Patents by Inventor Jung-Chin Wu

Jung-Chin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230405973
    Abstract: A composite material structure, including an outer layer, an inner layer, and a middle layer, is provided. The outer layer includes a metallic material. The inner layer includes a fiber material and a resin material. The outer layer has a first thickness, the inner layer has a second thickness, and the first thickness is different from the second thickness. The middle layer includes an adhesive material and is disposed between the outer layer and the inner layer. Two opposite surfaces of the middle layer are respectively in direct contact with the outer layer and the inner layer. A manufacturing method of the composite material structure is also provided.
    Type: Application
    Filed: May 23, 2023
    Publication date: December 21, 2023
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Han-Ching Huang, Sheng-Hung Lee, Jung-Chin Wu, Kuo-Nan Ling, Chih-Wen Chiang, Chien-Chu Chen
  • Patent number: 11794447
    Abstract: A composite material structure includes a first fiber layer, a second fiber layer, and a third fiber layer. The first fiber layer is composed of a first long fiber and a first resin material. The second fiber layer is composed of a second long fiber and a second resin material. The third fiber layer is disposed between the first fiber layer and the second fiber layer. The third fiber layer is composed of a short fiber and a third resin material. A length of the first long fiber and a length of the second long fiber are both greater than a length of the short fiber, and the length of the short fiber is less than or equal to 25 mm.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: October 24, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Sheng-Hung Lee
  • Patent number: 11478966
    Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: October 25, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
  • Publication number: 20220332087
    Abstract: A composite material structure includes a first fiber layer, a second fiber layer, and a third fiber layer. The first fiber layer is composed of a first long fiber and a first resin material. The second fiber layer is composed of a second long fiber and a second resin material. The third fiber layer is disposed between the first fiber layer and the second fiber layer. The third fiber layer is composed of a short fiber and a third resin material. A length of the first long fiber and a length of the second long fiber are both greater than a length of the short fiber, and the length of the short fiber is less than or equal to 25 mm.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 20, 2022
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Sheng-Hung Lee
  • Publication number: 20210031489
    Abstract: The present disclosure provides a composite material including a first thermoplastic adhesive layer made of a first thermoplastic resin, a second thermoplastic adhesive layer made of a second thermoplastic resin, and a core layer. The core layer has a first surface and a second surface, wherein the first surface is bonded to the first thermoplastic adhesive layer, and the second surface is bonded to the second thermoplastic adhesive layer. The core layer has a plurality of cavities, wherein each of the plurality of cavities has a pore diameter smaller than a thickness of the core layer. The first thermoplastic resin and the second thermoplastic resin are respectively adapted to be filled in a part of the plurality of cavities adjacent to the first surface of the core layer and a part of the plurality of cavities adjacent to the second surface of the core layer by heating.
    Type: Application
    Filed: October 20, 2019
    Publication date: February 4, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Po-An Lin
  • Publication number: 20200130243
    Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 30, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
  • Publication number: 20190025882
    Abstract: A casing including a plate member and a resin member is provided. The plate member has a bottom surface and includes a first surface layer, a second surface layer and a core layer. The first surface layer has a plurality of first through holes and disposed on at least one edge of the first surface layer. The first surface layer and the second surface layer are oppositely disposed on two sides of the core layer. The resin member covers edges and the bottom surface of the plate member and has an extension portion. The extension portion extends between the first surface layer and the second surface layer and adjacent to the core layer. The extension portion further extends to the plurality of first through holes. A manufacturing method of the casing is also provided.
    Type: Application
    Filed: July 16, 2018
    Publication date: January 24, 2019
    Inventors: Han-Ching Huang, Po-An Lin, Jung-Chin Wu, Kuo-Nan Ling
  • Patent number: 9242426
    Abstract: A composite plate structure including a fiber composite sheet, a metal layer, and a resin layer is provided. The fiber composite sheet includes a first fiber layer, a core layer, and a second fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer. The metal layer is disposed on the fiber composite sheet and has at least one opening. A portion of the second fiber layer is located in the opening. The resin layer is disposed on the metal layer. In addition, a manufacturing method of the composite plate structure is also provided.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: January 26, 2016
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang, Chih-Wen Chiang, Yen-Ling Liu
  • Publication number: 20150366088
    Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.
    Type: Application
    Filed: May 18, 2015
    Publication date: December 17, 2015
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
  • Publication number: 20140205699
    Abstract: A production method of three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured by implementing a plurality of heat treatments thereon. A workpiece of three-dimensional pattern and a production device of three-dimensional pattern are also disclosed.
    Type: Application
    Filed: March 21, 2014
    Publication date: July 24, 2014
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
  • Publication number: 20140178636
    Abstract: Provided is a composite material including a first surface layer, a second surface layer, and a core layer. The first surface layer includes a first fiber material layer and a first resin impregnated therein. The second surface layer includes a second fiber material layer and a second resin impregnated therein. The core layer is disposed between the first surface layer and the second surface layer and has a plurality of through holes, wherein the first resin and the second resin penetrate into each of the through holes, combining with each other, and forming a connecting column in each of the through holes.
    Type: Application
    Filed: December 13, 2013
    Publication date: June 26, 2014
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang
  • Patent number: 8721824
    Abstract: A production method of three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured by implementing a plurality of heat treatments thereon. A workpiece of three-dimensional pattern and a production device of three-dimensional pattern are also disclosed.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: May 13, 2014
    Assignee: Compal Electronics, Inc.
    Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
  • Patent number: 8681502
    Abstract: A shell structure suitable for an electronic device is provided. The electronic device has a heat generating element. The shell structure includes a core layer, a first material layer, and a second material layer. The core layer includes a thermal insulating area and a thermal conducting area. The core layer has first and second surfaces opposite to each other. The first material layer is configured on the first surface. The second material layer is configured on the second surface. The thermal insulating area is aligned to the heat generating element, and the shell structure covers the heat generating element, such that heat generated by the heat generating element is transferred to the first material layer through the second material layer and the heat conducting area to perform heat dissipation, and a position of the first material layer aligned to the heat generating element is prevented from generating a heat point.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: March 25, 2014
    Assignee: Compal Electronics, Inc.
    Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Wan-Li Chuang
  • Patent number: 8580485
    Abstract: A method for forming a three-dimensional pattern includes following steps. A shaped workpiece having an inner surface and an outer surface is provided, and a first photoresist layer and a second photoresist layer are respectively formed on the outer surface and the inner surface. The shaped workpiece is placed on a transparent fixture. The first photoresist layer and the second photoresist layer are exposed and developed, such that the first photoresist layer forms a patterned photoresist layer, and the second photoresist layer forms an etching protection layer. The shaped workpiece is etched to form the three-dimensional pattern on the outer surface of the shaped workpiece. The patterned photoresist layer and the etching protection layer are removed.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: November 12, 2013
    Assignee: Compal Electronics, Inc.
    Inventors: Chien-Min Chang, Jung-Chin Wu, Wan-Li Chuang
  • Patent number: 8574702
    Abstract: A shell structure includes a composite material layer and a second material layer is provided. The composite material layer includes a woven layer and a first material layer. The woven layer has a first surface and a second surface opposite to each other. The first material layer is located on the first surface and has a plurality of through-holes. The second material layer is disposed on the first material layer and has a plurality of extending-portions adapted to be combined with the woven layer and fix the second material layer and the composite material layer to each other. In addition, a manufacturing method for shell structure of electronic device is also provided.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: November 5, 2013
    Assignee: Compal Electronics, Inc.
    Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Chih-Wen Chiang, Chien-Min Chang
  • Publication number: 20130108830
    Abstract: A composite plate structure including a fiber composite sheet, a metal layer, and a resin layer is provided. The fiber composite sheet includes a first fiber layer, a core layer, and a second fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer. The metal layer is disposed on the fiber composite sheet and has at least one opening. A portion of the second fiber layer is located in the opening. The resin layer is disposed on the metal layer. In addition, a manufacturing method of the composite plate structure is also provided.
    Type: Application
    Filed: October 18, 2012
    Publication date: May 2, 2013
    Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang, Chih-Wen Chiang, Yen-Ling Liu
  • Publication number: 20130106262
    Abstract: A housing having a flat portion and a curved portion is provided. The housing includes an upper material layer, a lower material layer and a core layer. The core layer is disposed between the upper material layer and the lower material layer. The core layer has a first material region and a second material region. The first material region is corresponding to the flat portion. The second material region is corresponding to the curved portion. A material of the first material region is different from a material of the second material region.
    Type: Application
    Filed: October 4, 2012
    Publication date: May 2, 2013
    Inventors: Han-Ching Huang, Jung-Chin Wu, Po-An Lin
  • Publication number: 20120318444
    Abstract: A method for manufacturing a three-dimensional workpiece is provided. In this method, a ductile plate, a core layer and a prepreg are combined to form a sandwich structure. The core layer is located between the ductile plate and the prepreg. The sandwich structure is shaped to be the three-dimensional sandwich structure. The sandwich structure is heated to cure the prepreg.
    Type: Application
    Filed: June 13, 2012
    Publication date: December 20, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang
  • Publication number: 20120321840
    Abstract: A three-dimensional workpiece including a first ductile plate, a second ductile plate and a core layer is provided. The core layer is located between the first ductile plate and the second ductile plate. The first ductile plate, the second ductile plate and the core layer are bound together and have a three-dimensional shape. The first ductile plate has a flat area and a curved area. The core layer has a core flat area and a core curved area. The core flat area is superposed with the plate flat area and the core curved area is superposed with the plate curved area.
    Type: Application
    Filed: June 13, 2012
    Publication date: December 20, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Wan-Li Chuang
  • Publication number: 20120164360
    Abstract: A shell structure includes a composite material layer and a second material layer is provided. The composite material layer includes a woven layer and a first material layer. The woven layer has a first surface and a second surface opposite to each other. The first material layer is located on the first surface and has a plurality of through-holes. The second material layer is disposed on the first material layer and has a plurality of extending-portions adapted to be combined with the woven layer and fix the second material layer and the composite material layer to each other. In addition, a manufacturing method for shell structure of electronic device is also provided.
    Type: Application
    Filed: December 21, 2011
    Publication date: June 28, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Chih-Wen Chiang, Chien-Min Chang