Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).

Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.

Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and a bridge substrate embedded in the package substrate. In an embodiment, first pads are over the package substrate, where the first pads have a first pitch, and second pads are over the bridge substrate, where the second pads have a second pitch that is smaller than the first pitch. In an embodiment, a barrier layer is over individual ones of the second pads. In an embodiment, reflown solder is over individual ones of the first pads and over individual ones of the second pads. In an embodiment, a first standoff height of the reflown solder over the first pads is equal to a second standoff height of the reflown solder over the second pads.

Abstract: Disclosed are an uncoating metallic thermoplastic resin composition invention including metallic particles at an appropriate ratio and a molded article including the same. The molded article may maintain the mechanical properties such as impact strength and fluidity at an excellent level as well as improving the appearance characteristics such as luminance characteristics (high luminance) and metallic texture. The uncoating metallic thermoplastic resin composition and the molded article thereof may be usefully applied to the molded products in fields where the characteristics of the appearance quality are importantly required, for example, cell phone housing, TV housing, computer monitor housing, automobile bumper, wheel housing, panel button portion, interior and exterior lighting lamp housings, and the like.

Abstract: The present invention relates to a non-coating thermoplastic resin composition, a method for manufacturing a molded article by using the same, and a molded article manufactured by the same. More specifically, the present invention is characterized by providing the thermoplastic resin composition which contains polycarbonate, polysiloxane-polycarbonate copolymer, polyester, master-batched carbon black, and additives in specific contents and the molded article, which has excellent chemical resistance, mechanical properties, light resistance, hydrolysis resistance, and low glossiness, manufactured by using the same.

Abstract: Disclosed is an asymmetrical half-bridge converter having high efficiency in a wide input voltage range. The converter may include a primary-side circuit including a first switch, a second switch, a primary-side capacitor, an additional inductor, and a primary-side magnetization inductor, and a secondary-side circuit including first and second diodes connected in series, first and second capacitors connected in series, a secondary-side rectification inductor having one end connected to the anode of the first diode and cathode of the second diode, and having the other end connected between the first and second capacitors connected in series, a first coupling inductor having one end connected to the cathode of the first diode and having the other end connected to the first capacitor, and a second coupling inductor having one end connected to the anode of the second diode and having the other end connected to the second capacitor.

Abstract: Disclosed are an electric vehicle capable of improving the charging efficiency of a charging apparatus by reducing the switching loss that may occur in the charging apparatus of an electric vehicle and a charging apparatus thereof. To this end, a power factor correction apparatus of an on board charger includes a first boost circuit receiving AC power through a first inductor to charge a load, a second boost circuit receiving the AC power through a second inductor to charge the load, and a third inductor provided between a leg of the first boost circuit and a leg of the second boost circuit so that parasitic capacitors of the first boost circuit and the second boost circuit are discharged.

Abstract: The present invention relates to a thermoplastic resin composition having excellent thermal stability and birefringence properties and to a molded article formed therefrom. In one embodiment, the thermoplastic resin composition includes: 100 parts by weight of a polycarbonate resin including a repeating unit represented by formula 1; about 0.2 parts by weight to about 15 parts by weight of an epoxy resin represented by formula 2; and about 1 part by weight to about 15 parts by weight of a phosphate-based compound, wherein formula 1 and formula 2 are as defined in the detailed description.

Abstract: Embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes directed to manufacturing a package having a substrate with a first side and a second side opposite the first side, where a copper layer is coupled with a first region of the first side of the substrate and includes a plurality of bumps coupled with the first region of the first side of the substrate where one or more second regions on the first side of the substrate not coupled with a copper layer, and where a layout of the one or more second regions on the first side of the substrate is to vary a growth, respectively, of each of the plurality of bumps during a plating process by modifying a local copper density of each of the plurality of bumps.

Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.

Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.

Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.

Abstract: Disclosed is an asymmetrical half-bridge converter having high efficiency in a wide input voltage range. The converter may include a primary-side circuit including a first switch, a second switch, a primary-side capacitor, an additional inductor, and a primary-side magnetization inductor, and a secondary-side circuit including first and second diodes connected in series, first and second capacitors connected in series, a secondary-side rectification inductor having one end connected to the anode of the first diode and cathode of the second diode, and having the other end connected between the first and second capacitors connected in series, a first coupling inductor having one end connected to the cathode of the first diode and having the other end connected to the first capacitor, and a second coupling inductor having one end connected to the anode of the second diode and having the other end connected to the second capacitor.

Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).

Abstract: The present invention relates to a method of preparing vascular endothelial cells by transforming (transdifferentiating) adult fibroblasts and a composition, which includes vascular endothelial cells prepared according to the method, for preventing and treating ischemic diseases, the method including a step of transducing adult fibroblasts with a gene. In particular, the present invention confirms that five factors, Foxo1, Er71, Klf2, Tal1, and Lmo2, induce transdifferentiation of adult fibroblasts into induced vascular endothelial cells. Furthermore, the present invention confirms that three factors, Er71, Klf2, and Tal1 induce transdifferentiation of human adult fibroblasts into induced vascular endothelial cells. The resultant induced endothelial cells enable lower limb salvaging by angiogenesis in lower limb ischemic animal models, showing that the induced endothelial cells can be effectively used for prevention or treatment of ischemic diseases.

Abstract: Disclosed are an electric vehicle capable of improving the charging efficiency of a charging apparatus by reducing the switching loss that may occur in the charging apparatus of an electric vehicle and a charging apparatus thereof. To this end, a power factor correction apparatus of an on board charger includes a first boost circuit receiving AC power through a first inductor to charge a load, a second boost circuit receiving the AC power through a second inductor to charge the load, and a third inductor provided between a leg of the first boost circuit and a leg of the second boost circuit so that parasitic capacitors of the first boost circuit and the second boost circuit are discharged.

Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.

Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.

Abstract: The present invention relates to a thermoplastic resin composition having excellent thermal stability and birefringence properties and to a molded article formed therefrom. In one embodiment, the thermoplastic resin composition includes: 100 parts by weight of a polycarbonate resin including a repeating unit represented by formula 1; about 0.2 parts by weight to about 15 parts by weight of an epoxy resin represented by formula 2; and about 1 part by weight to about 15 parts by weight of a phosphate-based compound, wherein formula 1 and formula 2 are as defined in the detailed description.