Abstract: Provided are a positive electrode active material for improving an output and a lithium secondary battery including the same. Particularly, graphite and conductive carbon which have shapes and sizes different from each other, may be simultaneously coated on a mixed positive electrode material of a 3-component system lithium-containing metal oxide having a layered structure and expressed as following Chemical Formula 1 and LiFePO4 having an olivine structure as an conductive material to improve high resistance occurrence and conductivity reduction phenomenon of a 3-component system lithium metal oxide due to a difference between particle sizes and surface areas of the 3-component system lithium-containing metal oxide and LiFePO4 olivine. Li1+aNixCoyMn1-x-yO2, 0?a<0.5, 0<x<1, 0<y<0.

Abstract: An image sensor package including a PCB including bonding areas, an image sensor including bonding pads on edge portions thereof on the PCB, bonding wires connecting the bonding pads with the bonding areas, an insulating adhesion film attaching the bonding wires to the bonding pads on the edge portions of the image sensor, a heat spread pattern spaced apart from the bonding wires and the image sensor on the insulating adhesion film, a supporting holder spaced apart from the edge portions of the image sensor, encloses the image sensor, contacts a top surface of the heat spread pattern and the PCB, and includes a supporting portion at an upper portion thereof, and a transparent cover covering the image sensor on the supporting portion of the supporting holder and spaced apart from the top surface of the image sensor is provided.

Abstract: Semiconductor test devices and methods for fabricating the same may be provided. The semiconductor test device may include a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell. The first thermal test flip chip cell may include a plurality of first bumps arranged on a bottom surface of the first thermal test flip chip cell and be configured to be electrically connected to the first heater and the first sensor. The test substrate may include a first ball array arranged on a bottom surface of the test substrate in a first direction and be configured to be electrically connected to the plurality of first bumps, which are electrically connected to the first heater and the first sensor.

Abstract: The present invention relates to polymer-silicon composite particles using silicon having high energy density, a method of making the same, an anode and a lithium secondary battery including the same. The silicon having high energy density is used as an anode active material to provide a lithium secondary battery having large capacity. Silicon-polymer composite particles having a metal plated on the surface thereof are provided to solve the problem that silicon has low electrical conductivity and a method of preparing the same is provided to produce an electrode having improved electrical conductivity. Furthermore, silicon-polymer composite particles having a metal coated on the surface thereof through electroless plating are prepared and an electrode is formed using the silicon-polymer composite particles.

Abstract: A rechargeable battery includes an electrode assembly having a plurality of first electrodes each including a first coated region coated with a first active material and a first uncoated region having a first alignment opening and a second alignment opening, a plurality of second electrodes each including a second coated region coated with a second active material and a second uncoated region having a third alignment opening and a fourth alignment opening, a separator between each first coated region and each second coated region; and a case housing the electrode assembly, wherein the first alignment openings are substantially aligned with each other, the second alignment openings are substantially aligned with each other, the third alignment openings are substantially aligned with each other, and the fourth alignment openings are substantially aligned with each other.

Abstract: In an apparatus for laser alignment and a method of aligning laser using the same, the apparatus for laser alignment is used in a radiation therapy system. The radiation therapy system includes a rotatable gantry having a radiation source generating radiation, a radiation shaping unit and a crosshair indicating a radiation field center, a couch on which a patient is disposed and a laser device disposed adjacent to the gantry to irradiate a laser for aiming. A light source irradiates light being mounted in the gantry. The couch is disposed adjacent to the gantry. Position and direction of the couch are controllable. The apparatus for laser alignment includes the plural alignment marks spaced apart from each other to be projected, thereby simultaneously checking alignment status by the irradiation of the light in at least one direction; and a level and a level adjusting part.

Abstract: A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

Abstract: Provided is an image sensor having a depth sensor. The image sensor includes a substrate including a visible light region and a non-visible light region, a first well and a second well having a first conductivity type and in the non-visible light perception region, and a first gate and a second gate configured to receive voltages of opposite phases, respectively, and apply voltages to the first well and the second well, respectively.

Abstract: A rechargeable battery is disclosed.

Abstract: In a heat slug and a semiconductor package including the same, the heat slug includes a thermal conductive body having an active face and a dissipating face opposite to the active face, a dielectric layer covering the active face of the body, at least one thermoelectric element arranged on the dielectric layer and a conductive pattern arranged on the dielectric layer and electrically connected to the thermoelectric element. The electrical characteristics of the thermoelectric element are interacted with heat generated from a heat source.

Abstract: A semiconductor package and an electronic system including the same include a package board having an electric circuit pattern. A semiconductor chip is mounted on the package board and electrically connected with the circuit pattern of the package board. A non-contact temperature detector is provided with the semiconductor package and detects a temperature of an external heat source without making contact with the external heat source. A temperature controller controls the semiconductor chip according to the temperature of the external heat source that is detected by the non-contact temperature detector.

Abstract: Semiconductor test devices and methods for fabricating the same may be provided. The semiconductor test device may include a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell. The first thermal test flip chip cell may include a plurality of first bumps arranged on a bottom surface of the first thermal test flip chip cell and be configured to be electrically connected to the first heater and the first sensor. The test substrate may include a first ball array arranged on a bottom surface of the test substrate in a first direction and be configured to be electrically connected to the plurality of first bumps, which are electrically connected to the first heater and the first sensor.

Abstract: A high sensitivity image sensor including a pixel, the pixel including a single electron field effect transistor (SEFET), the SEFET including a first conductive type well in a second conductive type substrate, second conductive type source and drain regions in the well and a first conductive type gate region in the well between the source and the drain regions.

Abstract: Disclosed is a composition for preventing and treating acetaminophen induced liver injury including the protein extracted from Porphyra yezoensis. The protein(s), separated and purified from hot water extracts of Porphyra yezoensis, having the molecular weight of 14 kDa measured by sodium dodecyl sulfate polyacrylamide gel electrophoresis, has an excellent effect for inhibiting the oxidative injury of liver tissue and cell apoptosis of liver cells induced by acetaminophen.

Abstract: An image sensor package including a PCB including bonding areas, an image sensor including bonding pads on edge portions thereof on the PCB, bonding wires connecting the bonding pads with the bonding areas, an insulating adhesion film attaching the bonding wires to the bonding pads on the edge portions of the image sensor, a heat spread pattern spaced apart from the bonding wires and the image sensor on the insulating adhesion film, a supporting holder spaced apart from the edge portions of the image sensor, encloses the image sensor, contacts a top surface of the heat spread pattern and the PCB, and includes a supporting portion at an upper portion thereof, and a transparent cover covering the image sensor on the supporting portion of the supporting holder and spaced apart from the top surface of the image sensor is provided.

Abstract: A multi-chip package comprises a semiconductor chip stack structure comprising a semiconductor chip stack including a first semiconductor chip having a first power rating and a second semiconductor chip having a second power rating, the first and second semiconductor chips being stacked one on top of another; and a heat transfer blocking spacer interposed between the first semiconductor chip and the second semiconductor chip.

Abstract: Provided are an antifuse and methods of operating and manufacturing the same. The antifuse may include first and second conductors separate from each other; a dielectric layer for an antifuse between the first and second conductors; and a diffusion layer between one of the first and second conductors and the dielectric layer.

Abstract: A heat sink includes a first adhesive layer, and a heat dissipation layer disposed on the first adhesive layer, and has ventilation ports that extend therethrough including through the first adhesive layer and the heat dissipation layer. The heat sink forms an outermost part of a semiconductor package. Thus, when the heat sink is bonded via its adhesive layer to underlying structure during a manufacturing process, the ventilation ports allow air to pass therethrough. As a result, air is not trapped in the form of bubbles between the heat sink and the underlying structure.

Abstract: A high sensitivity image sensor including a pixel, the pixel including a single electron field effect transistor (SEFET), the SEFET including a first conductive type well in a second conductive type substrate, second conductive type source and drain regions in the well and a first conductive type gate region in the well between the source and the drain regions.

Abstract: An image sensor device may include a dual-gated charge storage region within a substrate. The dual-gated charge storage region includes first and second diodes within a common charge generating region. This charge generating region is configured to receive light incident on a surface of the image sensor device. The first and second diodes include respective first conductivity type regions responsive to first and second gate signals, respectively. These first and second gate signals are active during non-overlapping time intervals.