Abstract: A semiconductor system according to an embodiment of the present disclosure includes a controller configured to output a command address, a first chip selection signal, and a second chip selection signal, and a semiconductor device, including a first rank and a second rank, configured to receive the command address, the first chip selection signal, and the second chip selection signal and configured to calibrate each termination resistance value based on the command address, the first chip selection signal, and the second chip selection signal. The first rank calibrates the termination resistance value of the first rank to a target resistance value based on the command address and the first chip selection signal when a write operation on the first rank is performed, and the first rank calibrates the termination resistance value of the first rank to a dynamic resistance value based on the second chip selection signal when a write operation on the second rank is performed.

Abstract: A semiconductor system includes a controller configured to apply a command address, a first chip selection signal, and a second chip selection signal, and a semiconductor device including a first rank and a second rank configured to calibrate each termination resistance, based on the command address, the first chip selection signal, and the second chip selection signal.

Abstract: A semiconductor system includes a controller configured to transmit a command address and a plurality of read strobe signals, and a semiconductor device including a first rank and a second rank that are configured to receive the command address and the plurality of read strobe signals and to perform a write operation and a read operation based on the command address. In the semiconductor device, the first rank is configured to calibrate a termination resistance value of the first rank to a target resistance value when a write operation for the first rank is performed. In the semiconductor device, the first rank is configured to calibrate the termination resistance value of the first rank to a dynamic resistance value based on the plurality of read strobe signals when a write operation for the second rank is performed.

Abstract: A memory device including a memory cell region having a normal cell array and a redundant cell array, a fuse unit having a plurality of fuse sets corresponding to the redundant cell array and which is used for programming an address of a repair target memory cell of the normal cell array and a deciding unit which determines fuse sets that are used in a first operation mode according to a control signal.

Abstract: Disclosed is a memory device including a plurality of memory cell arrays each of which includes a normal cell array and a redundant cell array, a first fuse unit including a plurality of first fuse sets corresponding to first memory cell arrays among the memory cell arrays, a second fuse unit including a plurality of second fuse sets corresponding to second memory cell arrays among the memory cell arrays, the first fuse sets corresponding to the second fuse sets, respectively, and a repair unit selecting a pair of fuse sets that correspond to each other from the first fuse sets and the second fuse sets based on information that represents whether each of the first fuse sets and the second fuse sets failed or is usable and programming a repair target column address of the memory cell arrays in the selected fuse set pair.

Abstract: Disclosed is a memory device including a plurality of memory cell arrays each of which includes a normal cell array and a redundant cell array, a first fuse unit including a plurality of first fuse sets corresponding to first memory cell arrays among the memory cell arrays, a second fuse unit including a plurality of second fuse sets corresponding to second memory cell arrays among the memory cell arrays, the first fuse sets corresponding to the second fuse sets, to respectively, and a repair unit suitable for selecting a pair of fuse sets that correspond to each other from the first fuse sets and the second fuse sets based on information that represents whether each of the first fuse sets and the second fuse sets failed or is usable and programming a repair target column address of the memory cell arrays in the selected fuse set pair.

Abstract: A semiconductor memory device includes: a plurality of memory cell arrays each memory cell array including a first region, a second region, and a third region in the second region; and a repair controller suitable for storing a first repair address information, generating a first mode enable signal for accessing the third region by comparing the first repair address information with a row address during a first mode for a repair operation, and disabling the first mode enable signal in response to a refresh command regardless of a result of the comparing the first repair address information with the row address.

Abstract: A memory device includes a memory cell region that includes a normal cell array and a redundant cell array, a fuse unit that includes a plurality of fuse sets corresponding to the redundant cell array, for programming an address of a repair target memory cell of the normal cell array, and a deciding unit suitable for determining fuse sets that are used in a first operation mode, among the plurality of the fuse sets, according to a control signal.

Abstract: A semiconductor memory device includes: a plurality of memory cell arrays each memory cell array including a first region, a second region, and a third region in the second region; and a repair controller suitable for storing a first repair address information, generating a first mode enable signal for accessing the third region by comparing the first repair address information with a row address during a first mode for a repair operation, and disabling the first mode enable signal in response to a refresh command regardless of a result of the comparing the first repair address information with the row address.

Abstract: A semiconductor memory apparatus includes a plurality of cell arrays; and a use information storage block configured to determine whether a data write operation has already been performed for the plurality of cell arrays, and generate a plurality of control signals, wherein the semiconductor memory apparatus is configured to control a refresh operation for the plurality of cell arrays according to the plurality of control signals.

Abstract: A semiconductor circuit includes a test control unit configured to generate a driving activation signal and a sensing activation signal in response to a command and an address; a pad; a driver configured to drive the pad to a predetermined level in response to activation of the driving activation signal; and a sensing unit configured to compare a voltage level of the pad with a reference voltage in response to activation of the sensing activation signal, and output a sensing signal.

Abstract: A memory device including first to fourth cell blocks, each including a plurality of normal columns and one or more redundancy columns and a control unit suitable for repairing the normal columns using the redundancy columns in the first and the second cell blocks using first repair information and repairing the normal columns using the redundancy columns in the third and the fourth cell blocks using second repair information when the memory device is set as a first mode, and suitable for repairing the normal columns using the redundancy columns in the first and the third cell blocks using the first repair information and repairing the normal columns using the redundancy columns in the second and the fourth cell blocks using the second repair information when the memory device is set as a second mode.

Abstract: A semiconductor memory device includes a first fuse set block including a fuse array for storing first repair information, and a control block configured to store second repair information in a first mode, and generate an output control signal when input addresses applied from an external source and the second repair information are the same, in a second mode, wherein the first fuse set block enables a first match signal for accessing a first redundancy memory cell when the stored first repair information and the input addresses are the same, and disables the first match signal in response to the output control signal.

Abstract: A semiconductor memory apparatus includes a plurality of cell arrays; and a use information storage block configured to determine whether a data write operation has already been performed for the plurality of cell arrays, and generate a plurality of control signals, wherein the semiconductor memory apparatus is configured to control a refresh operation for the plurality of cell arrays according to the plurality of control signals.

Abstract: A semiconductor memory device includes a first fuse set block including a fuse array for storing first repair information, and a control block configured to store second repair information in a first mode, and generate an output control signal when input addresses applied from an external source and the second repair information are the same, in a second mode, wherein the first fuse set block enables a first match signal for accessing a first redundancy memory cell when the stored first repair information and the input addresses are the same, and disables the first match signal in response to the output control signal.

Abstract: A semiconductor memory device may include: a first fuse set unit suitable for storing a first repair address during a first mode; a second fuse set unit suitable for storing an input address during a second mode; and a comparison unit suitable for comparing the input address with the first repair address, wherein the first fuse set unit is reset when the first repair address is the same as the input address.

Abstract: A memory device including first to fourth cell blocks, each including a plurality of normal columns and one or more redundancy columns and a control unit suitable for repairing the normal columns using the redundancy columns in the first and the second cell blocks using first repair information and repairing the normal columns using the redundancy columns in the third and the fourth cell blocks using second repair information when the memory device is set as a first mode, and suitable for repairing the normal columns using the redundancy columns in the first and the third cell blocks using the first repair information and repairing the normal columns using the redundancy columns in the second and the fourth cell blocks using the second repair information when the memory device is set as a second mode.

Abstract: A semiconductor memory device may include: a first fuse set unit suitable for storing a first repair address during a first mode; a second fuse set unit suitable for storing an input address during a second mode; and a comparison unit suitable for comparing the input address with the first repair address, wherein the first fuse set unit is reset when the first repair address is the same as the input address.

Abstract: A fuse circuit includes an E-fuse array including a plurality of E-fuse elements configured to store fuse data; a latch block including a plurality of latch groups configured to latch the fuse data read from the E-fuse array; and a control block configured to output latch reset signals corresponding to the plurality of latch groups in response to an apparatus reset signal and a clock signal, wherein the control block sequentially enables the latch reset signals.

Abstract: A memory device may include an address latch circuit that latches an address received from an exterior of the memory device, a repair signal generation circuit that generates a soft repair signal, a selection information generation circuit that generates first selection information by using first bits of a latched address latched by the address latch circuit, first to Nth register circuits that store second bits of the latched address as repair data by being selected by the first selection information when the soft repair signal is activated, and first to Nth memory blocks that perform repair operations using the repair data stored in the respective first to Nth register circuits.