Patents by Inventor Jung-Min Kim

Jung-Min Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTILAYER ELECTRONIC COMPONENT
    Publication number: 20220165500
    Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including Cu3Sn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including Cu6Sn5; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 ?m.
    Type: Application
    Filed: August 31, 2021
    Publication date: May 26, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Il Ro Lee, Jung Min Kim, Hong Je Choi, Sang Wook Lee, Seon Ho Park, Jeong Ryeol Kim, Bon Seok Koo
  • Multilayer capacitor having external electrode including conductive resin layer
    Patent number: 11342119
    Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: May 24, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
  • MULTILAYER ELECTRONIC COMPONENT
    Publication number: 20220139618
    Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
    Type: Application
    Filed: May 5, 2021
    Publication date: May 5, 2022
    Inventors: Byung Woo Kang, Bon Seok Koo, Jeong Ryeol Kim, Jung Min Kim, Jae Seok Yi, Ji Hye Han, Hye Jin Park
  • COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220108828
    Abstract: A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.
    Type: Application
    Filed: December 16, 2021
    Publication date: April 7, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yoon Hee LEE, Bon Seok KOO, Yeon Tae KIM, Chang Hak CHOI, Jung Min KIM
  • MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
    Publication number: 20220093337
    Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.
    Type: Application
    Filed: April 16, 2021
    Publication date: March 24, 2022
    Inventors: Ji Hye HAN, Jung Min KIM, Jae Seok YI, Hye Jin PARK, Byung Woo KANG, Jeong Ryeol KIM, Bon Seok KOO, Il Ro LEE
  • MULTILAYER ELECTRONIC COMPONENT
    Publication number: 20220051853
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.
    Type: Application
    Filed: October 27, 2021
    Publication date: February 17, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim
  • MLCC MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220037087
    Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.
    Type: Application
    Filed: October 19, 2021
    Publication date: February 3, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok YI, Jung Min KIM, Chang Hak CHOI, Bon Seok KOO, Byung Woo KANG, Hae Sol KANG, San KYEONG, Jun Hyeon KIM
  • Coil component and method of manufacturing the same
    Patent number: 11227714
    Abstract: A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: January 18, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yoon Hee Lee, Bon Seok Koo, Yeon Tae Kim, Chang Hak Choi, Jung Min Kim
  • ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210375546
    Abstract: An electronic component includes an electronic component main body including a body and an external electrode disposed on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on the coating layer.
    Type: Application
    Filed: September 10, 2020
    Publication date: December 2, 2021
    Inventors: Jeong Suong YANG, Bon Seok KOO, Sang Wook LEE, Jung Min KIM, Sung Min CHO
  • Multilayer electronic component
    Patent number: 11189424
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: November 30, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim
  • BACTERIOPHAGE-DERIVED RECOMBINANT PROTEIN HAVING ANTIMICROBIAL ACTIVITY AGAINST PATHOGENIC GRAM-NEGATIVE BACTERIA
    Publication number: 20210361738
    Abstract: The present invention relates to a bacteriophage-derived recombinant protein having antimicrobial activity against gram-negative bacteria, and the bacteriophage-derived recombinant protein LysSS exhibits killing activity to gram-negative bacteria and thus can prevent or treat infectious diseases caused by bacteria, and can be widely used in antibiotics, disinfectants, food additives, feed additives, and the like, wherein the LysSS uses peptidoglycan, which is a component of the cell wall of bacteria, as a substrate, and exhibits bacterial killing ability due to peptidoglycan degradation and the peptidoglycan exists only in bacteria and not in humans or animals.
    Type: Application
    Filed: April 30, 2019
    Publication date: November 25, 2021
    Applicant: KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Jung Min KIM, Shukho KIM
  • MLCC module and method of manufacturing the same
    Patent number: 11183331
    Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: November 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Chang Hak Choi, Bon Seok Koo, Byung Woo Kang, Hae Sol Kang, San Kyeong, Jun Hyeon Kim
  • USE OF RECOMBINANT ANTIBACTERIAL PROTEIN ABLYSIN FOR EFFECTIVELY KILLING MULTIDRUG-RESISTANT PATHOGENIC BACTERIA
    Publication number: 20210353720
    Abstract: The present invention relates to the use of the recombinant antibacterial protein Ablysin for effectively killing multidrug-resistant pathogenic bacteria. The recombinant protein Ablysin of the present invention exhibits apoptosis against antibiotic-resistant Acinetobacter baumannii, Klebsiella pneumoniae, Escherichia coli, Pseudomonas aeruginosa, Staphylococcus aureus and Enterococcus faecium to prevent or treat infectious diseases caused by these bacteria and thus it can be widely used in antibiotics, disinfectants, food additives, feed additives, and the like. In particular, the Ablysin uses peptidoglycan, which is a component of the cell wall of bacteria, as a substrate, and exhibits bacterial killing ability due to peptidoglycan degradation.
    Type: Application
    Filed: July 2, 2020
    Publication date: November 18, 2021
    Applicant: KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Jung Min KIM, Jong Sook JIN, Shukho KIM
  • METHOD FOR PRODUCING CELL-CULTURING POLYVINYL ALCOHOL NANOFIBER STRUCTURE
    Publication number: 20210332511
    Abstract: The present disclosure provides a method for producing a cell-culturing polyvinyl alcohol-based nanofiber structure, the method comprising: electrospinning an electrospun solution to form a nanofiber mat, wherein the electrospun solution contains polyvinyl alcohol (PVA), polyacrylic acid (PA) and glutaraldehyde (GA); crosslinking the nanofiber mat via a hydrochloric acid (HCl) vapor treatment; and treating the crosslinked nanofiber mat with dimethylformamide (DMF) solvent to crystallize the nanofiber mat.
    Type: Application
    Filed: January 12, 2017
    Publication date: October 28, 2021
    Applicant: NANOFAENTECH CO., LTD.
    Inventors: Jong Young KWAK, Jung Min KIM, Yeo Jin PARK, Dan Bi PARK, Qasaim MUHAMMAD, Young Hun JEONG
  • MULTILAYERED CAPACITOR
    Publication number: 20210265115
    Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.
    Type: Application
    Filed: May 12, 2021
    Publication date: August 26, 2021
    Inventors: Mi Geum KIM, Byeong Cheol MOON, Kun Hoi KOO, Jung Min KIM
  • COIL COMPONENT
    Publication number: 20210202148
    Abstract: A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body.
    Type: Application
    Filed: June 25, 2020
    Publication date: July 1, 2021
    Inventors: Kwi Jong LEE, Jung Min KIM, Sung Jin HUH, Jin Hyuck YANG, Jae Wook LEE, Ji Hyun EOM
  • POROUS PARTICLE COMPOSITE FOR PCR WITH HEAT DISSIPATION FUNCTION
    Publication number: 20210197201
    Abstract: The present invention relates to a porous particle composite for PCR, wherein the porous particle composite distributes photothermal nano-elements that generate heat by absorbing light in porous particles in which nucleic acid amplification occurs through temperature control so as not to adjust the temperature of the entire sample by using a hot plate or the like but to adjust the temperature inside the particles by irradiating light to the porous particles to allow nucleic acid amplification inside thereof, thereby reducing energy consumption and shortening diagnostic time.
    Type: Application
    Filed: May 14, 2019
    Publication date: July 1, 2021
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sang Kyung KIM, Bong Kyun KIM, Jung Min KIM
  • COIL COMPONENT
    Publication number: 20210193373
    Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.
    Type: Application
    Filed: June 24, 2020
    Publication date: June 24, 2021
    Inventors: Kwi Jong Lee, Jung Min Kim, Young Seuck Yoo, Sung Jin Huh, Jin Hyuck Yang, Tae Hyun Kim
  • MULTILAYER ELECTRONIC COMPONENT
    Publication number: 20210193391
    Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
    Type: Application
    Filed: April 24, 2020
    Publication date: June 24, 2021
    Inventors: Jae Seok YI, Il Ro LEE, Chang Hak CHOI, Bon Seok KOO, Jung Min KIM, Byung Woo KANG, San KYEONG
  • Multilayered capacitor
    Patent number: 11037732
    Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Geum Kim, Byeong Cheol Moon, Kun Hoi Koo, Jung Min Kim