Abstract: An antenna for transfer of information or energy is described. The antenna includes an electrically conductive first layer having a width in a thickness direction of the antenna and extending longitudinally along a length of the first layer between first and second longitudinal ends of the first layer, and an electrically insulative thermally conductive second layer bonded to the first layer along the length of the first layer. The first and second layers are wound to form a plurality of substantially concentric loops. A width and a length of the second layer are substantially co-extensive with the respective width and length of the first layer so as to expose opposing longitudinal edge surfaces of the first layer along the length of the first layer. Coils and assemblies useful for making coils are also described.

Abstract: The present disclosure relates to an electronic assembly.

Abstract: An antenna includes a self-supporting electrically conductive wire having a width (W) and extending longitudinally along a length and between first and second ends of the conductive wire. The conductive wire forms one or more loops and comprises an electrically conductive layer disposed on and aligned with an adhesive layer. A width and a length of each of the conductive and adhesive layers are substantially co-extensive with the width and the length of the conductive wire.

Abstract: A multilayer tape according to an embodiment of the present disclosure includes: an adhesive layer including an epoxy; and an electromagnetic interference (EMI) absorption layer disposed on the adhesive layer and including a thermoset epoxy resin and a plurality of magnetic metal particles which are distributed in the thermoset epoxy resin, and the magnetic metal particles include iron, and a ratio of a gross weight of the plurality of magnetic metal particles to a gross weight of the EMI absorption layer is higher than bout 40%, and a peel strength of the adhesive layer and the EMI absorption layer after the adhesive layer is cured is about 5 times or more greater than a peel strength of the adhesive layer and the EMI absorption layer before the adhesive layer is cured.

Abstract: A magnetic film includes iron and copper distributed between opposing first and second major surfaces of the magnetic film. The copper has a first atomic concentration C1 at a first depth d1 from the first major surface and a peak second atomic concentration C2 at a second depth d2 from the first major surface, d2>d1, C2/C1?5.

Abstract: According to an embodiment of the present invention, an electronic assembly comprises: a circuit board including a plurality of connection parts having electrical conductivity; a plurality of spaced apart semiconductor integrated circuits mounted on the circuit board and electrically connected to the plurality of connection parts; a protective layer disposed on the plurality of semiconductor integrated circuits, substantially surrounding the semiconductor integrated circuits, and having a flat upper surface; and a heat spreading copper layer disposed on the protective layer, having an average thickness greater than or equal to about 3 microns, and an average grain size greater than about 0.15 micron, wherein the heat spreading copper layer may occupy substantially the same space in a length and a width as the circuit board (coextensive), and the average thickness of the protective layer may be equal to or greater than the height of the plurality of spaced apart semiconductor integrated circuits.

Abstract: An electronic assembly includes a circuit board including a plurality of electrically conductive traces, a cover layer disposed on the circuit board, and a plurality of antenna assemblies disposed on a major top surface of the cover layer and exposing the major top surface therebetween. Each of the antenna assemblies includes an antenna and an adhesive layer bonding the antenna to the major top surface of the cover layer. The antenna is electrically coupled to a corresponding different trace in the plurality of traces. The adhesive layers in the antenna assemblies have substantially a same first composition and a same average first thickness. The antennas in the antenna assemblies have substantially a same second composition and a same average second thickness greater than about 5 microns. The electronic assembly can be singulated to provide antenna assemblies. Methods of making the assemblies are also described.

Abstract: An antenna for transfer of information or energy is described. The antenna includes an electrically conductive first layer having a width in a thickness direction of the antenna and extending longitudinally along a length of the first layer between first and second longitudinal ends of the first layer, and an electrically insulative thermally conductive second layer bonded to the first layer along the length of the first layer. The first and second layers are wound to form a plurality of substantially concentric loops. A width and a length of the second layer are substantially co-extensive with the respective width and length of the first layer so as to expose opposing longitudinal edge surfaces of the first layer along the length of the first layer. Coils and assemblies useful for making coils are also described.

Abstract: A magnetic film includes iron and copper distributed between opposing first and second major surfaces of the magnetic film. The copper has a first atomic concentration C1 at a first depth d1 from the first major surface and a peak second atomic concentration C2 at a second depth d2 from the first major surface, d2>d1, C2/C1?5.

Abstract: The present disclosure relates to a coil assembly. According to a first embodiment of the present disclosure, there is provided a coil assembly including a coil including a multilayer film which is extended between a first longitudinal end and a second longitudinal end of the multilayer film, which are opposite to each other, and which is wound to form a plurality of loops which are substantially concentric, wherein the multilayer film includes: cut edges which are extended between the first longitudinal end and the second longitudinal end, and are opposite to each other and are substantially parallel to each other; a metal layer; and a magnetic layer disposed on the metal layer, wherein, at one or more of the first longitudinal end and the second longitudinal end of the multilayer film, the metal layer is electrically connected to a conductive terminal.

Abstract: A magnetic film assembly includes a coil having a plurality of turns defining a first major boundary surface of the coil, such that when energized, the coil generates an in-plane magnetic field component in a region of interest in air proximate and substantially parallel to the first major boundary surface, the in-plane magnetic field component having a magnetic field strength H that varies between a maximum Hmax and about 10% of Hmax in the region of interest in air; and a magnetic layer disposed on the coil so as to include the region of interest, such that when energized, the coil generates a magnetic field inducing an in-plane magnetic flux density B in the magnetic layer in the region of interest that varies less than about 5% in the region of interest.

Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer.

Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer.

Abstract: A magnetic film includes one or more magnetically conductive layers. Each magnetically conductive layer is cracked to form a plurality of first through-cracks defining a plurality of magnetically conductive segments. The first through-cracks extend along a first direction and form a first regular pattern along an orthogonal second direction at a first pitch P1, such that a Fourier transform of the first regular pattern has a first peak along the second direction at a first spatial frequency corresponding to the first pitch P1. The first through-cracks have an average length L1 along the first direction. L1/P1 is greater than or equal to 5.

Abstract: Fluid monitoring devices (100,200,700) including an impedance sensing element (110,210,410,510,610,710,61,62,63) are provided. The impedance sensing element (110,210,410,510,610,710,61,62,63) includes a calibration portion (212, 412, 512, 612, 712) and a measurement portion (214,414,514,614,714), and the fluid monitoring devices (100,200,700) can be self-calibrated in real time based on calibration data from the calibration portion (212,412,512,612,712).

Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer.

Abstract: A method for manufacturing a magnetic tape includes the steps of forming a thin film magnetic layer including at least one metal ribbon sheet, adhering a cover film layer to one side surface of the thin film magnetic layer through a first adhesive layer, performing flaking on the metal ribbon sheet included in the thin film magnetic layer to which the cover film layer is adhered, and adhering a conductive layer to the other side surface of the thin film magnetic layer, which includes the at least one metal ribbon sheet undergone the flaking, through a second adhesive layer, wherein the dividing includes dividing the thin film magnetic layer to provide a gap between adjacent fine pieces among the plurality of fine pieces by applying tension to the thin film magnetic layer in an extension direction of the magnetic shielding tape while the flaking is performed.

Abstract: A magnetic film includes iron and copper distributed between opposing first and second major surfaces of the magnetic film. The copper has a first atomic concentration C1 at a first depth d1 from the first major surface and a peak second atomic concentration C2 at a second depth d2 from the first major surface, d2>d1, C2/C1?5.

Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer.

Abstract: A magnetic film includes iron and copper distributed between opposing first and second major surfaces of the magnetic film. The copper has a first atomic concentration C1 at a first depth d1 from the first major surface and a peak second atomic concentration C2 at a second depth d2 from the first major surface, d2>d1, C2/C1?5.