Abstract: In a capacitor having a high dielectric constant, the capacitor includes a cylindrical lower electrode, a dielectric layer and an upper electrode. A metal oxide layer is formed on inner, top and outer surfaces of the lower electrode as the dielectric layer. A first sub-electrode is formed on a surface of the dielectric layer along the profile of the lower electrode and a second sub-electrode is continuously formed on the first sub-electrode corresponding to the top surface of the lower electrode, so an opening portion of the lower electrode is covered with the second sub-electrode. The first and second sub-electrodes include first and second metal nitride layers in which first and second stresses are applied, respectively. Directions of the first and second stresses are opposite to each other. Accordingly, cracking is minimized in the upper electrode with the high dielectric constant, thereby reducing current leakage.

Abstract: An inkjet printer includes an ink tank, a head chip comprising a nozzle and a signal pad, a base plate provided between the ink tank and the head chip and having a first ink flow path through which ink of the ink tank is supplied to the head chip, a head chip supporting member provided between the base plate and the head chip, comprising a second ink flow path which makes the nozzle communicate with the first ink flow path, and detachably combined to the base plate together with the head chip, and a controlling part which controls the head chip.

Abstract: An inkjet print head chip capable of preventing an adhesive from flowing over a nozzle part during a connection work of a flexible printed circuit board thereto is provided with a nozzle part to have a plurality of nozzles formed therein; a plurality of connecting pads disposed at a side of the nozzle part and electrically connected to a plurality of ink firing portions formed under the nozzle part; and an overflow prevention dam disposed between the nozzle part and the plurality of connecting pads and to have a height higher than the plurality of connecting pads.

Abstract: Provided is a session management method of managing a session created between a wireless universal serial bus (USB) host and a wireless USB device through a wireless network, the session management method including: receiving session status messages periodically transmitted for checking a status of the created session; counting a number of continuous reception failures representing a number of the session status messages that are not received; and if the number of the continuous reception failures of session status messages is greater than a reference number, changing the current status of the session to a suspended status if the current status of the session is a connected status, and closing the created session if the current status of the session is a suspended status.

Abstract: A method of interfacing between a universal serial bus (USB) host and a USB device. The USB host and the USB device include modules to process packets according to network protocols, instead of USB bus interfaces. Therefore, the USB device can be connected to the USB host even without a USB cable, and thus is not affected by the distance between the USB host and USB device.

Abstract: A liquid toner composition and a preparation method utilize a colorant, an organosol, a charge control agent, a carrier liquid, a dispersion assistant agent, and a photoreactive catalyst, in which the dispersion assistant agent is a polymer including an unsaturated functional group to cause photopolymerization in a presence of the photoreactive catalyst, and the photoreactive catalyst produces a free radical through an irradiation of light, and initiates the photopolymerization of the dispersion assistant agent. According to embodiments of the present invention, the toner organosol rarely affects the physical properties required of the liquid toner, and an offset error in a fixing operation is removed, resulting in an improved quality of a printed image.

Abstract: A developer cartridge for a wet-type image forming apparatus including a cartridge body in which developer is stored. The cartridge body has a supply hole formed thereon to supply the developer in the cartridge to the image forming apparatus. A filter is disposed in the cartridge body to improve the dispersion of the developer, and to filter sludge of the developer before the developer flows into the supply hole.

Abstract: An apparatus to manufacture a semiconductor includes a plasma-limiting device to limit a plasma region in a reaction chamber. The plasma-limiting device includes a first limiting device to limit the plasma region in the reaction chamber to a first plasma region, a second limiting device to limit the plasma region in the reaction chamber to a second plasma region having an area larger than an area of the first plasma region, and a driving device to simultaneously move the first and second limiting devices to vary the plasma region.

Abstract: A method for cleaning a processing chamber and manufacturing a semiconductor device by removing impurities from a substrate in the processing chamber with a plasma of a first gas including hydrogen gas. After the substrate is removed from the processing chamber, the processing chamber is etched with the plasma of a non-hydrogenous second gas. Thus, the etching selectivity can be improved and the particles are prevented from depositing and/or forming on the substrate.

Abstract: An ion neutralizer enhances a heat transfer rate between a reflecting plate and a frame while preventing the reflecting plate from being bent due to thermal deformation. The ion neutralizer includes a frame and a plurality of reflecting plates integrally formed with the frame to neutralize plasma ions. Each reflecting plate has a cantilever shape. Each reflecting plate has a supporting end in surface contact with the frame, and a free end to define a space with the frame in order to prevent the reflecting plate from being bent upon stretching due to thermal deformation.

Abstract: An ink cartridge of an inkjet printer includes at least one ink tank, at least one negative pressure adjusting part, an ink channel unit, and at least one print head having nozzles, wherein the ink channel unit is surface-treated by an ion assisted reaction (IAR) before being assembled.

Abstract: A test apparatus to evaluate the electrical properties of a liquid toner in which a printing quality of the liquid toner may be predicted by evaluating the electrical properties of the liquid toner without performing printing. The test apparatus to evaluate the electrical properties of a liquid toner includes a roller, a conductive flat panel positioned below the roller to move a predetermined distance in contact with the roller, a power supply device applying a voltage to the roller and the conductive flat panel, and a voltage tester provided at the rear of the roller to move together with the roller, testing a voltage of the liquid toner arranged on the conductive flat panel.

Abstract: A method for forming a tungsten contact plug of a semiconductor device including depositing an insulating layer on a semiconductor substrate, etching the insulating layer to form a contact hole, which exposes a conductive region, forming a barrier layer on the semiconductor substrate having the contact hole, changing characteristics of a portion of the barrier layer on the insulating layer and the portion of the barrier layer in the contact hold such that the characteristics between the barrier layer on the insulating layer and the barrier layer in the contact hole differ, depositing a tungsten layer for forming the tungsten contact plug, on the barrier layer, and removing the tungsten layer from the upper portion of the insulating layer to planarize the semiconductor device.

Abstract: A wire bonding structure that electrically connects a printhead chip with a flexible printed circuit (FPC) using a wire includes a ball formed on a bonding pad provided on a surface of the printhead chip, a wire having a first end connected to the ball and a second end bonded to the FPC, the first end of the wire connected to the ball has a bent portion in which a first portion of the wire is bent over a surface of the bonding pad to overlap a second portion of the wire located over the surface of the bonding pad.

Abstract: The nozzle error correction method is provided for adjusting information of an output image to correct an error nozzle. A position of an error nozzle firing an ink amount different from a reference value is detected from a plurality of nozzles. A determination is made from an input image as to whether a current pixel for output is an error pixel of the detected error nozzle. A channel value of the error nozzle is set to a certain value if the current pixel is the error pixel. However, if the current pixel is not the error pixel, a determination is made as to whether an error pixel exists in a certain area around the current pixel. A value of the current pixel is then adjusted based on error information. Image-processing is performed in order for the current pixel to be outputted, if the error pixel exists in the certain area. Accordingly, degradation of a print speed and a shortened life span of the head are prevented.

Abstract: In a stacked semiconductor device and method of manufacturing the same, an insulation multilayer pattern is formed on a substrate. The insulation multilayer pattern includes a first insulating interlayer pattern, a second insulating interlayer pattern and an opening exposing a surface of the substrate. A first channel pattern may be interposed between the first insulating interlayer pattern and the second insulating interlayer pattern, with a sidewall of the channel pattern being exposed through the opening. A barrier metal layer including a first continuous sub-layer is provided along a sidewall and bottom surface of the opening. The first sub-layer may have a substantially uniform thickness around the first channel pattern.

Abstract: A reaction apparatus including: a main body having a reaction chamber with an upper opening thereof, a lid hinge, and a lid combined to the lid hinge, rotationally opening and closing the upper opening; a lifting member having a first end part separated from a rotation axis of the lid and rotatably combined with the lid, and a second end part rotatably combined to the main body, that moves in opening and closing directions; and a driver activating the lifting member. With this configuration, the present invention provides a reaction apparatus, with a lid that is opened and closed readily, and in which the lid parallelly contacts a sealing member, and thereby creating a vacuum in the reaction chamber with ease.

Abstract: A semiconductor device, and a method of fabricating the same, includes cobalt as a capping layer. An interconnection structure of the semiconductor device has an improved via resistance. In the semiconductor device, a single cobalt layer or a composite film including a cobalt layer and a titanium nitride layer is used as the capping layer of a metal layer.

Abstract: A developer cartridge for a wet-type image forming apparatus comprises a cartridge body in which developer is stored. The cartridge body has a supply hole formed thereon to supply the developer in the cartridge to the image forming apparatus. A filter is disposed in the cartridge body to improve the dispersion of the developer, and to filter sludge of the developer before the developer flows into the supply hole.

Abstract: In a capacitor having a high dielectric constant, the capacitor includes a cylindrical lower electrode, a dielectric layer and an upper electrode. A metal oxide layer is formed on inner, top and outer surfaces of the lower electrode as the dielectric layer. A first sub-electrode is formed on a surface of the dielectric layer along the profile of the lower electrode and a second sub-electrode is continuously formed on the first sub-electrode corresponding to the top surface of the lower electrode, so an opening portion of the lower electrode is covered with the second sub-electrode. The first and second sub-electrodes include first and second metal nitride layers in which first and second stresses are applied, respectively. Directions of the first and second stresses are opposite to each other. Accordingly, cracking is minimized in the upper electrode with the high dielectric constant, thereby reducing current leakage.