Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.

Abstract: An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing an adhesive layer to attach an upper electronic package to a lower die and/or utilizing metal pillars for electrically connecting the upper electronic package to a lower substrate, wherein the metal pillars have a smaller height above the lower substrate than the lower die.

Abstract: Disclosed are a solid catalyst for producing polypropylene and a method for producing a block copolymer, particularly, disclosed are a solid catalyst for producing polypropylene, which has high activity and excellent hydrogenation activity and is capable of producing a block copolymer having high stereoregularity and a high rubber content by copolymerization of alpha-olefins, and a method for producing a block copolymer.

Abstract: A semiconductor package includes a package substrate; an interposer disposed over the package substrate; a stacked semiconductor device including a lower chip and one or more upper chips, which are sequentially stacked over the interposer; a first semiconductor chip stacked over the interposer and spaced apart from the stacked semiconductor device, and configured to interface with the lower chip; and one or more second semiconductor chips disposed over the package substrate to interface with the lower chip.

Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.

Abstract: An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing an adhesive layer to attach an upper electronic package to a lower die and/or utilizing metal pillars for electrically connecting the upper electronic package to a lower substrate, wherein the metal pillars have a smaller height above the lower substrate than the lower die.

Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.

Abstract: An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing an adhesive layer to attach an upper electronic package to a lower die and/or utilizing metal pillars for electrically connecting the upper electronic package to a lower substrate, wherein the metal pillars have a smaller height above the lower substrate than the lower die.

Abstract: An electronic apparatus includes a circuit board, a memory chip mounted on the circuit board, a memory controller to control an operation of the memory chip, a conductive pattern including a first control line to connect from a first terminal of the memory chip to a first terminal of the memory chip and a second control line to connect from a second terminal of the memory controller to a second terminal of the memory chip, and a capacitive element to provide a termination voltage. The first control line is connected to the capacitive element and the second control line is not connected to the capacitive element.

Abstract: The present disclosure relates to a ransomware attack detection device and method, and a recording medium having a program recorded thereon, the program for implementing the method. More particularly, the present disclosure relates to a multiprocess clustering-based ransomware attack detection device and method, and a recording medium having a program recorded thereon, the program being configured to implement the method, wherein a cluster ID for a cluster assigned to processes created at a kernel level of an operating system (OS) is created, processes branched from one parent process information read and written by the processes are clustered for each cluster ID, and a ransomware attack is detected and blocked according to whether the clustered information is changed or damaged.

Abstract: A method of predicting fetal or neonatal disease based on the stage of maternal periodontitis is presented to predict fetal or neonatal disease, specifically, any one or more of small for gestational age, neonatal general health, neonatal respiratory disease, retinopathy of prematurity, and patent ductus arteriosus requiring treatment, before birth by determining the stage of maternal periodontitis in a noninvasive and clear manner.

Abstract: Point of sale devices are disclosed. A register point-of-sale system may include: a register base; a customer screen that is removeable received by the register base; a merchant screen adjustably mounted on the register base; and a card reader integrated into the customer screen. A mobile payment terminal system may include: a mobile payment terminal comprising a wireless card reader, magnetic stripe reader, slot that receives a chip card, a screen, and an integrated receipt printer; and a dock that removably receives the mobile payment terminal. A mobile card reader system may include a cylindrical mobile card reader comprising a screen, a wireless card reader, a magnetic stripe reader, a slot that receives a chip card, and a plurality of base slots that receive a plurality of base latches; and a cylindrical base with an angled end and latches.

Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.

Abstract: A method for displaying charge and gain energy by a vehicle solar roof system is provided. The method includes determining whether the vehicle is in a parking or driving mode based on whether the vehicle key is turned on or off when the solar roof system installed in the vehicle operates. A corresponding consumed energy is calculated by determining whether the solar roof system charges the auxiliary battery or the main battery. The consumed energy is displayed in the cluster of the vehicle and booting is performed when the key is turned on in the parking mode and displayed when the key is turned off in the driving mode. The consumed energy is calculated based on efficiency of a charge amount of the auxiliary battery or the main battery and a gain fuel amount is changed based on the charge amount and calculated due to the saved energy.

Abstract: Provided is a method for delegating a device ownership based on a blockchain. The blockchain-based device ownership delegating method may include: transferring a device ownership request of a first user to a blockchain; providing a smart contract based ownership request event generated by the blockchain to a second user; transferring a device ownership change request of the second user to the blockchain; providing a smart contract based ownership change event generated by the blockchain to a device decentralized application (DApp); changing a device ownership; and recording a change history of the device ownership in the blockchain.