Abstract: A light emitting module includes a carrier, a light emitting element, a reflection layer, and a fluorescent layer. The light emitting element is disposed on the carrier. The reflection layer is disposed on the carrier and surrounds the light emitting element. The fluorescent layer covers at least part of the light emitting element. The disadvantages of over broad light emitting angle and low illuminance may be solved. Comparing with the related art, the present disclosure achieves an object of increasing the illuminance by at least 10%.

Abstract: The invention provides a packaged light-emitting element, which comprises a substrate, wherein the substrate comprises a front surface and a back surface; a light-emitting element is located on the front surface of the substrate, and a plurality of metal pillars buried in the substrate.

Abstract: The invention provides a transparent display, which comprises a plurality of horizontal circuit layers, wherein each horizontal circuit layer extends along a horizontal direction, a plurality of vertical conductive plugs connect the horizontal circuit layers with each other, a control integrated circuit located on one of the horizontal circuit layers, and at least one light-emitting element located on another horizontal circuit layer, wherein the control integrated circuit overlaps with the at least one light-emitting element in a vertical direction.

Abstract: The invention provides a transparent display panel. The display panel includes an encapsulated integrated circuit, a front surface and a back surface of the encapsulated integrated circuit both comprise a plurality of electrodes, and a light-emitting element which is positioned on the front surface of the encapsulated integrated circuit. When views in a top view, the light-emitting element partially overlaps the encapsulated integrated circuit from a vertical direction, and is electrically connected with the electrodes on the front surface of the encapsulated integrated circuit.

Abstract: An illuminant module includes a first illuminant unit, a second illuminant unit, a first phosphor layer, and a second phosphor layer. The first illuminant unit includes one or more first LED dice and a current regulator electrically connected to the LED dice in series. The second illuminant unit includes one or more second LED dice. The first phosphor layer at least covers the first LED dice, wherein first phosphor layer and the first LED dice collectively provide an emission having a first color temperature. The second phosphor layer at least covers the second LED dice, wherein second phosphor layer and the second LED dice collectively provide an emission having a second color temperature, the current regulator is configured to adjust currents flowing to the first illuminant unit and the second illuminant unit for changing luminous flux of emissions emitted from the first illuminant unit and the second illuminant unit.

Abstract: An illuminant module includes a first illuminant unit, a second illuminant unit, a first phosphor layer, and a second phosphor layer. The first illuminant unit includes one or more first LED dice and a current regulator electrically connected to the LED dice in series. The second illuminant unit includes one or more second LED dice. The first phosphor layer at least covers the first LED dice, wherein first phosphor layer and the first LED dice collectively provide an emission having a first color temperature. The second phosphor layer at least covers the second LED dice, wherein second phosphor layer and the second LED dice collectively provide an emission having a second color temperature, the current regulator is configured to adjust currents flowing to the first illuminant unit and the second illuminant unit for changing luminous flux of emissions emitted from the first illuminant unit and the second illuminant unit.

Abstract: A light emitting diode (LED) lighting module includes a plurality of LED components and a carrier. The LED components are electrically connected in series, and each LED component includes a LED die having a perpendicular structure. The carrier includes a substrate and a protecting dam, the LED components and the protecting dam are respectively placed on the substrate, and a height of the protecting dam is higher than that of each LED component. When a specific condition is satisfied, a short circuit condition between two adjacent LED components when performing die-bond procedure is prevented.

Abstract: A light emitting diode (LED) lighting module includes a plurality of LED components and a carrier. The LED components are electrically connected in series, and each LED component includes a LED die having a perpendicular structure. The carrier includes a substrate and a protecting dam, the LED components and the protecting dam are respectively placed on the substrate, and a height of the protecting dam is higher than that of each LED component. When a specific condition is satisfied, a short circuit condition between two adjacent LED components when performing die-bond procedure is prevented.

Abstract: The present invention provides a modularized light-emitting device, which comprises a first substrate, a package module, a second substrate, and a plurality of light-emitting modules. The package module packages at least a driving unit and at least a circuit component on the first substrate, which is connected to the second substrate. By the electrical connection between the first and second substrates, the light-emitting module on the second substrate can be driven. Alternatively, the package module is disposed on the first substrate and the plurality of light-emitting modules are disposed on a third substrate. The second substrate is connected electrically with the first and third substrates for driving the light-emitting modules on the third substrate. Accordingly, the light-emitting device is connected to different package modules according to the electrical specification of the light-emitting modules, respectively, and thus improving the flexibility of the light-emitting device.

Abstract: The present invention provides a light-emitting device having circular light emission. By disposing a light-emitting chip on a substrate and a frame on one side of the light-emitting chip, a transparent sheet is disposed on the frame. In addition, a shade layer is disposed on one surface of the transparent sheet and an opening is disposed at the center of the shade layer for providing circular light emission. Alternatively, the opening can be formed on the frame and aligning with the light-emitting and thus providing circular light emission.

Abstract: An illuminant component includes a carrier, a plurality of connecting pieces, a LED die, a first fluorescent layer, and a second fluorescent layer. The carrier includes a die-bonding area and the connecting pieces are placed on the die-bonding area. The LED die is placed on the die-bonding area and electrically connected to the connecting pieces. The first fluorescent layer placed on a top surface of the LED die includes a first light-transparent adhesive and a first phosphor powder uniformly suspended within the first light-transparent adhesive. The second fluorescent layer covering the first fluorescent layer and the LED die includes a second light-transparent adhesive and a second phosphor powder uniformly suspended within the second light-transparent adhesive. In the same quantity of the first light-transparent adhesive and the second light-transparent adhesive, the quantity of the second phosphor powder is less than that of the first phosphor powder.

Abstract: The present invention provides a light-emitting device capable of adjusting brightness. A plurality of light-emitting regions is disposed on a substrate. A power control module is connected electrically to the plurality of light-emitting regions and an input power source. The power control module converts the input power as a plurality of supply power sources, which turn on the plurality of light-emitting diodes in different regions and thus enabling them to emit light. Thereby, the light-emitting regions, and hence the brightness, can be adjusted according to the usage requirements.

Abstract: A light emitting diode is provided. The light emitting diode comprises a lead frame, a resin base, an emitting chip and a glue. The lead frame has a plurality of electrode portions thereon. The resin base is provided on the lead frame, the resin base having an outer wall thereon and around an edge to form an opening, and the opening exposing the electrode portions; and an inner wall extending from the outer wall, and the inner side of the inner wall has a slope to decrease the inner diameter of the opening gradually. The emitting chip is attached on the top surface(s) of one or two the electrode portion(s). The glue is filled into a space between the emitting chip and the inner wall to expose the top surface of the emitting chip. Therefore, the illumination of the light emitting diode can be enhanced.

Abstract: A light emitting diode is provided. The light emitting diode comprises a lead frame, a resin base, an emitting chip and a glue. The lead frame has a plurality of electrode portions thereon. The resin base is provided on the lead frame, the resin base having an outer wall thereon and around an edge to form an opening, and the opening exposing the electrode portions; and an inner wall extending from the outer wall, and the inner side of the inner wall has a slope to decrease the inner diameter of the opening gradually. The emitting chip is attached on the top surface(s) of one or two the electrode portion(s). The glue is filled into a space between the emitting chip and the inner wall to expose the top surface of the emitting chip. Therefore, the illumination of the light emitting diode can be enhanced.

Abstract: A LED (Light-Emitting Diode) package structure is provided. The LED package improved structure includes a base, a plurality of metallic nanoparticles and a LED unit. The base has an accommodating space, wherein the accommodating space has a bottom surface and at least one side surface surrounding the bottom surface. The metallic nanoparticles cover the bottom surface and/or the side surface. The LED unit is disposed in the accommodating spare, in which light emitted from the LED unit is reflected or scattered by the metallic nanoparticles, each of the metallic nanoparticles has a diameter smaller than 10 nm and is electrically isolated.

Abstract: The present invention provides a package structure of LED module and the method for manufacturing the same. The method comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member. The light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material. In the above structure, the light-pervious member and colloid member are used for reducing the total reflection effect in the package.

Abstract: The present invention provides a package structure of LED module and the method for manufacturing the same. The method comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member. The light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material. In the above structure, the light-pervious member and colloid member are used for reducing the total reflection effect in the package.

Abstract: The present invention provides a light-emitting apparatus having light-pervious plate. A circuit layer is disposed on a substrate. The circuit layer is adjacent to the LEDs, so that the LEDs can be connected electrically to the circuit layer. In addition, a frame is disposed on the circuit layer. A light-pervious plate is disposed on the frame and located in a light-emitting direction of the LEDs. Moreover, there is a gap between the light-pervious plate and the LEDs.

Abstract: The present invention provides a light-emitting device having circular light emission. By disposing a light-emitting chip on a substrate and a frame on one side of the light-emitting chip, a transparent sheet is disposed on the frame. In addition, a shade layer is disposed on one surface of the transparent sheet and an opening is disposed at the center of the shade layer for providing circular light emission. Alternatively, the opening can be formed on the frame and aligning with the light-emitting and thus providing circular light emission.

Abstract: A light enhancing structure includes a light emitting diode in it and at least one coating layer. The light emitting diode unit includes a plurality of surfaces and a light-emitting surface. The light-emitting surface is for allowing a plurality of lights generated inside the light emitting diode unit to emit through. The coating layer is formed on the surfaces for blocking or reflecting one of the lights generated inside the light emitting diode unit, and to light intensity of the light emitting diode unit is enhanced.