Abstract: A LED (Light-Emitting Diode) package structure is provided. The LED package improved structure includes a base, a plurality of metallic nanoparticles and a LED unit. The base has an accommodating space, wherein the accommodating space has a bottom surface and at least one side surface surrounding the bottom surface. The metallic nanoparticles cover the bottom surface and/or the side surface. The LED unit is disposed in the accommodating spare, in which light emitted from the LED unit is reflected or scattered by the metallic nanoparticles, each of the metallic nanoparticles has a diameter smaller than 10 nm and is electrically isolated.

Abstract: A light adjustable AC (alternating-current) LED device is provided. A color temperature of the light adjustable AC LED device is decreased as decreased brightness thereof. The light adjustable AC LED device includes an AC power source, a plurality of power loops and a plurality of LED segments. The AC power source is for providing an AC voltage. Each of the power loops is electrically connected with the AC power source, and each of the LED segments is electrically connected with each power loop. When the AC voltage is gradually raised, each LED segment of each power loop is turned-on in sequence, thereby a color temperature of each LED segment being mixed in sequence; when the AC voltage is gradually dropped, each LED segment of each power loop is turned-off in reverse order.

Abstract: A light emitting diode package structure is provided. The light emitting diode package structure includes at least one light emitting diode unit, an encapsulating body and at least one isolation film. The encapsulating body includes a plurality of surfaces and at least one light-emitting surface, wherein one of the surfaces supports the light emitting diode unit, the other surfaces are exposed. The at least one isolation film is formed on the exposed surfaces. Wherein the isolation film blocks or reflects a portion of light emitted from the light emitting diode unit.

Abstract: A light enhancing structure includes a light emitting diode in it and at least one coating layer. The light emitting diode unit includes a plurality of surfaces and a light-emitting surface. The light-emitting surface is for allowing a plurality of lights generated inside the light emitting diode unit to emit through. The coating layer is formed on the surfaces for blocking or reflecting one of the lights generated inside the light emitting diode unit, and to light intensity of the light emitting diode unit is enhanced.

Abstract: A light emitting diode package structure is provided. The light emitting diode package structure includes at least one light emitting diode unit, an encapsulating body and at least one isolation film. The encapsulating body includes a plurality of surfaces and at least one light-emitting surface, wherein one of the surfaces supports the light emitting diode unit, the other surfaces are exposed. The at least one isolation film is formed on the exposed surfaces. Wherein the isolation film blocks or reflects a portion of light emitted from the light emitting diode unit.

Abstract: An LED chip package having a topographical glass coating on top surface for enhancing heat dissipation is disclosed. A circular wall is optionally built to surround the LED chip for reflecting light beams from the LED chips; the glass coating further extends to cove the inner wall surface of the circular wall. The larger area the glass coating covers, the more heat the package dissipates in a time unit. The LED chip package according to the present invention exhibits higher thermal dissipation and helps to last longer the life of the LED chip package than a traditional one.

Abstract: A white light LED module structure including ultraviolet light comprises a white light LED module radiating a white light. An ultraviolet light LED chip is disposed in a packaging structure of the white light LED module. The ultraviolet light LED chip radiates an ultraviolet light. The white light and the ultraviolet light simultaneously illuminate an object. Alternatively, a white light LED module can be disposed for radiating a white light, and an ultraviolet light LED module can be disposed at one side of the white light LED module for radiating an ultraviolet light. The white light and the ultraviolet light simultaneously illuminate an object. The above-mentioned two methods allow an addition of an ultraviolet light wave band to the white light LED module, thereby activating fabrics containing fluorescent materials.

Abstract: An adjustable condenser seat includes at least one light source, at least one lens, at least one lens sleeve, and at least one adjuster. The lens sleeve contains the lens which is disposed for the light source correspondingly for guiding light from the light source to the lens. The adjuster is disposed at a focal axis of the light between the light source and the lens sleeve. The adjuster is utilized for lengthening or shortening a distance between the light source and the lens so that a relative position between the light source and the lens can be adjusted. Accordingly, either a condensing angle of the lens or a focal position of the lens to the light source can be changed.

Abstract: The illuminating device of the invention comprises at least one lighting component, red lighting component, current limiting component and fluorescent body, wherein said red lighting component is first series connected with said current limiting component, and further parallel connected with said lighting component, so that input current to red lighting component is controlled by said current limiting component to be smaller than input current to lighting component, thereby said fluorescent body receiving and triggering the light emitted by said lighting component is mixed with the light emitted by said red lighting device to emit a white light with high lighting efficient and high color rendering white light.

Abstract: A light emitting diode device includes a substrate, a reflector cup, a light emitting diode chip, and a phosphor paste. The reflector cup is set on the substrate, and has a wall of a first length and a first height wherein the first length is defined by a corresponding inner edge thereof. The LED chip is mounted on the substrate, and comprises a second length and a second height. The phosphor paste covers on the LED chip. The first height of the wall and the second height of the LED chip has a first ratio, and the first length of the wall and the second length of the LED chip has a second ratio wherein the first ratio is larger than the second ratio.

Abstract: The illuminating device of the invention comprises at least one lighting component, red lighting component, current limiting component and fluorescent body, wherein said red lighting component is first series connected with said current limiting component, and further parallel connected with said lighting component, so that input current to red lighting component is controlled by said current limiting component to be smaller than input current to lighting component, thereby said fluorescent body receiving and triggering the light emitted by said lighting component is mixed with the light emitted by said red lighting device to emit a white light with high lighting efficient and high color rendering white light.

Abstract: A side emitting LED is provided, and it includes a substrate, at least one LED chip, a light transmitting package and a light reflector. The substrate includes a base, and the LED chip is mounted on the base. The light transmitting package is a half-closed form and is mounted on the substrate to hold the LED chip. The light reflector is disposed on the package and corresponds to the LED chip to alter the light direction radiated from the LED chip. Therefore, the light radiated from the LED chip is reflected by the corresponding light reflector and passes through the light transmitting package to be emitted laterally.

Abstract: A side emitting LED is provided, and it includes a substrate, at least one LED chip, a light transmitting package and a light reflector. The substrate includes a base, and the LED chip is mounted on the base. The light transmitting package is a half-closed form and is mounted on the substrate to hold the LED chip. The light reflector is disposed on the package and corresponds to the LED chip to alter the light direction radiated from the LED chip. Therefore, the light radiated from the LED chip is reflected by the corresponding light reflector and passes through the light transmitting package to be emitted laterally.