Patents by Inventor Jung Park

Jung Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240127764
    Abstract: In a backlight apparatus, a master driving circuit generates a transmission frame including a training period including a clock training pattern and a data period including a plurality of data packets respectively corresponding to the plurality of blocks. A plurality of slave driving circuits correspond to the plurality of blocks, respectively, and are connected to the master driving circuit in a daisy chain structure. Each slave driving circuit receives the transmission frame through the daisy chain structure, recovers a clock based on the clock training pattern, and drives the plurality of light emitting elements included in a corresponding block among the plurality of blocks based on its own data packet among a plurality of data packets.
    Type: Application
    Filed: June 12, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Junil PARK, Sugyeung KANG, Yongil Kwon, Kang Joo KIM, Alan Kyongho KIM, Sunkwon KIM, Yong-Yun PARK, Jung-Pil LIM, Hyunwook LIM
  • Publication number: 20240130230
    Abstract: The present disclosure relates to a plurality of host materials, organic electroluminescent compounds, and organic electroluminescent devices comprising the same. By comprising specific combinations of compounds according to the present disclosure as the plurality of host materials or by comprising a compound according to the present disclosure, it is possible to provide organic electroluminescent devices having improved lifespan characteristics compared to conventional organic electroluminescent devices.
    Type: Application
    Filed: August 8, 2023
    Publication date: April 18, 2024
    Inventors: Doo-Hyeon MOON, DaiKyu KIM, Hyo-Jung LEE, Yea-Mi SONG, Kyoung-Jin PARK, Hyun-Ju KANG, Ga-Won LEE, Mi-Ja LEE, Kyung-Hoon CHOI
  • Patent number: 11959886
    Abstract: The present invention relates to a scanner having a flexible probe which is an apparatus capable of being utilized for an inspection on a weld zone of a general ferrite material and a stainless material and allowing an inspection to be performed on a fitting weld zone where it is difficult for a general phased array ultrasonic testing (PAUT) probe to approach.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: April 16, 2024
    Assignees: Foundation for Research and Business, Seoul National University of Science and Technology, Korea Inspection Eng.Co., Ltd
    Inventors: Ik Keun Park, Yu Min Choi, Seong Jin Lim, In Gon Jung, Hye Jin Park
  • Patent number: 11963364
    Abstract: A semiconductor device is provided. The semiconductor device includes a first stacked structure including a plurality of first insulating patterns and a plurality of first semiconductor patterns alternately stacked on a substrate, the first stacked structure extending in a first direction parallel to an upper surface of the substrate, a first conductive pattern on one side surface of the first stacked structure, the first conductive pattern extending in a second direction crossing the upper surface of the substrate, and a first ferroelectric layer between the first stacked structure and the first conductive pattern, the first ferroelectric layer extending in the second direction, wherein each of the first semiconductor patterns includes a first impurity region, a first channel region and a second impurity region which are sequentially arranged along the first direction.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: April 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seok Han Park, Yong Seok Kim, Hui-Jung Kim, Satoru Yamada, Kyung Hwan Lee, Jae Ho Hong, Yoo Sang Hwang
  • Publication number: 20240119212
    Abstract: Methods for configuring a patterning process based on results of another patterning process is described. The method includes obtaining a first set of contours by simulating a first patterning process using a design layout in a first orientation. The contours satisfy a design specification associated with the design layout and correspond to a first set of process window conditions. A second patterning process is configured based on a second orientation of the design layout, the first set of process window conditions and the first set of contours. The second patterning process is associated with one or more design variables (e.g., illumination, mask pattern) that affect a second set of contours. The configuring includes adjusting one or more design variables until the second set of contours are within a desired matching threshold with the first set of contours.
    Type: Application
    Filed: February 25, 2022
    Publication date: April 11, 2024
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Jung Hoon SER, Sungwoon PARK, Xin LEI, Jinwoong JEONG, Rongkuo ZHAO, Duan-Fu Stephen HSU, Xiaoyang LI
  • Publication number: 20240121956
    Abstract: A semiconductor device may include: first insulating pillars arranged in a first direction; second insulating pillars arranged alternately with the first insulating pillars and having a first width in the first direction and a second width in a second direction intersecting the first direction, the first width being greater than the second width; first memory cells located between the second insulating pillars and stacked along a first sidewall of each of the first insulating pillars; and second memory cells located between the second insulating pillars and stacked along a second sidewall of each of the first insulating pillars.
    Type: Application
    Filed: March 31, 2023
    Publication date: April 11, 2024
    Inventors: Rho Gyu KWAK, In Su PARK, Jung Shik JANG, Seok Min CHOI, Won Geun CHOI
  • Publication number: 20240117930
    Abstract: A hydrogen storage device includes a storage container having an accommodation space in an interior thereof, a first metal hydride material provided in the interior of the storage container and that stores hydrogen, and a second metal hydride material provided in the interior of the storage container and that stores the hydrogen at a pressure that is different from that of the first metal hydride material. An advantageous effect of restraining an excessive rise of a pressure of the storage container and enhancing safety and reliability may be obtained.
    Type: Application
    Filed: March 10, 2023
    Publication date: April 11, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Ji Hye Park, Won Jung Kim, Kyung Moon Lee, Dong Hoon Nam, Young Jin Cho, Byeong Soo Shin, Ji Hoon Lee, Suk Hoon Hong, Hoon Mo Park, Yong Doo Son
  • Publication number: 20240117211
    Abstract: A paint composition is prepared by mixing each of an acrylic resin, an acrylic polyol resin, a polycarbonate diol resin, a diisocyanate, a solvent, and an antibacterial agent in appropriate amounts. As a result, the paint composition has improved physical properties and effective antibacterial activities.
    Type: Application
    Filed: April 28, 2023
    Publication date: April 11, 2024
    Inventors: Hyun Jung Kim, Ho Tak Jeon, Jae Sik Seo, Ji Hwan Park, Dae Joung Cho
  • Publication number: 20240117941
    Abstract: A hydrogen storage system is disclosed and includes a storage unit including a plurality of unit storage containers, in which metal hydride materials are respectively provided in an interior thereof and which are connected to each other in parallel, and a thermal fluid line defining a thermal fluid passage, which passes via the plurality of unit storage containers continuously and through which a thermal fluid flows for heating or cooling the unit storage containers, thereby enhancing a storage performance and an efficiency of the hydrogen.
    Type: Application
    Filed: March 10, 2023
    Publication date: April 11, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Ji Hye Park, Won Jung Kim, Kyung Moon Lee, Dong Hoon Nam, Young Jin Cho, Byeong Soo Shin, Ji Hoon Lee, Suk Hoon Hong, Hoon Mo Park, Yong Doo Son
  • Publication number: 20240115644
    Abstract: The present invention is a pharmaceutical or food composition comprising a pretreated extract and an isolate and an isolated and purified product of Cinnamomum cassia showing a pharmacological effect. It relates to an active ingredient showing physiological activity in the Cinnamomum cassia extract.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 11, 2024
    Inventors: Shin Jung PARK, Yunyoung LIM, Hyo Jun KIM, Bo Hee HONG, Yun Sik KIM
  • Publication number: 20240120393
    Abstract: A semiconductor device includes a substrate, a first sheet pattern on the substrate, a gate electrode on the substrate and surrounding the first sheet pattern, a first source/drain pattern and a second source/drain pattern respectively connected to a first end and a second end of the first sheet pattern, a contact blocking pattern on a lower side of the second source/drain pattern, a first source/drain contact extending in a first direction and connected to the first source/drain pattern, and a second source/drain contact connected to the second source/drain pattern and extending in the first direction to contact an upper surface of the contact blocking pattern. A depth from an upper surface of the gate electrode to a lowermost portion of the first source/drain contact may be greater than a depth from the upper surface of the gate electrode to the upper surface of the contact blocking pattern.
    Type: Application
    Filed: June 14, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jisoo PARK, Myung Il KANG, Ji Wook KWON, Jung Han LEE, Subin CHOI
  • Publication number: 20240110170
    Abstract: The present disclosure relates to a modified polypeptide having xylanase activity and the use thereof.
    Type: Application
    Filed: December 15, 2021
    Publication date: April 4, 2024
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Tae Joo YANG, Jihyun SHIM, Eun Jung CHOI, Byung-sam SON, Jae Yong PARK
  • Publication number: 20240112864
    Abstract: A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.
    Type: Application
    Filed: July 10, 2023
    Publication date: April 4, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong PARK, Jung Tae PARK, Jong Ho LEE, Eun Jung LEE, Yong Min HONG, Jung Jin PARK, Rak Hyeon BAEK, Sun Mi KIM, Yong Ung LEE
  • Patent number: 11944661
    Abstract: The present invention provides a pharmaceutical composition for prevention or treatment of a stress disease and depression, the pharmaceutical composition be safely useable without toxicity and side effects by using an extract of leaves of Vaccinium bracteatum Thunb., which is natural resource of Korea, so that the reduction of manufacturing and production costs and the import substitution and export effects can be expected through the replacement of a raw material for preparation with a plant inhabiting in nature.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: April 2, 2024
    Assignee: JEONNAM BIOINDUSTRY FOUNDATION
    Inventors: Chul Yung Choi, Dool Ri Oh, Yu Jin Kim, Eun Jin Choi, Hyun Mi Lee, Dong Hyuck Bae, Kyo Nyeo Oh, Myung-A Jung, Ji Ae Hong, Kwang Su Kim, Hu Won Kang, Jae Yong Kim, Sang O Pan, Sung Yoon Park, Rack Seon Seong
  • Patent number: 11945864
    Abstract: A monoclonal antibody or an antigen-binding fragment thereof according to an embodiment of the present invention can bind to lymphocyte-activation gene 3 (LAG-3) including a heavy chain variable region and a light chain variable region and inhibit the activity thereof. Thus it is expected to be useful for the development of immunotherapeutic agents for various disorders that are associated with LAG-3.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: April 2, 2024
    Assignee: Y-BIOLOGICS INC.
    Inventors: Sang Pil Lee, Ji-Young Shin, Sunha Yoon, Yunseon Choi, Jae Eun Park, Ji Su Lee, Youngja Song, Gisun Baek, Seok Ho Yoo, Yeung-chul Kim, Dong Jung Lee, Bum-Chan Park, Young Woo Park
  • Patent number: 11950439
    Abstract: Disclosed herein are a white organic light-emitting device. The white organic light-emitting device enables an overall improvement in characteristics such as color temperature, efficiency, luminance, and service life, by changing the configuration of different types of emission layers in contact with each other, and a display device using the same.
    Type: Grant
    Filed: October 3, 2022
    Date of Patent: April 2, 2024
    Assignee: LG Display Co., Ltd.
    Inventors: Eun-Jung Park, Jung-Keun Kim, Wook Song, Tae-Shick Kim
  • Publication number: 20240101896
    Abstract: A quantum dot includes a core including InP, a first shell around (e.g., surrounding) the core and including ZnTeSe, a second shell around (e.g., surrounding) the first shell and including ZnSe, and a third shell around (e.g., surrounding) the second shell and including ZnS, wherein the ratio of the number of moles of the Te in the first shell to the number of moles of the P in the core is about 0.02 to about 0.90.
    Type: Application
    Filed: July 31, 2023
    Publication date: March 28, 2024
    Inventors: Youngsik KIM, Sungjae KIM, Seung-Won PARK, Bitna YOON, Donghee LEE, Junehyuk JUNG
  • Publication number: 20240101088
    Abstract: A braking system includes a hydraulic brake including a first hydraulic brake provided on one of a front wheel and a rear wheel of a vehicle and a second hydraulic brake provided on the other of the front wheel and the rear wheel of the vehicle, a main braking force adjusting device configured to control braking hydraulic pressure supplied to the first hydraulic brake and the second hydraulic brake, and an auxiliary braking force adjusting device configured to directly control braking hydraulic pressure of the first hydraulic brake when a failure occurs in the main braking force adjusting device, wherein the first hydraulic brake is connected to the main braking force adjusting device via the auxiliary braking force adjusting device.
    Type: Application
    Filed: January 12, 2023
    Publication date: March 28, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Ho Jung NAM, Joo Beom KIM, Jun Ho PARK
  • Publication number: 20240099544
    Abstract: A cup washer includes a base plate, a water tank disposed on the base plate and configured to store water for washing a cup, and a washing unit disposed above the water tank and configured to wash an accommodated cup, wherein a vertical length of the cup washer is formed to be larger than a length of the base plate.
    Type: Application
    Filed: September 25, 2023
    Publication date: March 28, 2024
    Applicant: LG ELECTRONICS INC.
    Inventors: Taeyong JUNG, Miseong KIM, Hyo Keun PARK, Sejae OH, Gyeoung Jin JEON, Jaewoo JIN, Changwoo SUNG, Charyeom PARK
  • Publication number: 20240105679
    Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises providing a semiconductor substrate, forming a semiconductor element on an active surface of the semiconductor substrate, forming in the semiconductor substrate through vias that extend from the active surface into the semiconductor substrate, forming a first pad layer on the active surface of the semiconductor substrate, performing a first planarization process on the first pad layer, performing on an inactive surface of the semiconductor substrate a thinning process to expose the through vias, forming a second pad layer on the inactive surface of the semiconductor substrate, performing a second planarization process on the second pad layer, and after the second planarization process, performing a third planarization process on the first pad layer.
    Type: Application
    Filed: April 14, 2023
    Publication date: March 28, 2024
    Inventors: YOUNG KUN JEE, SANGHOON LEE, UN-BYOUNG KANG, SANG CHEON PARK, JUMYONG PARK, HYUNCHUL JUNG