Abstract: Composition for preventing the formation of new scar, e.g. myofibroblast, having BMP-7 polypeptide is disclosed. The composition for preventing the formation of scar includes an effective amount of BMP-7 (Bone Morphogenic Protein-7) polypeptide of sequence 1. The effective amount is 50 ng/ml-50 ?g/ml or 0.1 ng-1 ?g/kg by weight and the scar is a corneal scar.

Abstract: A broadband slot array antenna employs a closely arranged array of slot antennas to minimize antenna size. The antenna array includes a common input terminal; a conductor plate having a common slot formed in a predetermined area and a plurality of slot halves being formed separately and respectively communicating with the common slot via a plurality of slot necks spaced by a predetermined distance; a plurality of feed lines, each having one terminus connected to the common input terminal, for applying power to the conductor plate at a cross coupling point; and a dielectric layer disposed between the conductor plate and the plurality of feed lines.

Abstract: A broadband slot array antenna employs a closely arranged array of slot antennas to minimize antenna size. The antenna array includes a common input terminal; a conductor plate having a common slot formed in a predetermined area and a plurality of slot halves being formed separately and respectively communicating with the common slot via a plurality of slot necks spaced by a predetermined distance; a plurality of feed lines, each having one terminus connected to the common input terminal, for applying power to the conductor plate at a cross coupling point; and a dielectric layer disposed between the conductor plate and the plurality of feed lines.

Abstract: Silver-tin alloy solder bumps are fabricated by forming a masked underbump metallurgy layer on a microelectronic substrate, to define exposed portions of the underbump metallurgy layer, plating silver on the exposed portions of the underbump metallurgy, plating tin on the silver and reflowing to form silver-tin alloy solder bumps. Accordingly, silver-tin alloy is not plated. Rather, individual layers of silver and tin are plated, and then reflowed to form silver-tin alloy solder bumps.

Abstract: Silver-tin alloy solder bumps are fabricated by forming a masked underbump metallurgy layer on a microelectronic substrate, to define exposed portions of the underbump metallurgy layer, plating silver on the exposed portions of the underbump metallurgy, plating tin on the silver and reflowing to form silver-tin alloy solder bumps. Accordingly, silver-tin alloy is not plated. Rather, individual layers of silver and tin are plated, and then reflowed to form silver-tin alloy solder bumps.