Abstract: A method of selective epitaxial growth performed by sequentially and repeatedly introducing a source gas, an etching gas, and a reducing gas in the reaction chamber, wherein controlled epitaxial layer doping may be obtained by introducing a dopant source gas during introducing any one of the source gas, an etching gas, and a reducing gas, and thereby producing a smooth and uniform epitaxial layer on a predetermined region of a semiconductor substrate.

Abstract: A method of selective epitaxial growth performed by sequentially and repeatedly introducing a source gas, an etching gas, and a reducing gas in the reaction chamber, wherein controlled epitaxial layer doping may be obtained by introducing a dopant source gas during introducing any one of the source gas, an etching gas, and a reducing gas, and thereby producing a smooth and uniform epitaxial layer on a predetermined region of a semiconductor substrate.

Abstract: Methods for fabricating a tungsten nitride layer in a semiconductor substrate having an insulating layer formed thereon. The methods include forming a contact hole through the insulating layer. A tungsten nitride layer is then selectively deposited only in the contact hole by selectively reacting a nitrogen-containing gas with a tungsten source gas so as to prevent formation of tungsten nitride layer on the insulating layer outside the contact hole. Methods or fabricating metal wiring utilizing the methods of fabricating a tungsten nitride layer are also provided.

Abstract: A method of manufacturing a metal wiring layer in a semiconductor device, wherein an insulating layer is plasma treated before a tungsten nitride film is formed on the insulating layer. A metal, metal silicide or metal alloy thereafter being deposited over the tungsten nitride film.

Abstract: A method of manufacturing a semiconductor capacitor electrode by growing a metal compound layer over polysilicon storage nodes. The metal compound layer readily growing on the polysilicon storage nodes, but not on portions of an insulating layer between adjacent polysilicon storage nodes.

Abstract: There is provided a method for manufacturing a capacitor in a semiconductor device including the steps of forming first and second insulating layers with a first contact hole through to a semiconductor substrate, patterning a first conductive layer to form a pedestal portion of a lower electrode, using a patterned third insulating layer selectively forming an upper portion of the lower electrode from a tungsten nitride thin film, and forming an undercut beneath the pedestal portion by wet-etching the second insulating layer.