Patents by Inventor Jung-Ju Suh

Jung-Ju Suh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10952357
    Abstract: The Internet of Things (IoT)-based receiver according to an aspect of the present disclosure includes a signal receive unit that receives a signal from a base station, which supports one IoT mode among a plurality of IoT modes, a mode determination unit determinates the IoT mode that is supported by the base station based on the received signal, and a function unit that processes a function related to IoT-based communication, supports each of the plurality of IoT modes, and operates based on the IoT mode, which is supported by the base station, among the plurality of IoT modes that is determined by the mode determination unit.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: March 16, 2021
    Assignee: 3M Innovative Properties Company
    Inventors: Seong-Woo Woo, Jinbae Kim, Jung Ju Suh
  • Publication number: 20210076547
    Abstract: A shielding tape according to an embodiment of the present disclosure includes a plurality of shielding members discrete from one another on a same plane, and, when the shielding tape is stretched in a first direction which is perpendicular to a thickness direction of the shielding tape, a distance between at least a portion of the shielding members increases, and a distance between the other portion of the shielding members is reduced.
    Type: Application
    Filed: May 7, 2019
    Publication date: March 11, 2021
    Inventors: Seong-Woo Woo, Jung-Ju Suh
  • Publication number: 20210005371
    Abstract: A magnetic film includes one or more magnetically conductive layers. Each magnetically conductive layer is cracked to form a plurality of first through-cracks defining a plurality of magnetically conductive segments. The first through-cracks extend along a first direction and form a first regular pattern along an orthogonal second direction at a first pitch P1, such that a Fourier transform of the first regular pattern has a first peak along the second direction at a first spatial frequency corresponding to the first pitch P1. The first through-cracks have an average length L1 along the first direction. L1/P1 is greater than or equal to 5.
    Type: Application
    Filed: June 18, 2020
    Publication date: January 7, 2021
    Inventors: Jinwook Kim, Seong-Woo Woo, Jung Ju Suh, Matthew R.C. Atkinson
  • Publication number: 20200303320
    Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer.
    Type: Application
    Filed: March 18, 2020
    Publication date: September 24, 2020
    Inventors: Jiwoong Kong, Jung Ju Suh, Seong-Woo Woo
  • Publication number: 20200170151
    Abstract: The Internet of Things (IoT)-based receiver according to an aspect of the present disclosure includes a signal receive unit that receives a signal from a base station, which supports one IoT mode among a plurality of IoT modes, a mode determination unit determinates the IoT mode that is supported by the base station based on the received signal, and a function unit that processes a function related to IoT-based communication, supports each of the plurality of IoT modes, and operates based on the IoT mode, which is supported by the base station, among the plurality of IoT modes that is determined by the mode determination unit.
    Type: Application
    Filed: January 30, 2020
    Publication date: May 28, 2020
    Inventors: Seong-Woo Woo, Jinbae Kim, Jung Ju Suh
  • Patent number: 10588250
    Abstract: The present disclosure relates to a magnetic shielding tape, which is capable of shielding a high-to-low frequency of a signal transmitted through a cable in shielding of a magnetic field which flows in such a cable or is emitted therefrom, and a method for manufacturing the same. The basic magnetic shielding tape comprises: —a thin film magnetic layer including at least one metal ribbon sheet which is divided into a plurality of fine pieces by flaking process, and a gap provided between adjacent fine pieces among the plurality of fine pieces; —a cover film layer adhered to one side surface of the thin film magnetic layer through a first adhesive layer; and—a conductive layer adhered to the other side surface of the thin film magnetic layer through a second adhesive layer, wherein a size of the gap is determined according to a frequency band of the signal.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: March 10, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Seong-Woo Woo, Jinbae Kim, Jung-Ju Suh
  • Publication number: 20190334223
    Abstract: An antenna includes a self-supporting electrically conductive wire having a width (W) and extending longitudinally along a length and between first and second ends of the conductive wire. The conductive wire forms one or more loops and comprises an electrically conductive layer disposed on and aligned with an adhesive layer. A width and a length of each of the conductive and adhesive layers are substantially co-extensive with the width and the length of the conductive wire.
    Type: Application
    Filed: June 21, 2016
    Publication date: October 31, 2019
    Inventors: Ya-Peng Fang, Jinbae Kim, Jung-ju Suh, Jeongwan Choi, Minji Kim
  • Patent number: 10401238
    Abstract: In some examples, a sensor comprises a circuit including an inductor. The inductor comprises an inductor layer, a reference layer comprising at least one of an electrically conductive material or a magnetic material, and a variable layer formed between the reference layer and inductor layer. A thickness of the variable layer may be configured to change upon application of a force external to the variable layer thereby causing a change in position of the reference layer relative the inductor layer, and the change in position of the reference layer relative the inductor layer changes an inductance of the inductor. The sensor may be configured to detect the force based on the change in inductance of the inductor.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: September 3, 2019
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Andrew P. Bonifas, Jaewon Kim, Jung-Ju Suh
  • Publication number: 20190098805
    Abstract: The present disclosure relates to a magnetic shielding tape, which is capable of shielding a high-to-low frequency of a signal transmitted through a cable in shielding of a magnetic field which flows in such a cable or is emitted therefrom, and a method for manufacturing the same. The basic magnetic shielding tape comprises: —a thin film magnetic layer including at least one metal ribbon sheet which is divided into a plurality of fine pieces by flaking process, and a gap provided between adjacent fine pieces among the plurality of fine pieces; —a cover film layer adhered to one side surface of the thin film magnetic layer through a first adhesive layer; and—a conductive layer adhered to the other side surface of the thin film magnetic layer through a second adhesive layer, wherein a size of the gap is determined according to a frequency band of the signal.
    Type: Application
    Filed: March 30, 2017
    Publication date: March 28, 2019
    Inventors: Seong-Woo Woo, Jinbae Kim, Jung-Ju Suh
  • Patent number: 10104763
    Abstract: Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: October 16, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: Mihee Lee, Jung-Ju Suh
  • Publication number: 20180249599
    Abstract: A system includes a curved circuit board with at least one electronic component mounted on the circuit board and electrically connected to a first electrically conductive trace of the circuit board. The system includes an electrically conductive curved fence conformably attached to the circuit board and surrounding the at least one electronic component. The fence is electrically connected to a different second electrically conductive trace of the circuit board. The system further includes an electrically conductive lid conformably attached to a top side of the fence. The electrically conductive lid covers the at least one electronic component. The fence comprises a plurality of spaced apart first tabs arranged along at least a first portion of a perimeter of the fence. Each first tab has a free end and is attached to the electrically conductive lid or the circuit board.
    Type: Application
    Filed: September 19, 2016
    Publication date: August 30, 2018
    Inventors: Jin-Bae Kim, Jung-Ju Suh, Jeongwan Choi
  • Publication number: 20180202873
    Abstract: In some examples, a sensor comprises a circuit including an inductor. The inductor comprises an inductor layer, a reference layer comprising at least one of an electrically conductive material or a magnetic material, and a variable layer formed between the reference layer and inductor layer. A thickness of the variable layer may be configured to change upon application of a force external to the variable layer thereby causing a change in position of the reference layer relative the inductor layer, and the change in position of the reference layer relative the inductor layer changes an inductance of the inductor. The sensor may be configured to detect the force based on the change in inductance of the inductor.
    Type: Application
    Filed: February 23, 2015
    Publication date: July 19, 2018
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: ANDREW P. BONIFAS, JAEWON KIM, JUNG-JU SUH
  • Patent number: 9847577
    Abstract: Disclosed are a ferrite green sheet comprising a pattern formed in a top surface of the ferrite green sheet, a sintered ferrite sheet, a ferrite composite sheet comprising the same, and a conductive loop antenna module. The pattern comprises a plurality of grooves, each groove has a width W and a rounded shape bottom having a radius of curvature of R, wherein a ratio of W to R (W:R) is in the range of 1:0.1 to 1:0.5.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: December 19, 2017
    Assignee: 3M Innovative Properties Company
    Inventors: Eun-Kwang Hur, Jung-Ju Suh, Seungah Cho, Suk-Won Choi
  • Publication number: 20170251549
    Abstract: Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.
    Type: Application
    Filed: October 7, 2015
    Publication date: August 31, 2017
    Inventors: Mihee Lee, Jung-Ju Suh
  • Publication number: 20150349424
    Abstract: Disclosed are a ferrite green sheet comprising a pattern formed in a top surface of the ferrite green sheet, a sintered ferrite sheet, a ferrite composite sheet comprising the same, and a conductive loop antenna module. The pattern comprises a plurality of grooves, each groove has a width W and a rounded shape bottom having a radius of curvature of R, wherein a ratio of W to R (W:R) is in the range of 1:0.1 to 1:0.5.
    Type: Application
    Filed: December 2, 2013
    Publication date: December 3, 2015
    Inventors: Eun-Kwang Hur, Jung-Ju Suh, Seungah Cho, Suk-Won Choi
  • Publication number: 20110186324
    Abstract: Disclosed is an electromagnetic interference suppressing hybrid sheet including an electromagnetic wave absorbing layer including ferrite particles, which is laminated on one side of an electromagnetic wave shielding layer including an electro-conductive material, thereby protecting an electronic device from an electromagnetic wave generated from inside and/or outside of the electronic device.
    Type: Application
    Filed: September 2, 2009
    Publication date: August 4, 2011
    Inventors: Eun-Kwang Hur, Jung-Ju Suh, Jung-Hwan Lee