Abstract: Provided is a light emitting diode device. The light emitting diode device includes a light emitting diode chip having a first surface on which first and second electrodes are disposed, and a second surface opposing the first surface, a wavelength conversion portion including fluorescent substances and covering the first surface and side surfaces of the light emitting diode chip, wherein the side surfaces denote surfaces placed between the first and second surfaces, and first and second electricity connection portions each including a plating layer, respectively connected to the first and second electrodes, and exposed to the outside of the wavelength conversion portion. Accordingly, the light emitting diode device, capable of enhancing luminous efficiency and realizing uniform product characteristics in terms of the emission of white light, is provided. Further, a process for easily and efficiently manufacturing the above light emitting diode device is provided.

Abstract: A light source module, a backlight unit, a display apparatus, a television set, and an illumination apparatus are provided. The light source module includes: one or more light source units including a light emitting element emitting light when electricity is applied thereto; and an optical sheet disposed above the light source units and exhibiting bidirectional transmittance distribution function characteristics having first and second peaks at radiation angles less than 0° and greater than 0°.

Abstract: The present invention relates to a GaN type LED device and a method of manufacturing the same. More particularly, there are provided a GaN type LED device including an LED chip; and a submount eutectic-bonded with the LED chip through an adhesive layer, wherein the adhesive layer is configured by soldering a plurality of metallic layers in which a first metallic layer and a second metallic layer are sequentially stacked, and the second metallic layer is formed in a paste form. Further, the present invention provides a method of manufacturing the GaN type LED device.

Abstract: Provided is a light-emitting device package strip that includes a lead frame strip, a plurality of resin molding products that are injection-molded in the lead frame strip, and runner and gate members that are formed between adjacent resin molding products and on end sides of a line of adjacent resin molding products, each runner and gate member having a smaller thickness than a thickness of the resin molding products to facilitate cutting thereof.

Abstract: A system and method for a heatable floor or wall covering having a decorative visible surface layer, for example marble or other natural stone. The heatable wall or floor covering includes at least one surface treatment panel, the at least one panel having at least a bottom layer, a heat module layer, and a surface material layer. The heat module layer includes at least one electrically conductive pathway, and the bottom layer includes at least one tab and at least one receiver, each tab and receiver located on a lateral surface of the bottom layer and including an electrical connector in contact with an electrically conductive pathway. When installed, a tab of one panel is matably engageable with a receiver of an adjacent panel, providing at least one continuous electrically conductive pathway between adjacent panels that generates heat, the heat being radiated from the visible surface layer.

Abstract: Provided is a light emitting diode device. The light emitting diode device includes a light emitting diode chip having a first surface on which first and second electrodes are disposed, and a second surface opposing the first surface, a wavelength conversion portion including fluorescent substances and covering the first surface and side surfaces of the light emitting diode chip, wherein the side surfaces denote surfaces placed between the first and second surfaces, and first and second electricity connection portions each including a plating layer, respectively connected to the first and second electrodes, and exposed to the outside of the wavelength conversion portion. Accordingly, the light emitting diode device, capable of enhancing luminous efficiency and realizing uniform product characteristics in terms of the emission of white light, is provided. Further, a process for easily and efficiently manufacturing the above light emitting diode device is provided.

Abstract: Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.

Abstract: The present invention relates to a filler composition for tissue reinforcement, including hyaluronic acid and alkylene diamine crosslinked hydrogel. The filler composition exhibits the positive physical properties required for tissue reinforcement, such as biocompatibility and swelling ability, as well as useful effects in that the same can remain in vivo for a long time.

Abstract: Provided is a light emitting diode device. The light emitting diode device includes a light emitting diode chip having a first surface on which first and second electrodes are disposed, and a second surface opposing the first surface, a wavelength conversion portion including fluorescent substances and covering the first surface and side surfaces of the light emitting diode chip, wherein the side surfaces denote surfaces placed between the first and second surfaces, and first and second electricity connection portions each including a plating layer, respectively connected to the first and second electrodes, and exposed to the outside of the wavelength conversion portion. Accordingly, the light emitting diode device, capable of enhancing luminous efficiency and realizing uniform product characteristics in terms of the emission of white light, is provided. Further, a process for easily and efficiently manufacturing the above light emitting diode device is provided.

Abstract: The invention relates to a long-acting formulation of biopharmaceutical, more specifically an aptamer therapeutics. A branched PEGylated aptamer or a hyaluronic acid (HA) derivative of which degradation in vivo is regulated is linked by the bioconjugation with biopharmaceutical to produce the long-action formulation.

Abstract: Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.

Abstract: Provided is a bone filling complex and method of preparing the same. The bone filling complex includes a matrix including a hydrogel-type hyaluronic acid derivative; and a bone derivative filling the matrix For example, the bone filling complex can be used to regenerate an injured alveolar bone.

Abstract: Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.

Abstract: Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.

Abstract: There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing. Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.

Abstract: A light source module, a backlight unit, a display apparatus, a television set, and an illumination apparatus are provided. The light source module includes: one or more light source units including a light emitting element emitting light when electricity is applied thereto; and an optical sheet disposed above the light source units and exhibiting bidirectional transmittance distribution function characteristics having first and second peaks at radiation angles less than 0° and greater than 0°.

Abstract: A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.

Abstract: An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.

Abstract: The invention relates to a long-acting formulation of biopharmaceutical, more specifically an aptamer therapeutics. A branched PEGylated aptamer or a hyaluronic acid (HA) derivative of which degradation in vivo is regulated is linked by the bioconjugation with biopharmaceutical to produce the long-action formulation.