Patents by Inventor Jung-Won Park

Jung-Won Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12198858
    Abstract: A multilayer electronic component includes: a body and an external electrode disposed on the body, wherein the external electrode includes a conductive resin layer containing a bisphenol A-based resin and a biphenyl-based resin with a specific mixing ratio (e.g., a ratio of a content of the biphenyl-based resin with respect to a total content is 10 wt % or more and 50 wt % or less). Such a resin mixing ratio between the bisphenol A-based resin and the biphenyl-based resin can lead to 0.337?2*C/A?0.367 or 0.048?B/A?0.14, with an aromatic ring peak intensity (A), a carbonyl peak intensity (B), and an alcohol peak intensity (C) in a Fourier transform infrared spectroscopy (FT-IR) analysis. The multilayer electronic component showing such peak intensity characteristics can suppress oxidation of a conductive resin layer while also securing excellent adhesive strength of the conductive resin layer.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: January 14, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Og Soon Kim, Chae Dong Lee, Hye Won Kim, Jung Won Park
  • Publication number: 20240373560
    Abstract: In an aspect, a substrate is disclosed that includes an electronic component including a lower planar surface having one or more electronic component terminals, a core having an upper planar surface facing the lower planar surface of the electronic component; a patterned metallization layer over the upper planar surface of the core, wherein the patterned metallization layer is connected to the one or more electronic component terminals at the lower planar surface of the electronic component; one or more dielectric layers disposed over the upper planar surface of the core; and a cavity formed within the one or more dielectric layers, wherein the electronic component is located in the cavity and over the upper planar surface of the core.
    Type: Application
    Filed: May 1, 2023
    Publication date: November 7, 2024
    Inventors: Seongryul CHOI, Kuiwon KANG, Hong Bok WE, Jung Won PARK
  • Publication number: 20240373561
    Abstract: In an aspect, an electronic device is disclosed that includes a substrate comprising a core having an upper planar surface and a lower planar surface, wherein the core includes a cavity extending between the upper planar surface of the core and the lower planar surface of the core; an electronic component at least partially disposed in the cavity, wherein the electronic component is at least partially surrounded in the cavity by a cured plugging ink, the electronic component including an upper planar surface having one or more electronic component terminals; and an upper metallization structure configured to provide one or more conductive paths from the one or more electronic component terminals to one or more upper metal terminals of the upper metallization structure.
    Type: Application
    Filed: May 1, 2023
    Publication date: November 7, 2024
    Inventors: Jung Won PARK, Kuiwon KANG, Seongryul CHOI
  • Publication number: 20240373562
    Abstract: In an aspect, an electronic device is disclosed that includes a core having an upper planar surface and an interior planar surface; a cavity extending at least partially through the upper planar surface of the core to the interior planar surface of the core; an electronic component mounted in the cavity, the electronic component including an upper planar surface having one or more electronic component terminals, wherein the electronic component is supported by the interior planar surface of the core so that the upper planar surface of the electronic component is level with the upper planar surface of the core; and an upper metallization structure configured to provide one or more conductive paths from the one or more electronic component terminals to one or more upper metal terminals of the upper metallization structure.
    Type: Application
    Filed: May 1, 2023
    Publication date: November 7, 2024
    Inventors: Seongryul CHOI, Kuiwon KANG, Jung Won PARK
  • Publication number: 20240360265
    Abstract: A multiblock copolymer, a method for preparing same, and a thermoplastic resin composition comprising polypropylene and the multiblock copolymer are described herein. The block copolymer has excellent processability and excellent compatibility with polypropylene, and the thermoplastic resin composition of the present disclosure using the same shows excellent low temperature impact strength and may be usefully used as a thermoplastic resin composition for the manufacture of a product requiring high impact resistance such as automotive parts.
    Type: Application
    Filed: September 30, 2022
    Publication date: October 31, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Ji Hyun Park, Jung Won Park, Chang Jong Kim, Eun Ji Shin, Seok Pil Sa, Seul Ki Im, Hyun Mo Lee, Yun Kon Kim
  • Publication number: 20240312718
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.
    Type: Application
    Filed: February 21, 2024
    Publication date: September 19, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: So Jung AN, Hyung Jong CHOI, Jung Won PARK, Yoo Jeong LEE, Kwang Yeun WON, Woo Kyung SUNG, Byung Jun JEON, Chul Seung LEE
  • Publication number: 20240218345
    Abstract: Provided are a method of decolorizing a composition including pectate lyase, and a decolorizing composition for the composition including pectate lyase.
    Type: Application
    Filed: January 2, 2024
    Publication date: July 4, 2024
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Jung Won PARK, Hyo Hyoung LEE, Sungkyun LEE, Young Kyung KIM, Taek Beom KIM, Chang Jun JI, Yu Shin KIM, Minhoe KIM
  • Publication number: 20240222030
    Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.
    Type: Application
    Filed: September 26, 2023
    Publication date: July 4, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yoo Jeong LEE, Kwang Yeun WON, Hyung Jong CHOI, So Jung AN, Jung Won PARK, Woo Kyung SUNG, Byung Jun JEON, Chul Seung LEE
  • Publication number: 20240222032
    Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer, wherein the plating layer includes an extension extending onto the body to contact the body, and the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the grain is 70 degrees or greater and 110 degrees or less.
    Type: Application
    Filed: December 14, 2023
    Publication date: July 4, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: So Jung An, Hyung Jong Choi, Jung Won Park, Yoo Jeong Lee, Kwang Yeun Won, Woo Kyung Sung, Byung Jun Jeon, Chul Seung Lee
  • Publication number: 20240203646
    Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.
    Type: Application
    Filed: October 20, 2023
    Publication date: June 20, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Won PARK, Hyung Jong CHOI, So Jung AN, Yoo Jeong LEE, Kwang Yeun WON, Woo Kyung SUNG, Byung Jun JEON, Chul Seung LEE
  • Patent number: 11915875
    Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chae Dong Lee, Og Soon Kim, Hye Won Kim, Jung Won Park
  • Publication number: 20240003554
    Abstract: The present disclosure relates to an electric adapter type controller for air conditioner outdoor unit auxiliary cooling device and, in more detail, an electric adapter type controller for air conditioner outdoor unit auxiliary cooling device that can measure used-power and check the operation of an outdoor unit installed outside on the basis of power that is consumed, by connecting an electrical outlet (wall socket, etc.) and the plug of an electric device (an air conditioner, a water tank cooler, etc.) to each other using an adapter even without specific electric equipment, and that can reduce the temperature of the outdoor unit and increase heat exchange efficiency by spraying micro-particle cooling water to the surface of a heat exchanger of the outdoor unit.
    Type: Application
    Filed: September 6, 2021
    Publication date: January 4, 2024
    Applicant: EASYX Co., Ltd.
    Inventors: Sang Cheol PARK, Jung Won PARK
  • Patent number: 11842856
    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: December 12, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Won Kim, Won Kuen Oh, Chae Dong Lee, Og Soon Kim, Jung Won Park
  • Publication number: 20230357033
    Abstract: Proposed is a method of preparing high-purity lithium carbonate through reduction calcining of waste cathode materials without using a carbonate such as sodium carbonate. The method reduces the amount of water required for lithium carbonate recovery, thereby reducing energy consumption for evaporation of water. The method includes (a) preparing scrap powder, (b) reducing and calcining the scrap powder using activated carbon, (c) preparing a lithium hydrogen carbonate solution by adding carbon dioxide gas and the reduced and calcined scrap powder to 8° C. to 12° C. soft water, (d) separating the lithium hydrogen carbonate solution into solid and liquid; (e) converting lithium hydrogen carbonate into lithium carbonate by heating, evaporating, and concentrating the lithium hydrogen carbonate solution, and (f) obtaining the lithium carbonate through filtration.
    Type: Application
    Filed: March 6, 2023
    Publication date: November 9, 2023
    Inventors: Jung Won PARK, Deock Kyu AN, Dipak SEN
  • Patent number: 11759498
    Abstract: Mite proteins according to an aspect may be used in diagnosing allergic diseases. Results of diagnosing allergic diseases by using the proteins have high reliability and validity. Further, the proteins may be used in a composition for preventing or treating allergic diseases.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: September 19, 2023
    Assignee: Industry-Academic Cooperation Foundation, Yonsei University
    Inventors: Kyoung Yong Jeong, Kyung Hee Park, Jung Won Park, Chang Ook Park, Kwang Hoon Lee
  • Patent number: 11721460
    Abstract: A method for preparing a metal powder includes preparing a mixture by mixing a fluoride of a group 1 element, a fluoride of a group 2 element or a transition metal fluoride, with neodymium oxide, boron, iron, and a reducing agent; and heating the mixture at a temperature of 800° C. to 1100° C.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: August 8, 2023
    Inventors: June Ho In, Soon Jae Kwon, Ik Jin Choi, Hyoun Soo Uh, Jung Won Park, Byung Kyu Lim, Pum Suk Park
  • Publication number: 20230212033
    Abstract: An apparatus for controlling chemical dosing optimization in a water treatment plant treating feed water includes: a control value derivation part configured to receive real-time data, analyze the real-time data through a water treatment model and a controller in response to receiving the real-time data, and calculate a control value, such that the control value is to set a minimum of a chemical dosage while maintaining a state of treated water of the water treatment plant in a normal range, the water treatment model simulating the water treatment plant and the controller being an optimization algorithm; and a chemical dosing output control part configured to provide the control value to a water treatment control device.
    Type: Application
    Filed: January 4, 2023
    Publication date: July 6, 2023
    Inventors: Sang Gun NA, Hyun Sik KIM, Jun Woo YOO, Yeong Hyeok KIM, Jung Won PARK, Young Geun LEE
  • Publication number: 20230215639
    Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.
    Type: Application
    Filed: April 21, 2022
    Publication date: July 6, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chae Dong LEE, Og Soon KIM, Hye Won KIM, Jung Won PARK
  • Publication number: 20230213898
    Abstract: A chemical dosing optimization apparatus includes a chemical dosing optimization part and a chemical dosing output control part, wherein the chemical dosing optimization part receives real-time data at least from a water treatment plant treating feed water by dosing a chemical and providing a treated water, analyzes the real-time data through a water treatment model in response to receiving the real-time data, derives a prediction value for predicting a state of the treated water of the water treatment plant, and derives a control value based on the prediction value through a controller, such that the control value is to set a minimum of a chemical dosage to be dosed in the feed water while the state of the treated water of the water treatment plant is maintained in a normal range, and wherein the chemical dosing output control part provides the control value to a water treatment control device.
    Type: Application
    Filed: January 4, 2023
    Publication date: July 6, 2023
    Inventors: Sang Gun NA, Jae KWAK, Yeong Hyeok KIM, Jung Won PARK, Young Geun LEE, Hyun Sik KIM, Jun Woo YOO
  • Publication number: 20230215649
    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.
    Type: Application
    Filed: March 29, 2022
    Publication date: July 6, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Won KIM, Won Kuen OH, Chae Dong LEE, Og Soon KIM, Jung Won PARK