pump 31 installed in a discharge line connected to the first fluid storage unit 10 so as to control an amount of a first fluid discharged from the first fluid storage unit 10, and a second pump 32 installed in a discharge line connected to the second fluid storage unit 20 so as to control an amount of a second fluid discharged from the second fluid storage unit 20; a mixing unit 40 in which the first fluid discharged from the first fluid storage unit 10 and the second fluid discharged from the second fluid storage unit 20 are mixed; a pouch 50 connected to the mixing unit 40; and a catheter 60 connected to the mixing unit 40.Type: ApplicationFiled: September 17, 2021Publication date: January 11, 2024Inventors: Hye-Ryun KANG, Jung Chan LEE, Kyoung Jin LEE, Byeong Chic CHO, Sung Ho KO
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Patent number: 11804372Abstract: A method of depositing a silicon-containing material is disclosed. Some embodiments of the disclosure provide films which fill narrow CD features without a seam or void. Some embodiments of the disclosure provide films which form conformally on features with wider CD. Embodiments of the disclosure also provide superior quality films with low roughness, low defects and advantageously low deposition rates.Type: GrantFiled: November 9, 2021Date of Patent: October 31, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Jung Chan Lee, Praket P. Jha, Jingmei Liang, Jinrui Guo, Wenhui Li
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Publication number: 20230030436Abstract: Embodiments of the present disclosure generally relate to methods for gap fill deposition and film densification on microelectronic devices. The method includes forming an oxide layer containing silicon oxide and having an initial wet etch rate (WER) over features disposed on the substrate, and exposing the oxide layer to a first plasma treatment to produce a treated oxide layer. The first plasma treatment includes generating a first plasma by a first RF source and directing the first plasma to the oxide layer by a DC bias. The method also includes exposing the treated oxide layer to a second plasma treatment to produce a densified oxide layer. The second plasma treatment includes generating a second plasma by top and side RF sources and directing the second plasma to the treated oxide layer without a bias. The densified oxide layer has a final WER of less than one-half of the initial WER.Type: ApplicationFiled: July 30, 2021Publication date: February 2, 2023Inventors: Jung Chan LEE, Mun Kyu PARK, Jun LEE, Euhngi LEE, Kyu-Ha SHIM, Deven Matthew Raj MITTAL, Sungho JO, Timothy MILLER, Jingmei LIANG, Praket Prakash JHA, Sanjay G. KAMATH
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Publication number: 20220375870Abstract: Systems, apparatuses, and methods may provide for technology that gap-fills stairwells for memory devices. The memory device is manufactured by forming a liner film on a trench of a stairwell layer of the memory device; depositing a doped silicon dioxide film on the liner film, wherein doping of the doped silicon dioxide film is performed during the deposition; and performing a pressurized and steamed anneal on the doped silicon dioxide film deposited on the liner film to form a reflowed doped silicon dioxide film.Type: ApplicationFiled: August 5, 2022Publication date: November 24, 2022Inventors: Jung Chan Lee, Agus Tjandra, Ebony Mays
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Publication number: 20220223410Abstract: A method of depositing a silicon-containing material is disclosed. Some embodiments of the disclosure provide films which fill narrow CD features without a seam or void. Some embodiments of the disclosure provide films which form conformally on features with wider CD. Embodiments of the disclosure also provide superior quality films with low roughness, low defects and advantageously low deposition rates.Type: ApplicationFiled: November 9, 2021Publication date: July 14, 2022Applicant: Applied Materials, Inc.Inventors: Jung Chan Lee, Praket P. Jha, Jingmei Liang, Jinrui Guo, Wenhui Li
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Patent number: 11170994Abstract: A method of depositing a silicon-containing material is disclosed. Some embodiments of the disclosure provide films which fill narrow CD features without a seam or void. Some embodiments of the disclosure provide films which form conformally on features with wider CD. Embodiments of the disclosure also provide superior quality films with low roughness, low defects and advantageously low deposition rates.Type: GrantFiled: January 12, 2021Date of Patent: November 9, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Jung Chan Lee, Praket P. Jha, Jingmei Liang, Jinrui Guo, Wenhui Li
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Patent number: 11152248Abstract: Embodiments disclosed herein relate to cluster tools for forming and filling trenches in a substrate with a flowable dielectric material. In one or more embodiments, a cluster tool for processing a substrate contains a load lock chamber, a first vacuum transfer chamber coupled to the load lock chamber, a second vacuum transfer chamber, a cooling station disposed between the first vacuum transfer chamber and the second vacuum transfer chamber, a factory interface coupled to the load lock chamber, a plurality of first processing chambers coupled to the first vacuum transfer chamber, wherein each of the first processing chambers is a deposition chamber capable of performing a flowable layer deposition, and a plurality of second processing chambers coupled to the second vacuum transfer chamber, wherein each of the second processing chambers is a plasma chamber capable of performing a plasma curing process.Type: GrantFiled: May 26, 2020Date of Patent: October 19, 2021Assignee: Applied Materials, Inc.Inventors: Jingmei Liang, Yong Sun, Jinrui Guo, Praket P. Jha, Jung Chan Lee, Tza-Jing Gung, Mukund Srinivasan
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Publication number: 20210280451Abstract: Provided are methods of depositing a film in high aspect ratio (AR) structures with small dimensions. The method provides flowable deposition for seamless gap-fill, UV cure for increasing film density, film conversion to silicon oxide at low temperature, and film densification by low temperature inductively coupled plasma (ICP) treatment (<400° C.).Type: ApplicationFiled: March 4, 2020Publication date: September 9, 2021Applicant: Applied Materials, Inc.Inventors: Jung Chan Lee, Praket P. Jha, Jingmei Liang, Shuchi Sunil Ojha
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Patent number: 11071686Abstract: An automatic cardiopulmonary resuscitation device includes a movable chest compressor for repeatedly pressing a patient's chest at a preset depth and cycle, a cardiac output measurement unit for measuring a cardiac output of the patient in accordance with the pressurization of the chest compressor and a processor for changing pressing locations by performing control such that the chest compressor moves according to a preset method.Type: GrantFiled: January 26, 2017Date of Patent: July 27, 2021Assignee: Seoul National University R&DB FoundationInventors: Gil Joon Suh, Woon Yong Kwon, Kyung Su Kim, Sang Hoon Na, Jaeheung Park, Jung Chan Lee, Yoon Sun Jung, Kyoung Min You, Min Ji Park, Taegyun Kim, Jung-In Ko, Jeeseop Kim, Jaesug Jung, Sanghyun Kim, Byeong Wook Yoo, Byeongtak Lee, Woo Sang Cho, Jin Woo Choi
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Patent number: 10947575Abstract: Provided are a rapid antimicrobial susceptibility test, based on an analysis of changes in morphology and growth pattern of a microbial cell under different concentrations of various antimicrobial agents, and an automated cell image analysis system therefor. The antimicrobial susceptibility test is rapidly performed based on an analysis of changes in morphology and growth pattern of a microbial cell under different concentrations of various antimicrobial agents, and this makes it possible to obtain highly reliable test results faster by six to seven times than the standard method recommended by Clinical and Laboratory Standards Institute (CLSI).Type: GrantFiled: November 27, 2018Date of Patent: March 16, 2021Assignee: QUANTAMATRIX INC.Inventors: Yong-Gyun Jung, Eun-Geun Kim, Jung Heon Yoo, Sunghoon Kwon, Jungil Choi, Hee Chan Kim, Jung Chan Lee, Eui Jong Kim, Sang Hoon Song, Sei Ick Joo, Ji Soo Lee
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Publication number: 20200388483Abstract: A method of post-treating a silicon nitride (SiN)-based dielectric film formed on a surface of a substrate includes positioning a substrate having a silicon nitride (SiN)-based dielectric film formed thereon in a processing chamber, and exposing the silicon nitride (SiN)-based dielectric film to helium-containing high-energy low-dose plasma in the processing chamber. Energy of helium ions in the helium-containing high-energy low-dose plasma is between 1 eV and 3.01 eV, and flux density of the helium ions in the helium-containing high-energy low-dose plasma is between 5×1015 ions/cm2·sec and 1.37×1016 ions/cm2·sec.Type: ApplicationFiled: June 4, 2020Publication date: December 10, 2020Inventors: Yong SUN, Jung Chan LEE, Shuchi Sunil OJHA, Praket Prakash JHA, Jingmei LIANG
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Publication number: 20200286773Abstract: Embodiments disclosed herein relate to cluster tools for forming and filling trenches in a substrate with a flowable dielectric material. In one or more embodiments, a cluster tool for processing a substrate contains a load lock chamber, a first vacuum transfer chamber coupled to the load lock chamber, a second vacuum transfer chamber, a cooling station disposed between the first vacuum transfer chamber and the second vacuum transfer chamber, a factory interface coupled to the load lock chamber, a plurality of first processing chambers coupled to the first vacuum transfer chamber, wherein each of the first processing chambers is a deposition chamber capable of performing a flowable layer deposition, and a plurality of second processing chambers coupled to the second vacuum transfer chamber, wherein each of the second processing chambers is a plasma chamber capable of performing a plasma curing process.Type: ApplicationFiled: May 26, 2020Publication date: September 10, 2020Inventors: Jingmei LIANG, Yong SUN, Jinrui GUO, Praket P. JHA, Jung Chan LEE, Tza-Jing GUNG, Mukund SRINIVASAN
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Patent number: 10707116Abstract: Implementations disclosed herein relate to methods for forming and filling trenches in a substrate with a flowable dielectric material. In one implementation, the method includes subjecting a substrate having at least one trench to a deposition process to form a flowable layer over a bottom surface and sidewall surfaces of the trench in a bottom-up fashion until the flowable layer reaches a predetermined deposition thickness, subjecting the flowable layer to a first curing process, the first curing process being a UV curing process, subjecting the UV cured flowable layer to a second curing process, the second curing process being a plasma or plasma-assisted process, and performing sequentially and repeatedly the deposition process, the first curing process, and the second curing process until the plasma cured flowable layer fills the trench and reaches a predetermined height over a top surface of the trench.Type: GrantFiled: May 11, 2018Date of Patent: July 7, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Jingmei Liang, Yong Sun, Jinrui Guo, Praket P. Jha, Jung Chan Lee, Tza-Jing Gung, Mukund Srinivasan
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Patent number: 10702642Abstract: The present invention relates to a blood pump. The blood pump according to the present invention includes: a housing including an inlet, through which blood flows, at an upper part of the housing and an outlet, through which the blood is discharged, along an edge of the housing; an impeller part, which is rotatable and disposed inside the housing, including a plurality of blades on the surface thereof so as to move the blood flowing in through the inlet toward the outlet by using a centrifugal force; a rotary shaft member disposed to penetrate the center part of the impeller part so as to support the impeller part to be rotatable which moves the blood to the lower part thereof; and a magnetic body disposed on the impeller part for rotating the impeller part in a predetermined direction according to a change in a magnetic field outside the housing.Type: GrantFiled: March 20, 2017Date of Patent: July 7, 2020Assignee: SNU R&DB FOUNDATIONInventors: Jung Chan Lee, Hee Chan Kim
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Publication number: 20190136289Abstract: Provided are a rapid antimicrobial susceptibility test, based on an analysis of changes in morphology and growth pattern of a microbial cell under different concentrations of various antimicrobial agents, and an automated cell image analysis system therefor. The antimicrobial susceptibility test is rapidly performed based on an analysis of changes in morphology and growth pattern of a microbial cell under different concentrations of various antimicrobial agents, and this makes it possible to obtain highly reliable test results faster by six to seven times than the standard method recommended by Clinical and Laboratory Standards Institute (CLSI).Type: ApplicationFiled: November 27, 2018Publication date: May 9, 2019Inventors: Yong-Gyun JUNG, Eun-Geun KIM, Jung Heon YOO, Sunghoon KWON, Jungil CHOI, Hee Chan KIM, Jung Chan LEE, Eui Jong KIM, Sang Hoon SONG, Sei Ick JOO, Ji Soo LEE