Abstract: A method and system of controlling an engine for vehicle interior heating is provided. The method includes performing a first engine control when the engine is not in an engine-on state for vehicle driving, to perform heating control for interior heating at a predetermined range of a reference coolant temperature. Additionally, the method includes performing a second engine control when the engine is in an engine-on state for vehicle driving, to prolong an engine-on time for vehicle driving by setting a minimum value of the range of the reference coolant temperature to a lower value and setting a maximum value of the range of the reference coolant temperature to a higher value and to determine a point of time of engine-off operation based on a real-time lock up time and an average lock up time of an engine clutch for vehicle driving.

Abstract: The present invention relates to a power control apparatus for sub-modules in a Modular Multilevel Converter (MMC), which controls the supply of power to sub-modules in an MMC connected to an HVDC system and to a STATCOM.

Abstract: A power supply device for HVDC controller is provided. The power supply device comprises: a first High Voltage Direct Current (HVDC) converter unit connected to an active power grid; a second HVDC converter unit connected to a passive power grid, the second HVDC converter unit being capable of receiving first DC power from the first HVDC converter unit by being connected to the first HVDC converter unit via a Direct Current (DC) transmission line; and an HVDC controller, arranged in the second HVDC converter unit, for receiving the first DC power, applied from the first HVDC converter unit to the second HVDC converter unit, by being connected to the DC transmission line that connects the first HVDC converter unit with the second HVDC converter unit.

Abstract: An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing an adhesive layer to attach an upper electronic package to a lower die and/or utilizing metal pillars for electrically connecting the upper electronic package to a lower substrate, wherein the metal pillars have a smaller height above the lower substrate than the lower die.

Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.

Abstract: The present invention relates to a module replacement device of a high voltage direct current transmission system. In the present invention, a replacement base (40) is provided in a structure (1) by using a support member (70) such that a sub-module (30) movably provided at a fixing base (10) of the structure (1) can be replaced by being withdrawn outside of the structure (1). A rear end of a base plate (42) of the replacement base (40) is hooked to an insulation support part (9) of the structure (1), and a front end of the replacement base (40) is supported by the support member (70) hooked to one side of the structure (1). The support member (70) is provided with a turn buckle (74) so as to adjust the replacement base (40) such that the replacement base is horizontally provided thereto.

Abstract: An Internet-of-Things (IoT) system for public transportation service and a method of operating the same are disclosed. The IoT system includes on-vehicle devices, a management server, a plurality of bus stop access points (APs), and a wired/wireless bus stop access point (AP) communication network. The on-vehicle devices are mounted within a bus, i.e., a public transportation means. The management server is connected to the bus over an Internet, i.e., a wireless communication means. The plurality of bus stop APs are short distance communication APs, and are each provided in each bus stop at which the bus stops and configured to enable information to be exchanged between the bus stop and the bus. The wired/wireless bus stop AP communication network connects the plurality of bus stop APs. The management server performs Internet access processing to connect the bus stop AP communication network and an external terminal.

Abstract: The present invention provides an apparatus for bypassing a phase current from a malfunctioning sub module in a converter. The converter includes multiple sub modules each having an energy storage unit, and at least one power semiconductor circuit which is connected in parallel to the energy storage unit and which includes a power semiconductor switch and free-wheeling diodes, wherein the sub modules are connected in series to each other. The bypass apparatus for a converter according to the present invention comprises: a vacuum switch tube for disconnecting between a first connection terminal and a second connection terminal of a malfunctioning sub module upon the occurrence of a malfunction in a specific sub module and bypassing a phase current from said malfunctioning sub module; and a control device for controlling the operation of the vacuum switch tube.

Abstract: Disclosed is a white organic light emitting device. The white organic light emitting device includes a first emission part between a first electrode and a second electrode, a second emission part on the first emission part, and a third emission part on the second emission part. At least one of the first to third emission parts includes at least two emission layers including a red emission layer, and a position of the red emission layer is set to enhance a color reproduction rate and at least one of red efficiency, green efficiency, and blue efficiency.

Abstract: Disclosed is a white organic light emitting display device comprising first and second electrodes, and a first emitting part between the first and second electrodes, the first emitting part including a red emitting layer and a blue emitting layer adjacent to the red emitting layer, wherein the red emitting layer includes a first host material which does not absorb a blue light emitted from the blue emitting layer, and an organic light emitting display apparatus using the same.

Abstract: Disclosed is a white organic light emitting device. The white organic light emitting device includes a first emission part between a first electrode and a second electrode, a second emission part on the first emission part, and a third emission part on the second emission part. At least one of the first to third emission parts includes at least two emission layers including a red emission layer, and a position of the red emission layer is set to enhance a color reproduction rate and at least one of red efficiency, green efficiency, and blue efficiency.

Abstract: A semiconductor device and a manufacturing method thereof, which can reduce a number of manufacturing processes and/or can reduce a thickness of the semiconductor device. As a non-limiting example, various aspects of this disclosure provide for the elimination process steps and/or a reduction in package size based on dielectric layer characteristics.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor packages, and methods of making thereof, that comprise a cover layer that enhances reliability of the semiconductor packages.

Abstract: The present invention relates to a direct current (DC) circuit breaker using a magnetic field, for generating a magnetic flux in a direction vertical to the direction of an arc current generated in a main switch so as to increase resistance to the arc current and for continuously supplying a circulating current from a DC line so as to further increase the magnetic flux and thus continuously increase the resistance to the arc current, thereby extinguishing an arc.

Abstract: The present invention relates to a high-voltage direct current (DC) circuit breaker which interrupts a fault current flowing in a power transmission or power distribution DC line when a fault occurs in the DC line.

Abstract: The present invention consists of: a first HVDC converter unit which is connected to a powered electrical grid; a second HVDC converter unit which is connected to a powerless electrical grid and connected to the first HVDC converter unit through a DC transmission line so as to receive a first DC power source from the first HVDC converter unit; a voltage distributor which is connected to the DC transmission line connecting the first HVDC converter unit and the second HVDC converter unit so as to receive and distribute the first DC power source applied from the first HVDC converter unit to the second HVDC converter unit, and output a second DC power source that is lower than the first DC power source; and a DC-DC converter which is connected to the voltage distributor so as to receive the second DC power source, convert the second DC power source into actuating power for use in a HVDC controller and output the actuating power.

Abstract: Provided is a lead frame for a semiconductor device, which includes a base layer made of copper, a strike plating layer or a self assembly monolayer (SAM), thereby preventing oxidation of a base layer while simplifying the manufacturing process, reducing the manufacturing costs and reducing a failure ratio. In one embodiment, in the lead frame for a semiconductor device including a die pad and a plurality of leads positioned adjacent to each other around the die pad, the lead frame includes a base layer made of copper; and a first strike plating layer formed on the one or more portions of the surface of the base layer.

Abstract: An information display system for a switching device having a handle includes a cover for the switching device and a faceplate. The cover includes an opening sized to allow passage of the handle. The faceplate is configured to carry information about the switching device. The faceplate is rotatable with respect to the cover to change an orientation of the information.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor packages, and methods of making thereof, that comprise a cover layer that enhances reliability of the semiconductor packages.

Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.