Patents by Inventor Jung-Chin Wu
Jung-Chin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250031466Abstract: An optical sensing apparatus including: a substrate including a first material; an absorption region including a second material different from the first material; an amplification region formed in the substrate and configured to collect at least a portion of the photo-carriers from the absorption region and to amplify the portion of the photo-carriers; an interface-dopant region formed in the substrate between the absorption region and the amplification region; a buffer layer formed between the absorption region and the interface-dopant region; one or more field-control regions formed between the absorption region and the interface-dopant region and at least partially surrounding the buffer layer; and a buried-dopant region formed in the substrate and separated from the absorption region, where the buried-dopant region is configured to collect at least a portion of the amplified portion of the photo-carriers from the amplification region.Type: ApplicationFiled: October 2, 2024Publication date: January 23, 2025Inventors: Yen-Cheng Lu, Yu-Hsuan Liu, Jung-Chin Chiang, Yun-Chung Na, Tsung-Ting Wu, Zheng-Shun Liu, Chou-Yun Hsu
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Patent number: 12122123Abstract: A composite material structure, including an outer layer, an inner layer, and a middle layer, is provided. The outer layer includes a metallic material. The inner layer includes a fiber material and a resin material. The outer layer has a first thickness, the inner layer has a second thickness, and the first thickness is different from the second thickness. The middle layer includes an adhesive material and is disposed between the outer layer and the inner layer. Two opposite surfaces of the middle layer are respectively in direct contact with the outer layer and the inner layer. A manufacturing method of the composite material structure is also provided.Type: GrantFiled: May 23, 2023Date of Patent: October 22, 2024Assignee: COMPAL ELECTRONICS, INC.Inventors: Han-Ching Huang, Sheng-Hung Lee, Jung-Chin Wu, Kuo-Nan Ling, Chih-Wen Chiang, Chien-Chu Chen
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Publication number: 20230405973Abstract: A composite material structure, including an outer layer, an inner layer, and a middle layer, is provided. The outer layer includes a metallic material. The inner layer includes a fiber material and a resin material. The outer layer has a first thickness, the inner layer has a second thickness, and the first thickness is different from the second thickness. The middle layer includes an adhesive material and is disposed between the outer layer and the inner layer. Two opposite surfaces of the middle layer are respectively in direct contact with the outer layer and the inner layer. A manufacturing method of the composite material structure is also provided.Type: ApplicationFiled: May 23, 2023Publication date: December 21, 2023Applicant: COMPAL ELECTRONICS, INC.Inventors: Han-Ching Huang, Sheng-Hung Lee, Jung-Chin Wu, Kuo-Nan Ling, Chih-Wen Chiang, Chien-Chu Chen
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Patent number: 11794447Abstract: A composite material structure includes a first fiber layer, a second fiber layer, and a third fiber layer. The first fiber layer is composed of a first long fiber and a first resin material. The second fiber layer is composed of a second long fiber and a second resin material. The third fiber layer is disposed between the first fiber layer and the second fiber layer. The third fiber layer is composed of a short fiber and a third resin material. A length of the first long fiber and a length of the second long fiber are both greater than a length of the short fiber, and the length of the short fiber is less than or equal to 25 mm.Type: GrantFiled: April 18, 2022Date of Patent: October 24, 2023Assignee: COMPAL ELECTRONICS, INC.Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Sheng-Hung Lee
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Patent number: 11478966Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.Type: GrantFiled: December 23, 2019Date of Patent: October 25, 2022Assignee: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
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Publication number: 20220332087Abstract: A composite material structure includes a first fiber layer, a second fiber layer, and a third fiber layer. The first fiber layer is composed of a first long fiber and a first resin material. The second fiber layer is composed of a second long fiber and a second resin material. The third fiber layer is disposed between the first fiber layer and the second fiber layer. The third fiber layer is composed of a short fiber and a third resin material. A length of the first long fiber and a length of the second long fiber are both greater than a length of the short fiber, and the length of the short fiber is less than or equal to 25 mm.Type: ApplicationFiled: April 18, 2022Publication date: October 20, 2022Applicant: COMPAL ELECTRONICS, INC.Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Sheng-Hung Lee
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Publication number: 20210031489Abstract: The present disclosure provides a composite material including a first thermoplastic adhesive layer made of a first thermoplastic resin, a second thermoplastic adhesive layer made of a second thermoplastic resin, and a core layer. The core layer has a first surface and a second surface, wherein the first surface is bonded to the first thermoplastic adhesive layer, and the second surface is bonded to the second thermoplastic adhesive layer. The core layer has a plurality of cavities, wherein each of the plurality of cavities has a pore diameter smaller than a thickness of the core layer. The first thermoplastic resin and the second thermoplastic resin are respectively adapted to be filled in a part of the plurality of cavities adjacent to the first surface of the core layer and a part of the plurality of cavities adjacent to the second surface of the core layer by heating.Type: ApplicationFiled: October 20, 2019Publication date: February 4, 2021Applicant: COMPAL ELECTRONICS, INC.Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Po-An Lin
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Publication number: 20200130243Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.Type: ApplicationFiled: December 23, 2019Publication date: April 30, 2020Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
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Publication number: 20190025882Abstract: A casing including a plate member and a resin member is provided. The plate member has a bottom surface and includes a first surface layer, a second surface layer and a core layer. The first surface layer has a plurality of first through holes and disposed on at least one edge of the first surface layer. The first surface layer and the second surface layer are oppositely disposed on two sides of the core layer. The resin member covers edges and the bottom surface of the plate member and has an extension portion. The extension portion extends between the first surface layer and the second surface layer and adjacent to the core layer. The extension portion further extends to the plurality of first through holes. A manufacturing method of the casing is also provided.Type: ApplicationFiled: July 16, 2018Publication date: January 24, 2019Inventors: Han-Ching Huang, Po-An Lin, Jung-Chin Wu, Kuo-Nan Ling
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Patent number: 9242426Abstract: A composite plate structure including a fiber composite sheet, a metal layer, and a resin layer is provided. The fiber composite sheet includes a first fiber layer, a core layer, and a second fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer. The metal layer is disposed on the fiber composite sheet and has at least one opening. A portion of the second fiber layer is located in the opening. The resin layer is disposed on the metal layer. In addition, a manufacturing method of the composite plate structure is also provided.Type: GrantFiled: October 18, 2012Date of Patent: January 26, 2016Assignee: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang, Chih-Wen Chiang, Yen-Ling Liu
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Publication number: 20150366088Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.Type: ApplicationFiled: May 18, 2015Publication date: December 17, 2015Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
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Publication number: 20140205699Abstract: A production method of three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured by implementing a plurality of heat treatments thereon. A workpiece of three-dimensional pattern and a production device of three-dimensional pattern are also disclosed.Type: ApplicationFiled: March 21, 2014Publication date: July 24, 2014Applicant: COMPAL ELECTRONICS, INC.Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
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Publication number: 20140178636Abstract: Provided is a composite material including a first surface layer, a second surface layer, and a core layer. The first surface layer includes a first fiber material layer and a first resin impregnated therein. The second surface layer includes a second fiber material layer and a second resin impregnated therein. The core layer is disposed between the first surface layer and the second surface layer and has a plurality of through holes, wherein the first resin and the second resin penetrate into each of the through holes, combining with each other, and forming a connecting column in each of the through holes.Type: ApplicationFiled: December 13, 2013Publication date: June 26, 2014Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang
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Patent number: 8721824Abstract: A production method of three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured by implementing a plurality of heat treatments thereon. A workpiece of three-dimensional pattern and a production device of three-dimensional pattern are also disclosed.Type: GrantFiled: September 14, 2010Date of Patent: May 13, 2014Assignee: Compal Electronics, Inc.Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
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Patent number: 8681502Abstract: A shell structure suitable for an electronic device is provided. The electronic device has a heat generating element. The shell structure includes a core layer, a first material layer, and a second material layer. The core layer includes a thermal insulating area and a thermal conducting area. The core layer has first and second surfaces opposite to each other. The first material layer is configured on the first surface. The second material layer is configured on the second surface. The thermal insulating area is aligned to the heat generating element, and the shell structure covers the heat generating element, such that heat generated by the heat generating element is transferred to the first material layer through the second material layer and the heat conducting area to perform heat dissipation, and a position of the first material layer aligned to the heat generating element is prevented from generating a heat point.Type: GrantFiled: December 21, 2011Date of Patent: March 25, 2014Assignee: Compal Electronics, Inc.Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Wan-Li Chuang
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Patent number: 8580485Abstract: A method for forming a three-dimensional pattern includes following steps. A shaped workpiece having an inner surface and an outer surface is provided, and a first photoresist layer and a second photoresist layer are respectively formed on the outer surface and the inner surface. The shaped workpiece is placed on a transparent fixture. The first photoresist layer and the second photoresist layer are exposed and developed, such that the first photoresist layer forms a patterned photoresist layer, and the second photoresist layer forms an etching protection layer. The shaped workpiece is etched to form the three-dimensional pattern on the outer surface of the shaped workpiece. The patterned photoresist layer and the etching protection layer are removed.Type: GrantFiled: November 12, 2010Date of Patent: November 12, 2013Assignee: Compal Electronics, Inc.Inventors: Chien-Min Chang, Jung-Chin Wu, Wan-Li Chuang
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Patent number: 8574702Abstract: A shell structure includes a composite material layer and a second material layer is provided. The composite material layer includes a woven layer and a first material layer. The woven layer has a first surface and a second surface opposite to each other. The first material layer is located on the first surface and has a plurality of through-holes. The second material layer is disposed on the first material layer and has a plurality of extending-portions adapted to be combined with the woven layer and fix the second material layer and the composite material layer to each other. In addition, a manufacturing method for shell structure of electronic device is also provided.Type: GrantFiled: December 21, 2011Date of Patent: November 5, 2013Assignee: Compal Electronics, Inc.Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Chih-Wen Chiang, Chien-Min Chang
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Publication number: 20130108830Abstract: A composite plate structure including a fiber composite sheet, a metal layer, and a resin layer is provided. The fiber composite sheet includes a first fiber layer, a core layer, and a second fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer. The metal layer is disposed on the fiber composite sheet and has at least one opening. A portion of the second fiber layer is located in the opening. The resin layer is disposed on the metal layer. In addition, a manufacturing method of the composite plate structure is also provided.Type: ApplicationFiled: October 18, 2012Publication date: May 2, 2013Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang, Chih-Wen Chiang, Yen-Ling Liu
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Publication number: 20130106262Abstract: A housing having a flat portion and a curved portion is provided. The housing includes an upper material layer, a lower material layer and a core layer. The core layer is disposed between the upper material layer and the lower material layer. The core layer has a first material region and a second material region. The first material region is corresponding to the flat portion. The second material region is corresponding to the curved portion. A material of the first material region is different from a material of the second material region.Type: ApplicationFiled: October 4, 2012Publication date: May 2, 2013Inventors: Han-Ching Huang, Jung-Chin Wu, Po-An Lin
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Publication number: 20120318444Abstract: A method for manufacturing a three-dimensional workpiece is provided. In this method, a ductile plate, a core layer and a prepreg are combined to form a sandwich structure. The core layer is located between the ductile plate and the prepreg. The sandwich structure is shaped to be the three-dimensional sandwich structure. The sandwich structure is heated to cure the prepreg.Type: ApplicationFiled: June 13, 2012Publication date: December 20, 2012Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang