Patents by Inventor Jung Hwa Jung

Jung Hwa Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11342486
    Abstract: A light emitting device package disclosed in an embodiment of the invention includes a substrate including first and second frames; a light emitting device including a first bonding portion facing the first frame and a second bonding portion facing the second frame; a phosphor layer on the light emitting device; a first resin disposed around the upper surface of the substrate and the light emitting device; a second resin between the first resin and side surfaces of the light emitting device; and an adhesive layer between the phosphor layer and the light emitting device, wherein the adhesive layer includes a thickness thinner than a thickness of the phosphor layer, and the first resin comprises a reflective resin material and is disposed on the side surface of the phosphor layer. The second resin may include a transparent resin material, and the second resin may include a curved surface with an outer surface facing the first resin.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: May 24, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Ki Seok Kim, Jung Hwa Jung, Na Young Kim, Won Jung Kim, Suk Kyung Park, Sang Jun Lee, Nak Hun Kim, Chang Man Lim
  • Publication number: 20200395514
    Abstract: A light emitting device package according to an embodiment may include: a body including first and second openings; a light emitting device disposed on the body and including first and second bonding parts; a first resin disposed between the body and the light emitting device; and a second resin disposed on a side surface and an upper surface of the light emitting device. According to an embodiment, the second resin may include functional groups detected in 800-850 wavenumber band, 929-1229 wavenumber band, and 1420-1605 wavenumber band, respectively, through FT-IR analysis, and [an area integral value of 800˜850 wavenumber band]/[an area integral value of 929˜1229 wavenumber band] may be in a range of 2% to 3%, and [the area integral value of 800˜850 wavenumber band]/[an area integral value of 1420˜1605 wavenumber band] may be provided in a range of 70% to 90%.
    Type: Application
    Filed: October 23, 2018
    Publication date: December 17, 2020
    Inventors: Suk Kyung PARK, Chang Man LIM, June O SONG, Jung Hwa JUNG
  • Publication number: 20200335673
    Abstract: A light emitting device package disclosed in an embodiment of the invention includes a substrate including first and second frames; a light emitting device including a first bonding portion facing the first frame and a second bonding portion facing the second frame; a phosphor layer on the light emitting device; a first resin disposed around the upper surface of the substrate and the light emitting device; a second resin between the first resin and side surfaces of the light emitting device; and an adhesive layer between the phosphor layer and the light emitting device, wherein the adhesive layer includes a thickness thinner than a thickness of the phosphor layer, and the first resin comprises a reflective resin material and is disposed on the side surface of the phosphor layer. The second resin may include a transparent resin material, and the second resin may include a curved surface with an outer surface facing the first resin.
    Type: Application
    Filed: October 31, 2018
    Publication date: October 22, 2020
    Inventors: Ki Seok KIM, Jung Hwa JUNG, Na Young KIM, Won Jung KIM, Suk Kyung PARK, Sang Jun LEE, Nak Hun KIM, Chang Man LIM
  • Patent number: 10784415
    Abstract: Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: September 22, 2020
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Jung Hwa Jung, Seoung Ho Jung, Sung Ki Hwang
  • Publication number: 20200168852
    Abstract: Disclosed is a method for manufacturing a secondary battery. According to the present invention, a problem of weakening durability of a pouch, which may occur in a process of forming cups having different depths in the pouch may be solved.
    Type: Application
    Filed: December 10, 2018
    Publication date: May 28, 2020
    Applicant: LG Chem, Ltd.
    Inventors: Sei Woon Oh, Soo Ji Hwang, Jung Hwa Jung, Ho Sub Lee, Jin Seo Park
  • Patent number: 10615398
    Abstract: Disclosed herein are an electrode assembly including a plurality of unit cells arranged in a height direction on the basis of a plane, at least two of the unit cells having different planar sizes, and a space portion defined by the difference in planar size between the arranged unit cells, wherein each of the unit cells includes at least one electrode plate, electrode tabs protruding from the electrode plates of the unit cells are electrically connected to an electrode lead via a tab-lead coupling part, and the tab-lead coupling part is located in the space portion, and a battery cell including the same.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: April 7, 2020
    Assignee: LG Chem, Ltd.
    Inventors: Sei Woon Oh, Seong Yoon Lim, Hyun Min Kim, Jung Ah Shim, Ho Sub Lee, Jung Hwa Jung
  • Patent number: 10529901
    Abstract: An LED package allows a fluorescent material to be uniformly distributed around an LED chip on a base when a filling space inside a transparent wall surrounding the LED chip is filled with the fluorescent material. The LED package includes a base, at least one LED chip mounted on the base, a transparent wall formed on the base and having a filling space around the LED chip, and a fluorescent material, with which the filling space is filled to cover the LED chip.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: January 7, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Jung Hwa Jung
  • Publication number: 20190157519
    Abstract: Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.
    Type: Application
    Filed: January 22, 2019
    Publication date: May 23, 2019
    Inventors: Jung Hwa JUNG, Seoung Ho JUNG, Sung Ki HWANG
  • Patent number: 10236421
    Abstract: Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: March 19, 2019
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Jung Hwa Jung, Seoung Ho Jung, Sung Ki Hwang
  • Patent number: 10091850
    Abstract: A backlight unit includes a backlight module with a printed circuit board including blocks and MJT LEDs disposed on the blocks, respectively and a backlight control module generating a signal for drive control of each of the blocks, wherein each of the blocks comprises at least one MJT LED, and the backlight control module includes a drive controller for On/Off control and dimming control of each of the blocks.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: October 2, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Young Jun Song, Jung Hwa Jung, Eun Ju Kim
  • Patent number: 10054731
    Abstract: A light source module including a circuit board, a first light emitting device mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), a reflective portion disposed on the circuit board and having at least one recess accommodating the first light emitting device, and a bonding member disposed between the circuit board and the reflective portion. The reflective portion has a height greater than a height of the first light emitting device.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: August 21, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seoung Ho Jung, Jung Hwa Jung, Ki Bum Nam
  • Patent number: 10051705
    Abstract: A backlight unit includes a backlight module with a printed circuit board including blocks and MJT LEDs disposed on the blocks, respectively and a backlight control module generating a signal for drive control of each of the blocks, wherein each of the blocks comprises at least one MJT LED, and the backlight control module includes a drive controller for On/Off control and dimming control of each of the blocks.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: August 14, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Young Jun Song, Jung Hwa Jung, Eun Ju Kim
  • Patent number: 10043955
    Abstract: A light-emitting diode (LED) includes a substrate, a semiconductor stacked structure disposed on the substrate, the semiconductor stacked structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, a wavelength converting layer configured to convert a wavelength of light emitted from the semiconductor stacked structure, the wavelength converting layer covering side surfaces of the substrate and the semiconductor stacked structure, and a distributed Bragg reflector (DBR) configured to reflect at least a portion of light wavelength-converted by the wavelength converting layer, in which at least a portion of the DBR is covered with a metal layer configured to reflect light transmitted through the DBR.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: August 7, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Jung Hwa Jung, Bang Hyun Kim
  • Publication number: 20180160496
    Abstract: A backlight unit includes a backlight module with a printed circuit board including blocks and MJT LEDs disposed on the blocks, respectively and a backlight control module generating a signal for drive control of each of the blocks, wherein each of the blocks comprises at least one MJT LED, and the backlight control module includes a drive controller for On/Off control and dimming control of each of the blocks.
    Type: Application
    Filed: January 17, 2018
    Publication date: June 7, 2018
    Inventors: Young Jun SONG, Jung Hwa JUNG, Eun Ju KIM
  • Patent number: 9910203
    Abstract: A light source including a circuit board, at least one light emitting device mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), and a reflective portion formed on the circuit board and enclosing the light emitting device. The reflective portion formed on the circuit board reflects light emitted from the light emitting device in one direction, to reduce light loss while focusing light in a desired direction.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: March 6, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seoung Ho Jung, Jung Hwa Jung, Ki Bum Nam
  • Publication number: 20180026254
    Abstract: Disclosed herein are an electrode assembly including a plurality of unit cells arranged in a height direction on the basis of a plane, at least two of the unit cells having different planar sizes, and a space portion defined by the difference in planar size between the arranged unit cells, wherein each of the unit cells includes at least one electrode plate, electrode tabs protruding from the electrode plates of the unit cells are electrically connected to an electrode lead via a tab-lead coupling part, and the tab-lead coupling part is located in the space portion, and a battery cell including the same.
    Type: Application
    Filed: January 28, 2016
    Publication date: January 25, 2018
    Applicant: LG Chem, Ltd.
    Inventors: Sei Woon Oh, Seong Yoon Lim, Hyun Min Kim, Jung Ah Shim, Ho Sub Lee, Jung Hwa Jung
  • Publication number: 20180006198
    Abstract: A light-emitting diode (LED) includes a substrate, a semiconductor stacked structure disposed on the substrate, the semiconductor stacked structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, a wavelength converting layer configured to convert a wavelength of light emitted from the semiconductor stacked structure, the wavelength converting layer covering side surfaces of the substrate and the semiconductor stacked structure, and a distributed Bragg reflector (DBR) configured to reflect at least a portion of light wavelength-converted by the wavelength converting layer, in which at least a portion of the DBR is covered with a metal layer configured to reflect light transmitted through the DBR.
    Type: Application
    Filed: September 13, 2017
    Publication date: January 4, 2018
    Inventors: Jung Hwa JUNG, Bang Hyun KIM
  • Publication number: 20170347418
    Abstract: A backlight unit includes a backlight module with a printed circuit board including blocks and MJT LEDs disposed on the blocks, respectively and a backlight control module generating a signal for drive control of each of the blocks, wherein each of the blocks comprises at least one MJT LED, and the backlight control module includes a drive controller for On/Off control and dimming control of each of the blocks.
    Type: Application
    Filed: August 16, 2017
    Publication date: November 30, 2017
    Inventors: Young Jun SON, Jung Hwa JUNG, Eun Ju KIM
  • Patent number: 9793448
    Abstract: A light-emitting diode (LED) includes a substrate, a semiconductor stacked structure disposed on the substrate, the semiconductor stacked structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, a wavelength converting layer configured to convert a wavelength of light emitted from the semiconductor stacked structure, the wavelength converting layer covering side surfaces of the substrate and the semiconductor stacked structure, and a distributed Bragg reflector (DBR) configured to reflect at least a portion of light wavelength-converted by the wavelength converting layer, in which at least a portion of the DBR is covered with a metal layer configured to reflect light transmitted through the DBR.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: October 17, 2017
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Jung Hwa Jung, Bang Hyun Kim
  • Patent number: 9786827
    Abstract: A light-emitting diode package includes a package body. The package body includes an upper insulation substrate including upper conductive patterns, a lower insulation substrate including lower conductive patterns, and middle conductive patterns disposed between the upper insulation substrate and the lower insulation substrate. The package body also includes an upper via disposed in the upper insulation substrate, a lower via disposed in the lower insulation substrate, the upper via and the lower via not overlaid with each other.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: October 10, 2017
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Jung Hwa Jung, Hee Tak Oh, Do Hyung Kim, You Jin Kwon, Oh Sug Kim