Abstract: A memory device may include an address latch circuit that latches an address received from an exterior of the memory device, a repair signal generation circuit that generates a soft repair signal, a selection information generation circuit that generates first selection information by using first bits of a latched address latched by the address latch circuit, first to Nth register circuits that store second bits of the latched address as repair data by being selected by the first selection information when the soft repair signal is activated, and first to Nth memory blocks that perform repair operations using the repair data stored in the respective first to Nth register circuits.

Abstract: A repair circuit includes a column repair signal generation block suitable for comparing an input address with respective first and second repair addresses in response to a mode control signal, and generating first and second column repair signals; a normal decoder suitable for accessing any one of a first normal column line corresponding to the input address and a second normal column line corresponding to an address that is different in terms of a most significant bit from the input address, in response to the first and second column repair signals; and a redundancy decoder suitable for decoding the first repair address in response to the first and second column repair signals, wherein the second repair address is generated by inverting a most significant bit of the first repair signal.

Abstract: A repair circuit includes a column repair signal generation block suitable for comparing an input address with respective first and second repair addresses in response to a mode control signal, and generating first and second column repair signals; a normal decoder suitable for accessing any one of a first normal column line corresponding to the input address and a second normal column line corresponding to an address that is different in terms of a most significant bit from the input address, in response to the first and second column repair signals; and a redundancy decoder suitable for decoding the first repair address in response to the first and second column repair signals, wherein the second repair address is generated by inverting a most significant bit of the first repair signal.

Abstract: A memory device may include an address latch circuit that latches an address received from an exterior of the memory device, a repair signal generation circuit that generates a soft repair signal, a selection information generation circuit that generates first selection information by using first bits of a latched address latched by the address latch circuit, first to Nth register circuits that store second bits of the latched address as repair data by being selected by the first selection information when the soft repair signal is activated, and first to Nth memory blocks that perform repair operations using the repair data stored in the respective first to Nth register circuits.

Abstract: A fuse circuit includes an E-fuse array including a plurality of E-fuse elements configured to store fuse data; a latch block including a plurality of latch groups configured to latch the fuse data read from the E-fuse array; and a control block configured to output latch reset signals corresponding to the plurality of latch groups in response to an apparatus reset signal and a clock signal, wherein the control block sequentially enables the latch reset signals.

Abstract: A repair system for a semiconductor apparatus includes a tester configured to generate memory repair data including a die identification information and repair addresses, and a command to perform a repair process; and a semiconductor apparatus including a plurality of dies configured to receive the memory repair data, wherein one of the dies corresponding to the die identification information performs a repair operation according to the repair addresses and the command.

Abstract: A semiconductor circuit includes a test control unit configured to generate a driving activation signal and a sensing activation signal in response to a command and an address; a pad; a driver configured to drive the pad to a predetermined level in response to activation of the driving activation signal; and a sensing unit configured to compare a voltage level of the pad with a reference voltage in response to activation of the sensing activation signal, and output a sensing signal.

Abstract: A data write circuit of a semiconductor apparatus includes a plurality of latches configured to latch a plurality of data in response to activation of a plurality of control signals and output the latched data to data lines; and a control unit configured to generate the plurality of control signals to be activated at different timings, such that partial data input at relatively earlier timing among the plurality of data is latched at earlier timing than the other data by a portion of the plurality of latches.

Abstract: A repair control circuit and a semiconductor integrated circuit using the same, which can reduce test time, are provided. The semiconductor integrated circuit includes a plurality of memory blocks in which a plurality of word lines are arranged, a plurality of word line drivers driving one or more of the plurality of word lines in response to a plurality of memory block selection signals, and a repair control circuit determining whether to perform a repair through comparison of repair addresses generated in response to surplus addresses and the plurality of memory block selection signals with external addresses.

Abstract: An anti-fuse control circuit includes a first power supply voltage application unit, a second power supply voltage application unit and a control unit. The first power supply voltage application unit configured to selectively apply first power supply voltage to an output node in response to a power up signal. The second power supply voltage application unit configured to selectively apply second power supply voltage to the output node in response to a program signal. The control unit configured to control a connection between the output node and an anti-fuse in response to the power up signal when the program signal is inactivated.

Abstract: A repair control circuit and a semiconductor integrated circuit using the same, which can reduce test time, are provided. The semiconductor integrated circuit includes a plurality of memory blocks in which a plurality of word lines are arranged, a plurality of word line drivers driving one or more of the plurality of word lines in response to a plurality of memory block selection signals, and a repair control circuit determining whether to perform a repair through comparison of repair addresses generated in response to surplus addresses and the plurality of memory block selection signals with external addresses.

Abstract: A semiconductor integrated circuit includes a command generating unit configured to generate a plurality of second commands in response to a first command, each second command for indicating an operation sections of a corresponding anti-fuse circuit, and a plurality of anti-fuse circuits, each comprising an anti-fuse and configured to receives a corresponding second command and perform a rupture operation of the anti-fuse in response to the received corresponding second command.

Abstract: A semiconductor device includes a device identification detection code output block configured to output a device identification detection code to an outside of the semiconductor device when the semiconductor device enters an identification (ID) read mode, a code comparison block configured to compare a device selection code applied from the outside with the device identification detection code when the semiconductor device enters a device selection mode, and generate a device matching signal based on a comparison result, and an internal circuit block configured to decide whether to perform a predetermined internal operation based on the device matching signal when the semiconductor device enters an operation control mode.

Abstract: An anti-fuse control circuit includes a first power supply voltage application unit, a second power supply voltage application unit and a control unit. The first power supply voltage application unit configured to selectively apply first power supply voltage to an output node in response to a power up signal. The second power supply voltage application unit configured to selectively apply second power supply voltage to the output node in response to a program signal. The control unit configured to control a connection between the output node and an anti-fuse in response to the power up signal when the program signal is inactivated.

Abstract: A semiconductor integrated circuit includes a command generating unit configured to generate a plurality of second commands in response to a first command, each second command for indicating an operation sections of a corresponding anti-fuse circuit, and a plurality of anti-fuse circuits, each comprising an anti-fuse and configured to receives a corresponding second command and perform a rupture operation of the anti-fuse in response to the received corresponding second command.

Abstract: A data write circuit of a semiconductor apparatus includes a plurality of latches configured to latch a plurality of data in response to activation of a plurality of control signals and output the latched data to data lines; and a control unit configured to generate the plurality of control signals to be activated at different timings, such that partial data input at relatively earlier timing among the plurality of data is latched at earlier timing than the other data by a portion of the plurality of latches.

Abstract: A semiconductor device includes a device identification detection code output block configured to output a device identification detection code to an outside of the semiconductor device when the semiconductor device enters an identification (ID) read mode, a code comparison block configured to compare a device selection code applied from the outside with the device identification detection code when the semiconductor device enters a device selection mode, and generate a device matching signal based on a comparison result, and an internal circuit block configured to decide whether to perform a predetermined internal operation based on the device matching signal when the semiconductor device enters an operation control mode.

Abstract: A data write circuit of a semiconductor apparatus includes a plurality of latches configured to latch a plurality of data in response to activation of a plurality of control signals and output the latched data to data lines; and a control unit configured to generate the plurality of control signals to be activated at different timings, such that partial data input at relatively earlier timing among the plurality of data is latched at earlier timing than the other data by a portion of the plurality of latches.