Patents by Inventor Jung Park

Jung Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240172947
    Abstract: An electronic device for estimating body temperature may include: a sensor including a heat source, a pair of first temperature sensors horizontally spaced apart from each other at two opposing sides of the heat source, and a pair of second temperature sensors vertically spaced apart from the pair of first temperature sensors in a thickness direction of the electronic device; and at least one processor configured to estimate a blood temperature difference based on temperatures measured by the pair of first temperature sensors and the pair of second temperature sensors, and estimate blood flow information based on the estimated blood temperature difference.
    Type: Application
    Filed: March 28, 2023
    Publication date: May 30, 2024
    Applicants: SAMSUNG ELECTRONICS CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Bok Soon KWON, Kyeongha KWON, Do Yun PARK, Young Min SIM, Chulyoon JUNG, Sang Kyu KIM, Sungho KIM, So Young LEE, Ho Taik LEE, Hong Soon RHEE
  • Publication number: 20240176233
    Abstract: A photosensitive resin composition, a photosensitive resin layer manufactured using the same, and a color filter, the photosensitive resin composition includes a colorant; a photopolymerizable compound; a photopolymerization initiator; a binder resin; and a solvent, wherein the colorant includes a pigment, a dispersant, and a dispersing aid represented by Chemical Formula 1,
    Type: Application
    Filed: October 13, 2023
    Publication date: May 30, 2024
    Inventors: Chang-Hyun KWON, Heejo MOON, Juho JUNG, Kwangwon SEO, Baek Soung PARK
  • Publication number: 20240174890
    Abstract: A CMP slurry composition for polishing tungsten and a method of polishing tungsten using the same, the composition includes a polar solvent or a nonpolar solvent; an abrasive agent; and a compound represented by Formula 3 or a complex thereof:
    Type: Application
    Filed: October 24, 2023
    Publication date: May 30, 2024
    Inventors: Keun Sam JANG, Won Jung KIM, Tae Won PARK, Ji Ho LEE, Eui Rang LEE, Jin Gyo KIM, Dong Hyeon LEE, Chang Suk LEE
  • Publication number: 20240174241
    Abstract: A method of mitigating motion sickness in a passenger including learning a motion sickness prediction model based on state information of a vehicle or the passenger, reaction information of the passenger, and motion sickness-related information, predicting reactions of the passenger to a current state of the vehicle or the passenger and possibility of motion sickness using the learned motion sickness prediction model, and providing information on the motion sickness mitigation methods to the passenger or controlling the vehicle based on the predicted reactions of the passenger and possibility of motion sickness. The motion sickness-related information includes one or more of a determination result of whether motion sickness occurs to the passenger, motion sickness state information, and motion sickness reaction information.
    Type: Application
    Filed: July 5, 2023
    Publication date: May 30, 2024
    Inventors: Gyu Ri Lee, Seong Wook Moon, Do Hwa Kim, Sung Bae Jeon, SungII Jung, Jae Young Park, Jeong Eun Kim, Hui Un Son
  • Publication number: 20240176232
    Abstract: A photosensitive resin composition includes a colorant; a photopolymerizable compound; a photopolymerization initiator; a binder resin; and a solvent, wherein the colorant includes a pigment, a dispersant, and a dispersing aid, the dispersing aid being represented by Chemical Formula 1:
    Type: Application
    Filed: October 13, 2023
    Publication date: May 30, 2024
    Inventors: Chang-Hyun KWON, Baek Soung PARK, Juho JUNG, Heejo MOON
  • Patent number: 11996240
    Abstract: An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: May 28, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kong Joo Jeon, So Jung An, Kwang Yeun Won, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park
  • Patent number: 11997664
    Abstract: Discussed is wireless communication that includes beam failure detection and recovery for high priority or broadcast CORESETs performed in wireless communication systems to effectuate an overall improvement in wireless communication. In some aspects, a mobile device may monitor one or more first reference signals associated with wireless communication performed using one or more first reception beams. The mobile device may also monitor one or more second reference signals associated with wireless communication performed using one or more second reception beams. The mobile device may detect a failure in wireless communication performed using the one or more first reception beams based, at least in part, on the monitoring of the one or more first reference signals. The mobile device may also initiate a beam failure recovery procedure for the one or more first reception beams upon detecting the failure in wireless communication performed using the one or more first reception beams.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: May 28, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Tianyang Bai, Tao Luo, Wooseok Nam, Sungwoo Park, Kiran Venugopal, Jung Ho Ryu, Junyi Li
  • Publication number: 20240166799
    Abstract: The present exemplary embodiments may provide a latent curing agent including an imidazole-based compound protected by a Diels-Alder reaction between a diene and a dienophile.
    Type: Application
    Filed: December 15, 2022
    Publication date: May 23, 2024
    Inventors: Jaewoo KIM, Sungmin JUNG, Yong Seok CHOI, Jong Hyuk PARK, Min PARK, Jun Woo JEON, Yong Chae JUNG, YOONSANG KIM, Han Gyeol JANG, Jun Young JO
  • Publication number: 20240166944
    Abstract: Embodiments provide a quantum dot, a method of preparing the quantum dot, and a display device including the quantum dot. The quantum dot includes a core including zinc (Zn), tin (Sn), and phosphorous (P), and a shell surrounding the core, wherein a molar ratio of the number of moles of zinc to a number of moles of tin is in a range of about 0.1 to about 0.2.
    Type: Application
    Filed: August 9, 2023
    Publication date: May 23, 2024
    Applicant: Samsung Display Co., Ltd.
    Inventors: SUNGJAE KIM, Youngsik KIM, SEUNG-WON PARK, Bitna YOON, DONGHEE LEE, JUNEHYUK JUNG
  • Publication number: 20240170449
    Abstract: A method includes providing a first structure, forming a connection pad on the first structure, forming a preliminary connection member on the connection pad, forming an adhesion layer on the first structure, the adhesion layer covering the preliminary connection member, removing a portion of the adhesion layer to expose an exposure surface of the preliminary connection member, providing a second structure, forming a chip pad and a dummy pad on the second structure, and covering the chip pad and the dummy pad with the adhesion layer that has been formed on the first structure. A thickness of the dummy pad is greater than a thickness of the chip pad.
    Type: Application
    Filed: June 22, 2023
    Publication date: May 23, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: HYOUNGJOO LEE, SANG-SICK PARK, CHUNGSUN LEE, SEUNGYOON JUNG
  • Publication number: 20240168377
    Abstract: Disclosed are a photosensitive resin composition, a photosensitive resin layer manufactured using the same, and a color filter. Specifically, an embodiment provides a photosensitive resin composition including (A) a colorant; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) a binder resin; and (E) a solvent, wherein the colorant includes a pigment, a dispersant, and a dispersing aid represented by Chemical Formula 1: (Each substituent of Chemical Formula 1 is as defined in the specification.
    Type: Application
    Filed: October 16, 2023
    Publication date: May 23, 2024
    Inventors: Chang-Hyun KWON, Baek Soung PARK, Juho JUNG, Kwangwon SEO, Heejo MOON
  • Patent number: 11990372
    Abstract: There may be provided a method of manufacturing a semiconductor chip. A layer stack in which first material layers and second material layers are alternately stacked is formed on a semiconductor substrate that includes a chip region and a scribe lane region, and crack propagation guides are formed in a first portion of the layer stack within the scribe lane region.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: May 21, 2024
    Assignee: SK hynix inc.
    Inventors: In Su Park, Jung Dal Choi
  • Patent number: 11987740
    Abstract: Provided are a silicon nitride film etching composition, a method of etching a silicon nitride film using the same, and a manufacturing method of a semiconductor device. Specifically, a silicon nitride film may be highly selectively etched as compared with a silicon oxide film, and when the composition is applied to an etching process at a high temperature and a semiconductor manufacturing process, not only no precipitate occurs but also anomalous growth in which the thickness of the silicon oxide film is rather increased does not occur, thereby minimizing defects and reliability reduction.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: May 21, 2024
    Assignee: ENF Technology Co., Ltd.
    Inventors: Dong Hyun Kim, Hyeon Woo Park, Sung Jun Hong, Myung Ho Lee, Myung Geun Song, Hoon Sik Kim, Jae Jung Ko, Myong Euy Lee, Jun Hyeok Hwang
  • Publication number: 20240162193
    Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a first semiconductor chip, a lower adhesion layer on the first semiconductor chip, a second semiconductor chip on the lower adhesion layer, an upper adhesion layer on the second semiconductor chip, and a third semiconductor chip on the upper adhesion layer. The lower adhesion layer includes a first cutting surface connected to a top surface of the lower adhesion layer. The upper adhesion layer is in contact with the first cutting surface of the lower adhesion layer.
    Type: Application
    Filed: June 25, 2023
    Publication date: May 16, 2024
    Inventors: Seongyo KIM, UN-BYOUNG KANG, SANG-SICK PARK, Hanmin LEE, Seungyoon JUNG
  • Publication number: 20240163580
    Abstract: An image sensor and an operating method thereof are provided. The image sensor comprises a voltage generator configured to receive a reference voltage and generate an operating voltage, an analog-to-digital converter (ADC) circuit configured to receive the operating voltage and output a digital code based on the operating voltage, and processing circuitry configured to receive the digital code, and calculate a settling time at which the operating voltage was stabilized based on the digital code and a desired settling threshold voltage value.
    Type: Application
    Filed: May 23, 2023
    Publication date: May 16, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong Jae Han, Jae Jung Park, Bo Keun Lim, Gye Hun Choi
  • Patent number: 11980610
    Abstract: Disclosed are an oral solid dosage form composition comprising an active ingredient and a solubilizing carrier wherein a foaming ingredient is used to improve disintegration, dispersion or dissolution, and a preparation method therefor.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: May 14, 2024
    Assignee: SAMYANG HOLDINGS CORPORATION
    Inventors: Sang Yeob Park, Hye Jung Lim, Jae Young Lee, Min Hyo Seo, Sa Won Lee
  • Publication number: 20240149642
    Abstract: A vehicle air conditioner for minimizing the leakage of air through a dual blocking structure between upper and lower flow paths, and having a dual blocking structure. An air-conditioning case having an inner air flow path is divided into an upper flow path and a lower flow path. A heat exchanger for cooling and a heat exchanger for heating are provided in the air flow path of the air-conditioning case. A member having through-holes is disposed downstream of the heat exchanger for heating in the flow direction of air and allows the air that has passed through the heat exchanger for heating to pass therethrough. The member having through-holes has a horizontal member dividing the upper flow path from the lower flow path. A leakage-preventing means is overlapped with the horizontal member so as to prevent the air in the upper flow path and the lower flow path from mixing.
    Type: Application
    Filed: April 22, 2022
    Publication date: May 9, 2024
    Inventors: Gyu Ik HAN, Jae Woo KO, Ki Jung PARK, Joon Yeong LEE, Ki Man JEON
  • Publication number: 20240151440
    Abstract: An embodiment multi-way coolant valve includes an outer housing including first to third outer inlets, first to third outer outlets, and a pump mount portion coupled to one of the outer outlets, an inner housing rotatably provided within the outer housing and including penetration holes corresponding to the outer inlets and outlets, a coolant line defined by a selective connection of the penetration holes such that the outer inlets and outlets are selectively connected, pads interposed between an interior circumference of the outer housing and an exterior circumference of the inner housing at locations of the outer inlets and outlets, respectively, and a driving device connected to a rotation center of the inner housing to selectively rotate the inner housing within the outer housing, wherein the inner housing is configured to rotate by a preset interval according to a selected vehicle mode.
    Type: Application
    Filed: May 10, 2023
    Publication date: May 9, 2024
    Inventors: Wan Je Cho, Namho Park, Seong-Bin Jeong, Yeonho Kim, Tae Hee Kim, Jae-Eun Jeong, Man Hee Park, Jae Yeon Kim, Hyunjae Lee, Seong Woo Jeong, Jung Bum Choi, Ho Sung Kang, Jeong Wan Han
  • Publication number: 20240150651
    Abstract: Embodiments provide a quantum dot that includes a core including zinc (Zn), tin (Sn) and phosphorus (P), and a shell surrounding the core, wherein a molar ratio of a number of moles of zinc to a number of moles of tin is in a range of about 0.1 to about 2. The quantum dots have high luminous efficiency and color purity.
    Type: Application
    Filed: August 4, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Display Co., Ltd.
    Inventors: SEUNG-WON PARK, SUNGJAE KIM, Youngsik KIM, Bitna YOON, DONGHEE LEE, JUNEHYUK JUNG
  • Patent number: D1027764
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: May 21, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Bong-Hun Koh, Yoon-Jung Park