Patents by Inventor Jung-Chin Wu

Jung-Chin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120162921
    Abstract: A shell structure suitable for an electronic device is provided. The electronic device has a heat generating element. The shell structure includes a core layer, a first material layer, and a second material layer. The core layer includes a thermal insulating area and a thermal conducting area. The core layer has first and second surfaces opposite to each other. The first material layer is configured on the first surface. The second material layer is configured on the second surface. The thermal insulating area is aligned to the heat generating element, and the shell structure covers the heat generating element, such that heat generated by the heat generating element is transferred to the first material layer through the second material layer and the heat conducting area to perform heat dissipation, and a position of the first material layer aligned to the heat generating element is prevented from generating a heat point.
    Type: Application
    Filed: December 21, 2011
    Publication date: June 28, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Wan-Li Chuang
  • Publication number: 20110183270
    Abstract: A method for forming a three-dimensional pattern includes following steps. A shaped workpiece having an inner surface and an outer surface is provided, and a first photoresist layer and a second photoresist layer are respectively formed on the outer surface and the inner surface. The shaped workpiece is placed on a transparent fixture. The first photoresist layer and the second photoresist layer are exposed and developed, such that the first photoresist layer forms a patterned photoresist layer, and the second photoresist layer forms an etching protection layer. The shaped workpiece is etched to form the three-dimensional pattern on the outer surface of the shaped workpiece. The patterned photoresist layer and the etching protection layer are removed.
    Type: Application
    Filed: November 12, 2010
    Publication date: July 28, 2011
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chien-Min Chang, Jung-Chin Wu, Wan-Li Chuang
  • Publication number: 20110128462
    Abstract: A cover plate includes two substrates and a composite structure disposed between the two substrates. The cover plate has low specific weight and high strength. The composite structure includes an adhesive layer and a fiber layer disposed in the adhesive layer, where the fiber layer is made of degradable fibers or a composite material having degradable fibers fixed by a forming material.
    Type: Application
    Filed: January 6, 2010
    Publication date: June 2, 2011
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Po-An Lin, Kuo-Nan Ling, Jung-Chin Wu
  • Publication number: 20110064924
    Abstract: A production method of three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured by implementing a plurality of heat treatments thereon. A workpiece of three-dimensional pattern and a production device of three-dimensional pattern are also disclosed.
    Type: Application
    Filed: September 14, 2010
    Publication date: March 17, 2011
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
  • Publication number: 20110064915
    Abstract: A production method of metal workpiece is provided. First, an adhesive layer is applied on a metal workpiece. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. The adhesive layer is then cured by implementing a plurality of heat treatments thereon. A metal workpiece with three-dimensional pattern is also provided.
    Type: Application
    Filed: September 14, 2010
    Publication date: March 17, 2011
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
  • Publication number: 20110061798
    Abstract: A production method of a three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured.
    Type: Application
    Filed: April 12, 2010
    Publication date: March 17, 2011
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chien-Min Chang, Wan-Li Chuang, Jung-Chin Wu
  • Publication number: 20090236772
    Abstract: A pattern transfer mold is suitable for transferring at least one decorative pattern of a film to at least one workpiece. The pattern transfer mold includes a mold base and a mold core. The mold base has a mold cavity and an air vent associated with the mold cavity. The mold core is inserted in the mold cavity of the mold base and has an upper surface and a plurality of upper air grooves on the upper surface. The mold cavity and the mold core have a plurality of mold air channels located between the mold cavity and the mold core. The upper air grooves are associated with the air vent via the mold air channels.
    Type: Application
    Filed: December 1, 2008
    Publication date: September 24, 2009
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chien-Min Chang, Jung-Chin Wu, Wan-Li Chuang, Ho-Hsiang Wang