Patents by Inventor Jung Ho Yoon

Jung Ho Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11956426
    Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus for deriving an intra-prediction mode. An intra-prediction mode may be derived using a method for deriving an intra-prediction mode based on a neighbor block of the target block, a method for deriving an intra-prediction mode using signaling of the intra-prediction mode of the target block, or a method for deriving an adaptive intra-prediction mode based on the type of a target slice. An MPM list may be used to derive the intra-prediction mode, and a temporal neighbor block or the like may be used to configure the MPM list.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: April 9, 2024
    Assignees: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Industry-Academia Cooperation Group of Sejong University
    Inventors: Jin-Ho Lee, Jae-Gon Kim, Jung-Won Kang, Do-Hyeon Park, Yung-Lyul Lee, Ha-Hyun Lee, Sung-Chang Lim, Hui-Yong Kim, Ji-Hoon Do, Yong-Uk Yoon
  • Patent number: 11953213
    Abstract: An air conditioner that further provides a lighting function is provided. The air conditioner can increase space utilization of a ceiling by the lighting device being integrally installed in the indoor unit. In addition, heat generated at the lighting device can be radiated by the cooling structure provided in the indoor unit, and thereby overheating of the lighting device can be prevented. The air conditioner includes a blowing fan configured to flow air, a housing in which an intake port is formed to suction air by the blowing fan, a lighting device provided in the housing, and a cooling channel configured to guide the air suctioned by the blowing fan to pass the lighting device.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: April 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyoung-Rock Kim, Joon-Ho Yoon, Jung Ho Kim
  • Patent number: 11940162
    Abstract: An integrated air conditioner comprises: a housing partitioned into a first housing on the upper side thereof and a second housing on the lower side thereof, wherein the first housing has a first intake port through which external air is introduced thereinto and a first exhaust port through which internal air is exhausted therefrom, and the second housing has a second intake port through which external air is introduced thereinto and a second exhaust port through which internal air is exhausted therefrom; a compressor provided in the interior of the housing to compress a refrigerant; a condenser that is provided on a second fluid channel, which connects the second intake port and the second exhaust port, and condenses the compressed refrigerant, supplied from the compressor, into a liquid phase; an expansion unit that expands the refrigerant, condensed in the condenser, into a low-pressure refrigerant; and an evaporator.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: March 26, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong Hyun Kil, Jung Ho Kim, Joon Ho Yoon
  • Patent number: 11932618
    Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: March 19, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Hong Chul Yoon, Kyung Mi An, Myong Jae Lee, Jin Hee Lee, Jeong-geun Kim, A-rang Im, Woo Jin Jeon, Jin Ah Jeong, Jaeho Heo, Changhee Hong, Kyeojin Kim, Jung-Eun Park, Te-ik Sohn, Changmok Oh, Da Hae Hong, Sung Wook Kwon, Jung Ho Kim, Jae Eui Shin, Yeongran Yoo, Min Whan Chang, Eun Hye Jang, In-gyu Je, Ji Hye Choi, Gunhee Kim, Yearin Jun
  • Publication number: 20240071686
    Abstract: A dielectric ceramic composition for multi-layer ceramic capacitor for use in extreme environments is formed by mixing a main compos it ion and a composite oxide for low-temperature sintering, where the main composition includes 96.0 to 99.0 wt. % of BaTiO3 and 1.0 to 4.0 wt. % of Nb2O5 and Co3O4 as an additive. The main composition is formed by per forming a heat treatment for synthesis to form a core-shell structure having the BaTiO3 as a core and the Nb2O5 and Co3O4 covering the sur face of the BaTiO3. The composite oxide for low-temperature sintering is at least one selected from BaV2O6, Ba3V4O13 and Ba4V2O9.
    Type: Application
    Filed: October 25, 2022
    Publication date: February 29, 2024
    Inventors: Young Joo OH, Jung Rag YOON, Chang Ho LEE
  • Publication number: 20240067065
    Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.
    Type: Application
    Filed: December 21, 2022
    Publication date: February 29, 2024
    Inventors: Deok Soo Lim, Sang Hark Lee, Sang Soo Lee, Jung Sang You, Sang Do Park, Chan Ho Jung, Gun Chu Park, Gi Tae Jo, Jin Sik Kim, Hee Dong Yoon, Ho Sub Lim, Jae Hyun Park
  • Publication number: 20230145077
    Abstract: Disclosed is a method of manufacturing an epitaxy oxide thin film of enhanced crystalline quality, and an epitaxy oxide thin film manufactured thereby according to the present invention. With respect to the manufacturing method of the epitaxy oxide thin film, which epitaxially grows an orientation film with an oxide capable of being oriented to (001), (110), and (111) on a single crystal Si substrate, because time required for raising a temperature of the orientation film up to an annealing temperature at room temperature is extremely minimized, thermal stress arising from the large difference in thermal expansion coefficients between the substrate and the orientation film is controlled, so crystalline quality of the epitaxy oxide thin film can be enhanced. Moreover, various epitaxial functional oxides are integrated into the thin film of enhanced crystalline quality so that a novel electronic device can be embodied.
    Type: Application
    Filed: October 7, 2022
    Publication date: May 11, 2023
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Seung Hyub BAEK, Hyung-Jin CHOI, Sung Hoon HUR, Ji-Soo JANG, Jung Ho YOON, Seong Keun KIM, Hyun Cheol SONG, Chong Yun KANG, Ji-Won CHOI, Jin Sang KIM, Byung Chul Lee
  • Publication number: 20230058826
    Abstract: Provided is an apparatus for generating direct current using continuous polarization change of piezoelectric materials. For example, a piezoelectric direct current generator includes a first electrode, a polarized piezoelectric material layer disposed on a first surface of the first electrode, and a second electrode disposed on a surface opposite to the first electrode and coupled to move along the piezoelectric material layer while pressing the piezoelectric material layer.
    Type: Application
    Filed: August 17, 2022
    Publication date: February 23, 2023
    Inventors: Hyun Cheol SONG, Chong Yun KANG, Sung Hoon HUR, Seung Hyub BAEK, Seong Keun KIM, Ji Won CHOI, Jung Ho YOON, Hyun Soo KIM
  • Publication number: 20220348927
    Abstract: The present invention pertains to a pharmaceutical composition for preventing or treating squamous cell carcinoma, the pharmaceutical composition containing a highly expressed lncRNAs in esophageal squamous cell carcinoma (HERES) expression inhibitor. More specifically, the present invention pertains to a pharmaceutical composition which uses a HERES expression inhibitor to reduce the expression of HERES and affect Wnt signaling pathways, and thereby prevent or treat squamous cell carcinoma. The present inventors discovered that the expression pattern of HERES is related to the onset of squamous cell carcinoma, and found that HERES can be a target for treating squamous cell carcinoma.
    Type: Application
    Filed: May 8, 2020
    Publication date: November 3, 2022
    Applicants: IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY), INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Jin-Wu NAM, Bo-Hyun YOU, Sang Kil LEE, Jung Ho YOON
  • Patent number: 10622561
    Abstract: Provided are a semiconductor technique, and more particularly, to a variable resistor, a non-volatile memory device using the same, and a method of fabricating the same. The variable resistor may include a first electrode including titanium (Ti); a second electrode for forming a Schottky barrier; and a stacked structure including an oxygen-deficient hafnium oxide film (HfO2-x, 0<x<2) between the first electrode and the second electrode, an oxygen-deficient titanium oxide (TiOx) film between the oxygen-deficient hafnium oxide film and the first electrode, and a stoichiometric tantalum oxide (Ta2O5) film between the oxygen-deficient hafnium oxide film and the second electrode.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: April 14, 2020
    Assignee: Seoul National University R&DB foundation
    Inventors: Cheol Seong Hwang, Jung Ho Yoon
  • Patent number: 10109584
    Abstract: A semiconductor package according to some examples of the disclosure may include a first body layer, a transformer that may comprise one or more inductors, coupled inductors, or inductive elements positioned above the first body layer. A first ground plane is on a top of the first body layer between the first body layer and the inductive element. The first ground plane may have conductive lines generally perpendicular to a magnetic field generated by the inductive element, and a second ground plane on a bottom of the first body layer opposite the first ground plane. The first and second ground planes may also provide heat dissipation elements for the semiconductor as well as reduce or eliminate eddy current and parasitic effects produced by the inductive element.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: October 23, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Uei-Ming Jow, Young Kyu Song, Jung Ho Yoon, Jong-Hoon Lee, Xiaonan Zhang
  • Patent number: 9576718
    Abstract: An inductor structure includes a first set of traces corresponding to a first layer of an inductor, a second set of traces corresponding to a second layer of the inductor, and a third set of traces corresponding to a third layer of the inductor that is positioned between the first layer and the second layer. The first set of traces includes a first trace and a second trace that is parallel to the first trace. A dimension of the first trace is different from a corresponding dimension of the second trace. The second set of traces is coupled to the first set of traces. The second set of traces includes a third trace that is coupled to the first trace and to the second trace. The third set of traces is coupled to the first set of traces.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: February 21, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Uei-Ming Jow, Young Kyu Song, Jong-Hoon Lee, Jung Ho Yoon, Sangjo Choi, Xiaonan Zhang
  • Publication number: 20170018513
    Abstract: There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.
    Type: Application
    Filed: September 27, 2016
    Publication date: January 19, 2017
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Jae YOO, Jung Ho YOON, Chul Gyun PARK, Myeong Woo HAN, Jung Aun LEE
  • Publication number: 20170005262
    Abstract: Provided are a semiconductor technique, and more particularly, to a variable resistor, a non-volatile memory device using the same, and a method of fabricating the same. The variable resistor may include a first electrode including titanium (Ti); a second electrode for forming a Schottky barrier; and a stacked structure including an oxygen-deficient hafnium oxide film (HfO2-x, 0<x<2) between the first electrode and the second electrode, an oxygen-deficient titanium oxide (TiOx) film between the oxygen-deficient hafnium oxide film and the first electrode, and a stoichiometric tantalum oxide (Ta2O5) film between the oxygen-deficient hafnium oxide film and the second electrode.
    Type: Application
    Filed: June 30, 2016
    Publication date: January 5, 2017
    Inventors: Cheol Seong Hwang, Jung Ho Yoon
  • Publication number: 20160372253
    Abstract: An inductor structure includes a first set of traces corresponding to a first layer of an inductor, a second set of traces corresponding to a second layer of the inductor, and a third set of traces corresponding to a third layer of the inductor that is positioned between the first layer and the second layer. The first set of traces includes a first trace and a second trace that is parallel to the first trace. A dimension of the first trace is different from a corresponding dimension of the second trace. The second set of traces is coupled to the first set of traces. The second set of traces includes a third trace that is coupled to the first trace and to the second trace. The third set of traces is coupled to the first set of traces.
    Type: Application
    Filed: June 22, 2015
    Publication date: December 22, 2016
    Inventors: Uei-Ming Jow, Young Kyu Song, Jong-Hoon Lee, Jung Ho Yoon, Sangjo Choi, Xiaonan Zhang
  • Patent number: 9509374
    Abstract: Disclosed herein are a wireless power transmission apparatus and a transmission method thereof. The wireless power transmission apparatus is configured to include a wireless power transmitter generating a wireless power signal to be wireless transmitted, wirelessly transmitting the generated wireless power signal by a magnetic resonance manner, receiving a reflection wireless power signal to determine whether or not a load apparatus is presented, and supplying power to the load apparatus; and a wireless power receiver connected to the load apparatus and receiving the transmitted wireless power signal by the magnetic resonance manner and supplying it to the connected load apparatus and reflecting the remaining wireless power signal to the wireless power transmitter, whereby a transmission apparatus can recognize a receiving environment and resonance characteristics are improved, without a separate communication device or a system.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: November 29, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Hoon Kim, Kwang Du Lee, Chul Gyun Park, Jung Ho Yoon, Eung Ju Kim, Sang Hoon Hwang
  • Patent number: 9496219
    Abstract: A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: November 15, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Do Jae Yoo, Jung Ho Yoon, Chul Gyun Park, Myeong Woo Han, Jung Aun Lee
  • Publication number: 20160308500
    Abstract: A current mirror circuit for biasing a power amplifier includes a modified Wilson current mirror with a pair of first and second mirror transistors connected to a third transistor. The first mirror transistor is configured for operating in a saturation mode, with a gate voltage of the first mirror transistor being lower than a gate voltage of the power amplifier. The third transistor charges the power amplifier circuit during a positive half cycle of an input signal and the first mirror transistor discharges the power amplifier circuit during a negative half cycle of the input signal at different rates.
    Type: Application
    Filed: April 15, 2016
    Publication date: October 20, 2016
    Inventors: Sifen Luo, Zhan Xu, Changli Chen, Haitao Li, Heng-chia Chang, Narisi Wang, Jung Ho Yoon
  • Patent number: 9373583
    Abstract: Some implementations provide an integrated device that includes a capacitor and an inductor. The inductor is electrically coupled to the capacitor. The inductor and the capacitor are configured to operate as a filter for an electrical signal in the integrated device. The inductor includes a first metal layer of a printed circuit board (PCB), a set of solder balls coupled to the PCB, and a second metal layer in a die. In some implementations, the capacitor is located in the die. In some implementations, the capacitor is a surface mounted passive device on the PCB. In some implementations, the first metal layer is a trace on the PCB. In some implementations, the inductor includes a third metal layer in the die. In some implementations, the second metal layer is an under bump metallization (UBM) layer of the die, and the third metal is a redistribution layer of the die.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: June 21, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Jong-Hoon Lee, Young Kyu Song, Jung Ho Yoon, Uei Ming Jow, Xiaonan Zhang, Ryan David Lane
  • Publication number: 20160172274
    Abstract: A semiconductor package according to some examples may include a first portion of a support plate configured as an RF signal connection, a semiconductor die thermally coupled to a second portion of the support plate to dissipate heat, a first redistribution layer positioned in close proximity to a second redistribution layer to capacitively couple the first redistribution layer to the second redistribution layer, a first via extending between the first portion and the first redistribution layer, and a second via in close proximity to the first via to capacitively couple the second via to the first via.
    Type: Application
    Filed: December 16, 2014
    Publication date: June 16, 2016
    Inventors: Jung Ho YOON, Young Kyu SONG, Uei-Ming JOW, Jong-Hoon LEE, Xiaonan ZHANG