Patents by Inventor Jung-Kyu Park

Jung-Kyu Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7186013
    Abstract: In a backlight apparatus used in an LCD, in which upper and lower reflective plates are installed under upper and lower transparent plates, respectively. The lower transparent plates and the lower reflective plates introduce light generated by lower light sources in upward directions and the upper transparent plate and the upper reflective plates introduce light generated by an upper light source into those areas, which are not lighted by the lower light sources. This can prevent the formation of dark areas above the lower light sources thereby enhancing the overall uniformity of light.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: March 6, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young June Jeong, Hyung Suk Kim, Jung Kyu Park, Ho Sik Ahn, Young Sam Park, Bum Jin Kim, Hun Joo Hahm
  • Patent number: 7176503
    Abstract: An LED package comprises a substrate, one or three terminals formed on a first side of the substrate, three terminals formed on a second side opposite to the first side, and two or three LEDs disposed on the substrate, one of the LEDS being electrically connected to one of the terminals formed on the first side while being electrically connected to one of the terminals formed on the second side, and other LEDS being electrically connected to two terminals formed on the first side or to two terminals formed on the second side. A light source comprises the LED packages having the structure as described above. Without being arranged in a line, the LEDs emitting the same color are differently arranged in every LED package, thereby solving the problem of non-uniform combination of the colors according to the positions of the LEDs on an LED package-mounting substrate.
    Type: Grant
    Filed: October 19, 2004
    Date of Patent: February 13, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Suk Kim, Young Sam Park, Hun Joo Hahm, Jung Kyu Park, Young June Jeong
  • Patent number: 7172325
    Abstract: A backlight unit of a liquid crystal display includes a plurality of light emitting diode packages arranged in a matrix while being spaced a uniform distance apart from each other. Each light emitting diode package includes one or more light emitting diode chips and is structured such that light generated from the light emitting chips is emitted in the horizontal direction. A reflector consists of a plurality of reflection cells connected to each other in a matrix. Each of the reflection cells of a unit size has each of the light generating packages positioned at the center thereof, and reflects the light, emitted from the light emitting diode at the center thereof in the horizontal direction, in the vertical direction.
    Type: Grant
    Filed: August 12, 2004
    Date of Patent: February 6, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Suk Kim, Young Sam Park, Hun Joo Hahm, Jung Kyu Park, Young June Jeong
  • Patent number: 7153000
    Abstract: A multi-lens LED has multiple lenses and an intermediate layer interposed between the multiple lenses in order to radiate light emitted from an LED chip in a desired direction and/or at a desired beam angle. The first lens is centered behind the LED chip when seen in the propagation direction of light. The second lens has a concave structure and surrounds the first lens. The intermediate layer is interposed between the first and second lenses, so that light emitted from the LED chip can be radiated at a wide beam angle. When provided in the form of a hemisphere, the multi-lens LED can be attached, e.g., to a wall or a ceiling for interior lighting. On the other hand, when provided in the form of a semicylinder, the multi-lens LEDs can be arranged in arrays to be used, e.g., as a light source of an LCD backlight apparatus.
    Type: Grant
    Filed: October 5, 2004
    Date of Patent: December 26, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Kyu Park, Young Sam Park, Hun Joo Hahm, Young June Jeong, Hyung Suk Kim
  • Patent number: 7118236
    Abstract: The present invention relates to an LED lens, in which a planar bottom has a pair of halves symmetrically connected with each other about a reference line and narrowed in the vicinity of the reference line. A pair of substantially semicircular reflecting surfaces are extended from both edges of the bottom connected with both ends of the reference line. A radiating surface is connected with remaining edges of the bottom and semicircular edges of the reflecting surfaces. The reflecting surfaces reflect light beams are introduced from the LED chip through the bottom toward the radiating surface. The radiating surface radiates the light beams to the outside when the light beams are introduced to the radiating surface through reflection from the reflecting surfaces and directly through the bottom, so that the light beams are radiated to the outside in a predetermined beam angle.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: October 10, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hun Joo Hahm, Jung Kyu Park, Young June Jeong, Young Sam Park, Hyung Suk Kim, Ho Sik Ahn
  • Patent number: 7115979
    Abstract: An LED package in which an LED chip a body has a cup part housing an LED chip. The cup part has a step formed in the outer circumference of the top thereof. A lens is mounted on the cup part, and has a flange extended downward from the outer circumference of the lens along the outside wall of the cup part to form a gap between the flange and the downward step of the cup part and to seal the gap from the outside. Resin material fills a space formed between the underside of the lens and the cup part and at least partially the gap formed between the step of the cup part and the lens flange. The resin material is prevented from leaking out of the LED package. The LED package of the invention prevents the creation of voids in the resin material surrounding the LED chip or the leakage of the resin material to the outside.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: October 3, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Kyu Park, Young Sam Park
  • Patent number: 7097337
    Abstract: Disclosed herein is a vertical light emitting type backlight module, for irradiating white light to the rear side of a liquid crystal display in the perpendicular direction.
    Type: Grant
    Filed: August 13, 2004
    Date of Patent: August 29, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Suk Kim, Young Sam Park, Hun Joo Hahm, Jung Kyu Park, Young June Jeong
  • Patent number: 6972439
    Abstract: Disclosed herein is a light emitting diode (LED) device. The light emitting diode device comprises a package formed with a terminal for applying an electrical signal, one or more LED chips mounted on the package such that the LED chips are electrically connected to the terminal, a lens formed to surround the LED chips on the package for changing path of light emitted from the LED chips to the horizontal direction with the difference of the refraction rates of the media, and a reflector formed on the lens for reflecting the light, emitted above the lens without being refracted in the horizontal direction at the lens, to the horizontal direction. The LED device reflects the light, which is deviated from the optical design range of the lens and emitted above the lens, back to the lens, thereby preventing the hot spot from being generated, and enhancing horizontal emission efficiency of the light.
    Type: Grant
    Filed: August 12, 2004
    Date of Patent: December 6, 2005
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Suk Kim, Young Sam Park, Hun Joo Hahm, Jung Kyu Park, Young June Jeong
  • Publication number: 20050243576
    Abstract: The present invention provides a Light Emitting Diode (LED) array module for providing backlight, which can be used as an independent device with a plurality of LEDs being integrally packaged, and which can be universally used regardless of a screen size, and a backlight unit having the same. The LED array module used as a light source of backlight includes a bar-shaped Printed Circuit Board (PCB) on which conductive patterns for transmitting power are formed, a base formed on the PCB and made of a heat conductive material, a plurality of LED chips mounted on the base in a line and electrically connected to the conductive patterns of the PCB, a reflector formed to surround the plurality of the LED chips and adapted to reflect light radiated from the plurality of LED chips upward, and a lens formed above the plurality of LED chips and reflector to have a bar shape and adapted to diffuse the light radiated from the plurality of LED chips and reflector in a horizontal direction.
    Type: Application
    Filed: July 14, 2004
    Publication date: November 3, 2005
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Kyu Park, Chang Wook Kim, Young Sam Park
  • Publication number: 20050199884
    Abstract: A high power LED package, in which substantially planar first and second lead frames made of high reflectivity metal are spaced from each other for a predetermined gap. An LED chip is seated on at least one of the lead frames, and having terminals electrically connected to the lead frames, respectively. A package body made of resin seals the LED chip therein while fixedly securing the lead frame in the bottom thereof. The encapsulant preferably fills up the gap between the first and second lead frames. The LED package is structured to raise thermal radiation efficiency thereby reducing the size and thickness thereof.
    Type: Application
    Filed: July 14, 2004
    Publication date: September 15, 2005
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seon Goo Lee, Seung Mo Park, Chan Wang Park, Jung Kyu Park
  • Publication number: 20040137999
    Abstract: There is provided an apparatus for training a golf which includes: a base in which a power supply unit is embedded; a mat formed attachably and detachably to the base; a pair of shot sensing units installed between the base and the mat in a down blow position and a duff position centering on a golf ball, for sensing a blow of a club head; and a shot state checking unit connected to each of the shot sensing units, for checking a down blow state or a duff state by a sensed signal outputted from the shot sensing units and outputting a voice.
    Type: Application
    Filed: December 24, 2003
    Publication date: July 15, 2004
    Inventor: Jung-Kyu Park
  • Patent number: D508725
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: August 23, 2005
    Inventor: Jung-Kyu Park
  • Patent number: D508971
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: August 30, 2005
    Inventor: Jung-Kyu Park
  • Patent number: D495304
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: August 31, 2004
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Wook Kim, Jung Kyu Park
  • Patent number: D499075
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: November 30, 2004
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Joon Ho Yoon, Jung Kyu Park, Young Sam Park