Abstract: Some features pertain to an integrated device (e.g., package-on-package (PoP) device) that includes a substrate, a first die, a first encapsulation layer, a first redistribution portion, a second die, a second encapsulation layer, and a second redistribution portion. The substrate includes a first surface and a second surface. The substrate includes a capacitor. The first die is coupled to the first surface of the substrate. The first encapsulation layer encapsulates the first die. The first redistribution portion is coupled to the first encapsulation. The second die is coupled to the second surface of the substrate. The second encapsulation layer encapsulates the second die. The second redistribution portion is coupled to the second encapsulation layer.

Abstract: A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon: a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.

Abstract: Disclosed herein are a multi wireless charging apparatus and a method for manufacturing the same. The multi wireless charging apparatus includes: a control unit wholly controlling a multi wireless charging process; and a plurality of wireless charging units electrically connected with the control and deformed into a roll form by being bonded so as to a plurality of interlayer voids at the time of laminating a plurality of flexible substrates. By this configuration, the multi wireless charging apparatus can be rolled up in a roll form while having a slim thickness and therefore, can be conveniently carried.

Abstract: A semiconductor package according to some examples of the disclosure may include a first body layer, a transformer that may comprise one or more inductors, coupled inductors, or inductive elements positioned above the first body layer. A first ground plane is on a top of the first body layer between the first body layer and the inductive element. The first ground plane may have conductive lines generally perpendicular to a magnetic field generated by the inductive element, and a second ground plane on a bottom of the first body layer opposite the first ground plane. The first and second ground planes may also provide heat dissipation elements for the semiconductor as well as reduce or eliminate eddy current and parasitic effects produced by the inductive element.

Abstract: A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.

Abstract: A package substrate (or printed circuit board) that includes at least one dielectric layer, a first inductor structure is at least partially located in the dielectric layer, a third interconnect, and a second inductor structure. The first inductor structure includes a first interconnect, a first via coupled to the first interconnect, and a second interconnect coupled to the first via. The third interconnect is coupled to the first inductor structure. The third interconnect is configured to provide an electrical path for a ground signal. The second inductor structure is at least partially located in the dielectric layer. The second inductor is coupled to the third interconnect. The second inductor structure includes a fourth interconnect, a second via coupled to the fourth interconnect, and a fifth interconnect coupled to the second via. The first and second inductor structures are configured to operate with a capacitor as a 3rd harmonic suppression filter.

Abstract: Some features pertain to an integrated device (e.g., package-on-package (PoP) device) that includes a substrate, a first die, a first encapsulation layer, a first redistribution portion, a second die, a second encapsulation layer, and a second redistribution portion. The substrate includes a first surface and a second surface. The substrate includes a capacitor. The first die is coupled to the first surface of the substrate. The first encapsulation layer encapsulates the first die. The first redistribution portion is coupled to the first encapsulation. The second die is coupled to the second surface of the substrate. The second encapsulation layer encapsulates the second die. The second redistribution portion is coupled to the second encapsulation layer.

Abstract: Disclosed are a wireless power transmitter capable of transmitting power wirelessly according to an impedance of an output side and a wireless power transceiver. There are provided a wireless power transmitter and a wireless power transceiver including: a wireless power transmitting unit converting input power into a preset transmission power and transmitting the converted input power wirelessly; and a controlling unit controlling a transmission of the transmission power according to a level of output impedance of the transmission power output from the wireless power transmitting unit.

Abstract: A wireless power transmission/reception apparatus includes a wireless power transmission unit. The transmission unit is configured to generate a wireless power signal to be transmitted, transmit the wireless power signal using magnetic resonance, receive a reflected wireless power signal from a wireless power reception unit, determine whether a load device is present, and transmit a further wireless power signal when it is determined that the load device is present in such a way that impedance and output power depending on variation in a distance to the load device are tracked, and wireless power is supplied to the load device in an optimized state. Accordingly, a separate transceiver module is not provided for the purpose of performing communication between a transmitting end and a receiving end, and a reception environment is automatically detected, thus enabling wireless power to be transmitted in an optimal wireless power transmission state.

Abstract: Some implementations provide an integrated device that includes a capacitor and an inductor. The inductor is electrically coupled to the capacitor. The inductor and the capacitor are configured to operate as a filter for an electrical signal in the integrated device. The inductor includes a first metal layer of a printed circuit board (PCB), a set of solder balls coupled to the PCB, and a second metal layer in a die. In some implementations, the capacitor is located in the die. In some implementations, the capacitor is a surface mounted passive device on the PCB. In some implementations, the first metal layer is a trace on the PCB. In some implementations, the inductor includes a third metal layer in the die. In some implementations, the second metal layer is an under bump metallization (UBM) layer of the die, and the third metal is a redistribution layer of the die.

Abstract: A wireless power transmission/reception apparatus includes a wireless power transmission unit. The transmission unit is configured to generate a wireless power signal to be transmitted, transmit the wireless power signal using magnetic resonance, receive a reflected wireless power signal from a wireless power reception unit, determine whether a load device is present, and transmit a further wireless power signal when it is determined that the load device is present in such a way that impedance and output power depending on variation in a distance to the load device are tracked, and wireless power is supplied to the load device in an optimized state. Accordingly, a separate transceiver module is not provided for the purpose of performing communication between a transmitting end and a receiving end, and a reception environment is automatically detected, thus enabling wireless power to be transmitted in an optimal wireless power transmission state.

Abstract: Disclosed herein is an apparatus for transmitting and receiving wireless energy using meta-material structures having a zero refractive index. The apparatus includes a wireless energy transmission unit and a wireless energy reception unit. When external power is applied thereto, the wireless energy transmission unit generates wireless energy to be wirelessly transmitted, and then wirelessly transmits wireless energy, which is normally propagated radially when the generated wireless energy is transmitted, using a magnetic resonance method while concentrating the wireless energy in one direction.

Abstract: Disclosed herein is there is provided an apparatus for transmitting and receiving wireless energy using meta-material structures having a negative refractive index. The apparatus includes a wireless energy transmission unit and a wireless energy reception unit. The wireless energy transmission unit generates wireless energy to be wirelessly transmitted, and then wirelessly transmits wireless energy, which is normally propagated radially, using a magnetic resonance method while concentrating the wireless energy at a single point. The wireless energy reception unit wirelessly receives the wireless energy using the magnetic resonance method while concentrating the wireless energy at a single point.

Abstract: A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip.

Abstract: Disclosed is a battery management system. More specifically, the battery management system includes an alternator that supplies a battery and electronic equipment of a vehicle with electricity that is generated by a driving torque of the vehicle, a battery that supplies the electronic equipment with power that is charged by the alternator, a battery observer that observes a condition of the battery, a vehicle information collection portion that collects vehicle condition information according to driving of the vehicle, and a control portion that performs charging recovery of the battery by activating a battery refresh operation when at least one condition of a current accumulation value of the battery, a low SCO entry frequency, and a vehicle starting frequency satisfies a predetermined battery refresh condition.

Abstract: The wireless charging apparatus according to the preferred embodiment of the present invention includes a control unit performing a general control of a wireless charging process; a driving unit connected to the control unit to generate a wireless power signal to be transmitted according to the control of the control unit; a transmission coil unit connected to the driving unit as a coil structure in a dumbbel form and transmitting wireless power according to the wireless power signal, the turn loop having a major-axis side of which one side is longer than the other side and at least one area is formed in a form depressed inwardly; and a sensing unit connected between the transmission coil unit and the control unit to detect whether the wireless charging receiver is positioned corresponding to the transmission coil unit and transfer the detected state to the control unit.

Abstract: There is provided a semiconductor package including: a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern.

Abstract: There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.

Abstract: Disclosed is a wireless energy transmission structure which includes a disc part including a first conductor plate and a second conductor plate which are spaced to face each other and a dielectric material inserted between the first conductor plate and the second conductor plate, and generating an electric field between the first conductor plate and the second conductor plate; and a ring-shaped wire part one end of which is connected to the first conductor plate and the other end of which is connected to the second conductor plate, and having a meta structure in which a plurality of meta cells is repetitively arranged so as to induce a magnetic field using the electric field, so that the wireless energy transmission structure is reduced in size and is improved in transmission distance and transmission efficiency.

Abstract: An antenna assembly, and a portable terminal having the same. The antenna assembly according to an embodiment comprises: a circuit board having a ground plane at a predetermined region; first and second antenna conductors spaced from each other at one side of the ground plane; and a shielding wall disposed between the ground plane and the antenna conductors, for reducing a coupling between the first and second antenna conductors. Since a plurality of antennas are mounted at a small space inside the portable terminal with maintaining their functions, an isolation characteristic between the antennas is enhanced, and a mutual coupling between the antennas is minimized.