Abstract: A jig device for laser welding of the disclosure includes a jig body having a semi-oval shaped seating groove in which a lower side of a refrigerant pipe to which a charging port is coupled is seated; a first pressing block provided in an upper portion of one side of the jig body and having a first groove part configured to press an upper portion of one side of the refrigerant pipe and an upper portion of one side of a fixing part of the charging port at a lower surface thereof; and a second pressing block provided at an upper portion of the other side of the jig body and having a second groove part configured to press an upper portion of the other side of the refrigerant pipe and an upper portion of the other side of the fixing part of the charging port at a lower surface thereof.

Abstract: A semiconductor apparatus includes a calibration circuit, a selection circuit, and a data circuit. The calibration circuit generates a plurality of calibration signals by being coupled to a plurality of reference resistors. The selection circuit selects at least one signal among the plurality of calibration signals on the basis of an impedance setting signal. The data circuit sets an impedance based on the selected calibration signal.

Abstract: An exhaust gas treatment device including an outer housing including a first inflow part and a second inflow part, an inner housing provided in the outer housing and having a gas inflow part, a guide channel defined between the outer housing and the inner housing and configured to guide a part of the first exhaust gas to the gas inflow part, and a spiral member including a barrel part provided in the inner housing and configured to define a passage flow path, a spiral protrusion provided on an outer surface of the barrel part and configured to define a spiral flow path between the barrel part and the inner housing, and a gas discharge part provided in the barrel part and configured to discharge the first exhaust gas and the second exhaust gas, which have passed through the spiral flow path, to the passage flow path.

Abstract: A semiconductor apparatus includes a calibration circuit, a selection circuit, and a data circuit. The calibration circuit generates a plurality of calibration signals by being coupled to a plurality of reference resistors. The selection circuit selects at least one signal among the plurality of calibration signals on the basis of an impedance setting signal. The data circuit sets an impedance based on the selected calibration signal.

Abstract: A semiconductor apparatus includes a calibration circuit, a selection circuit, and a data circuit. The calibration circuit generates a plurality of calibration signals by being coupled to a plurality of reference resistors. The selection circuit selects at least one signal among the plurality of calibration signals on the basis of an impedance setting signal. The data circuit sets an impedance based on the selected calibration signal.

Abstract: Provided is a display device including a substrate, a light-emitting element disposed on the substrate and configured to emit light, a photoelectric conversion element configured to detect incident light, and a window disposed on the light-emitting element and the photoelectric conversion element and configured to transmit light. The window includes a plurality of through holes that overlap the photoelectric conversion element in a thickness direction of the substrate, and a filling member disposed in the plurality of through holes.

Abstract: A jig device for laser welding of the disclosure inclides a jig body having a semi-oval shaped seating groove in which a lower side of a refrigerant pipe to which a charging port is coupled is seated: a first pressing block provided in an upper portion of one side of the jig body and having a first groove part configured to press an upper portion of one side of the refrigerant pipe and an upper portion of one side of a fixing part of the charging port at a lower surface thereof; and a second pressing block provided at an upper portion of the other side of the jig body and having a second groove part configured to press an upper portion of the other side of the refrigerant pipe and an upper portion of the other side of the fixing part of the charging port at a lower surface thereof.

Abstract: An image forming apparatus includes a detection sensor to irradiate light to a recording medium passing through a printing path, and detect an amount of light, a driving device to move a cleaning member to a cleaning region overlapping the printing path to clean a light window of the detection sensor, and a processor to confirm a position of the cleaning member based on the amount of light detected by the detection sensor and control the driving device to move the cleaning member based on the confirmed position.

Abstract: A semiconductor apparatus includes a calibration circuit, a selection circuit, and a data circuit. The calibration circuit generates a plurality of calibration signals by being coupled to a plurality of reference resistors. The selection circuit selects at least one signal among the plurality of calibration signals on the basis of an impedance setting signal. The data circuit sets an impedance based on the selected calibration signal.

Abstract: An image forming device includes: a print engine to form an image on a medium, a sensor to irradiate light onto the medium and to detect an amount of light transmitted through the medium, and a processor to control the print engine based on the detected transmitted light amount and temperature data.

Abstract: A resonator divides and forms a sound attenuation space and maintains airtightness without external force. The resonator includes a tubular cover body and having a hollow portion with different diameters, a tubular insert inserted into the cover body and having second hollow portion that turbocharger air is introduced into the second hollow portion, the air being guided into the first hollow portion on an outer surface of the insert body; and one or more space partition members coupled to the outer surface of the insert body to form airtight noise attenuation spaces. The partition members are ring shaped, and each space partition member is formed of a resilient material, and each space partition member has a contact portion formed by an inclined surface to be in contact with the inner surface of the cover body in a direction in which the insert body is inserted into the cover body.

Abstract: A replaceable double-type probe pin is proposed. The double-type probe pin includes: a support having upper and lower coupling portions disposed at both ends of a supporting bar to face each other; an upper plunger detachably coupled to the upper coupling portion and being able to reciprocate up and down when coupled; a lower plunger detachably coupled to the lower coupling portion and being able to reciprocate up and down when coupled; and a coil spring disposed between the upper and lower plungers and pressing the upper and lower plungers in opposite directions.

Abstract: A replaceable single-type probe pin is proposed. The probe pin includes: a support having upper and lower coupling portions disposed at both ends of a supporting bar to face each other; an upper plunger detachably coupled to the upper coupling portion; a lower plunger detachably coupled to the lower coupling portion; and a coil spring disposed between the upper and lower plungers and pressing the upper and lower plungers in opposite directions, in which any one of the upper and lower plungers can reciprocate in an elasticity direction of the coil spring.

Abstract: An input/output circuit includes a data buffer group configured to buffer data received through data lines, a data strobe buffer configured to buffer a data strobe signal to output a buffered data strobe clock, a digitally controlled delay line configured to output delay data by controlling skew of the buffered data according to a delay code, a data strobe clock output circuit configured to generate a delay data strobe clock in response to the buffered data strobe clock, a sampler configured to sample the delay data according to the delay data strobe clock to output sampled data, and a de-skew circuit configured to update the delay code according to the sampled data.

Abstract: A quick connector assembly configured to, when a coupling case is separated from an outer case, airtightness may be maintained without fully separating the fixing member. The quick connector assembly includes an tubular outer case having a hollow portion, a coupling case inserted into the hollow portion to be connected to the outer case so as to allow fluid flow, an airtightness maintaining member provided inside the hollow portion and coupled to an outer surface of the coupling case to maintain airtightness between the coupling case and the outer case, and a fixing member detachably fitted from an outside of the outer case to fix the coupling case inserted into the hollow portion by elasticity thereof, wherein the fixing member is introduced toward the hollow portion from outside of the outer case to thereby fix an outer surface of the coupling case located inside the hollow portion by compression.

Abstract: A resonator divides and forms a sound attenuation space and maintains airtightness without external force. The resonator includes a tubular cover body and having a hollow portion with different diameters, a tubular insert inserted into the cover body and having second hollow portion that turbocharger air is introduced into the second hollow portion, the air being guided into the first hollow portion on an outer surface of the insert body; and one or more space partition members coupled to the outer surface of the insert body to form airtight noise attenuation spaces. The partition members are ring shaped, and each space partition member is formed of a resilient material, and each space partition member has a contact portion formed by an inclined surface to be in contact with the inner surface of the cover body in a direction in which the insert body is inserted into the cover body.

Abstract: An input/output circuit includes a data buffer group configured to buffer data received through data lines, a data strobe buffer configured to buffer a data strobe signal to output a buffered data strobe clock, a digitally controlled delay line configured to output delay data by controlling skew of the buffered data according to a delay code, a data strobe clock output circuit configured to generate a delay data strobe clock in response to the buffered data strobe clock, a sampler configured to sample the delay data according to the delay data strobe clock to output sampled data, and a de-skew circuit configured to update the delay code according to the sampled data.

Abstract: An image forming apparatus and a communication connection method thereof. The communication connection method includes: receiving, by a first image forming apparatus, packet information from a second image forming apparatus; measuring, by the first image forming apparatus, a signal strength of the received packet information; and changing a connection reference strength of the first image forming apparatus based on the measured signal strength.

Abstract: An image forming apparatus and a communication connection method thereof. The communication connection method includes: receiving, by a first image forming apparatus, packet information from a second image forming apparatus; measuring, by the first image forming apparatus, a signal strength of the received packet information; and changing a connection reference strength of the first image forming apparatus based on the measured signal strength.

Abstract: A semiconductor fuse box includes a fuse structure and a protective structure disposed between the fuse structure and an integrated circuit structure. The protective structure has at least one irregular side surface. The protective structure (which may also include a pad formed there-under) extends beyond a bottom of the fuse structure. Such an irregular side surface and such an extension of the protective structure minimize propagation of damaging energy to the adjacent integrated circuit structure when a laser beam is directed to the fuse structure.