Patents by Inventor Jung Wu
Jung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Semiconductor device and manufacturing method thereof having grating coupled dies and nanostructures
Patent number: 12276838Abstract: A semiconductor device includes a photonic die and an optical die. The photonic die includes a grating coupler and an optical device. The optical device is connected to the grating coupler to receive radiation of predetermined wavelength incident on the grating coupler. The optical die is disposed over the photonic die and includes a substrate with optical nanostructures. Positions and shapes of the optical nanostructures are such to perform an optical transformation on the incident radiation of predetermined wavelength when the incident radiation passes through an area of the substrate where the optical nanostructures are located. The optical nanostructures overlie the grating coupler so that the incident radiation of predetermined wavelength crosses the optical die where the optical nanostructures are located before reaching the grating coupler.Type: GrantFiled: July 27, 2023Date of Patent: April 15, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu -
Publication number: 20250119195Abstract: A wireless signal transceiver device includes a receiver unit, a conversion module, an estimation module, a processing unit, and a storage unit. The receiver unit is configured to receive a wireless signal. The conversion module is electrically connected to the receiver unit and configured to convert the wireless signal into a frequency-domain signal. The estimation module is electrically connected to the conversion module and configured to estimate the frequency-domain signal so as to obtain first channel state information. The first channel state information includes a plurality of channel state information sub portions. The processing unit is electrically connected to the estimation module and configured to filter the first channel state information so as to obtain second channel state information. The storage unit is electrically connected to the processing unit and configured to store the second channel state information.Type: ApplicationFiled: September 30, 2024Publication date: April 10, 2025Applicant: REALTEK SEMICONDUCTOR CORP.Inventors: Shau-Yu Cheng, Cheng-Jung Wu, Yi-Ru Lai
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Patent number: 12267506Abstract: Techniques are disclosed for deriving prediction pixel blocks for use in intra-coding video and combined inter- and intra-coding video. In a first aspect, the techniques may include deriving value(s) for pixel location(s) of the prediction pixel block by, when a prediction direction vector assigned to the prediction vector points to quadrants I or III of a Cartesian plane, deriving the pixel location's value from pixel values in two regions of previously-decoded pixel data intercepted by extending the prediction direction vector in two opposite directions through the pixel location. When the prediction direction vector points toward quadrants II of the Cartesian plane, deriving the pixel location's value from pixel values in one region intercepted by the prediction direction vector through the pixel location, and from a second region intercepted by a vector that is orthogonal to the prediction direction vector.Type: GrantFiled: June 10, 2022Date of Patent: April 1, 2025Assignee: APPLE INC.Inventors: Mei Guo, Jun Xin, Hsi-Jung Wu, Alexandros Tourapis, Krishnakanth Rapaka
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Patent number: 12267496Abstract: Video coders and decoders perform transform coding and decoding on blocks of video content according to an adaptively selected transform type. The transform types are organized into a hierarchy of transform sets where each transform set includes a respective number of transforms and each higher-level transform set includes the transforms of each lower-level transform set within the hierarchy. The video coders and video decoders may exchange signaling that establishes a transform set context from which a transform set that was selected for coding given block(s) may be identified. The video coders and video decoders may exchange signaling that establishes a transform decoding context from which a transform that was selected from the identified transform set to be used for decoding the transform unit. The block(s) may be coded and decoded by the selected transform.Type: GrantFiled: July 25, 2023Date of Patent: April 1, 2025Assignee: APPLE INC.Inventors: Hilmi Enes Egilmez, Yunfei Zheng, Alican Nalci, Yeqing Wu, Yixin Du, Guoxin Jin, Alexandros Tourapis, Jun Xin, Hsi-Jung Wu
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Patent number: 12253756Abstract: An electronic device including a first light emitting unit, a second light emitting unit, a first optical layer and a second optical layer is disclosed. The first light emitting unit emits a first light. The second light emitting unit emits a second light. At least one of the first light and the second light passes through the first optical layer. The second optical layer is overlapped with the first optical layer. The second optical layer is configured to scatter the first light emitted from the first light emitting unit. When the first light emitting unit emits the first light, the second light emitting unit selectively emits the second light.Type: GrantFiled: January 31, 2024Date of Patent: March 18, 2025Assignee: InnoLux CorporationInventors: Kuei-Sheng Chang, Kuo-Jung Wu, Po-Yang Chen, I-An Yao
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Publication number: 20250087498Abstract: Tin oxide films are used as mandrels in semiconductor device manufacturing. In one implementation the process starts by patterning a tin oxide layer using at least one of a hydrogen-based etch chemistry and a chlorine-based etch chemistry, and using patterned photoresist as a mask, thereby providing a substrate having a plurality of protruding tin oxide features (mandrels). Next, a conformal layer of spacer material is formed both on the horizontal surfaces and on the sidewalls of the mandrels. The spacer material is then removed from the horizontal surfaces exposing the tin oxide material of the mandrels, without fully removing the spacer material residing at the sidewalls of the mandrels. Next, mandrels are selectively removed (e.g., using hydrogen-based etch chemistry), while leaving the spacer material that resided at the sidewalls of the mandrels. The resulting spacers can be used for patterning underlying layers on the substrate.Type: ApplicationFiled: November 22, 2024Publication date: March 13, 2025Inventors: Jengyi Yu, Samantha S.H. Tan, Seongjun Heo, Boris Volosskiy, Sivananda Krishnan Kanakasabapathy, Richard Wise, Yang Pan, Hui-Jung Wu
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Patent number: 12249566Abstract: A method includes bonding a top die to a bottom die, depositing a first dielectric liner on the top die, and depositing a gap-fill layer on the first dielectric liner. The gap-fill layer has a first thermal conductivity value higher than a second thermal conductivity value of silicon oxide. The method further includes etching the gap-fill layer and the first dielectric liner to form a through-opening, wherein a metal pad in the bottom die is exposed to the through-opening, depositing a second dielectric liner lining the through-opening, filling the through-opening with a conductive material to form a through-via connecting to the metal pad, and forming a redistribution structure over and electrically connecting to the top die and the through-via.Type: GrantFiled: November 21, 2023Date of Patent: March 11, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ping-Jung Wu, Ken-Yu Chang, Hao-Wen Ko, Tsang-Jiuh Wu
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Publication number: 20250080759Abstract: Techniques are disclosed for coding video in applications where regions of video are inactive on a frame to frame basis. According to the techniques, coding processes update and reconstruct only a subset of pixel blocks of pixels within a frame, while other pixel blocks are retained from a previously coded frame stored in a coder's or decoder's reference frame buffer. The technique is called Backward Reference Updating (or “BRU”) for convenience. At a desired pixel block granularity, based on the activity between a current frame to be coded and its reference frame(s), BRU will only perform prediction, transform, quantization, and reconstruction on selected regions that are determined to be active. The reconstructed pixels in these active regions are directly placed onto a specified reference frame in memory instead of creating a new frame. Therefore, fewer memory transfers need to be performed.Type: ApplicationFiled: August 5, 2024Publication date: March 6, 2025Inventors: Guoxin JIN, Yeqing WU, Yunfei ZHENG, Dazhong ZHANG, Dzung T. HOANG, Felix C. FERNANDES, Van Luong PHAM, Jiancong LUO, Yixin DU, Hilmi Enes EGILMEZ, Alican NALCI, Jun XIN, Hsi-Jung WU
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Publication number: 20250080726Abstract: Systems and methods are configured for accessing data representing video content, the data comprising a set of one or more symbols each associated with a syntax element; performing a probability estimation, for encoding the data, comprising: for each symbol, obtaining, based on the syntax element for that symbol, an adaptivity rate parameter value, the adaptivity rate parameter value being a function of a number of symbols in the set of one or more symbols; updating the adaptivity rate parameter value as a function of an adjustment parameter value; and generating, based on the updated adaptivity rate parameter value, a probability value; generating a probability estimation; and encoding, based on the CDF of the probability estimation, the data comprising the set of one or more symbols for transmission.Type: ApplicationFiled: August 29, 2024Publication date: March 6, 2025Inventors: Hilmi Enes Egilmez, Alexandros Tourapis, Alican Nalci, Guoxin Jin, Hsi-Jung Wu, Jun Xin, Yeqing Wu, Yixin Du, Yunfei Zheng
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Publication number: 20250076763Abstract: A photosensitive resin laminate and application thereof are provided. The photosensitive resin laminate consists of two or more photosensitive resin layers and includes a second component, wherein: when the photosensitive resin laminate is characterized by gas chromatography with added toluene as an internal standard, an elution peak of the second component is at a retention time ranging from 0.55 min to 1.30 min, an elution peak of the added toluene is at a retention time ranging from 1.32 min to 1.65 min, and the following formula is satisfied: Area ? of ? the ? elution ? peak of ? the ? second ? component Area ? of ? the ? elution ? peak of ? the ? added ? toluene × Amount ? of ? the added ? toluene Mass ? of ? the ? photosensitive ? resin ? laminate × 100 ? % = 0.1 % - 7.Type: ApplicationFiled: February 28, 2024Publication date: March 6, 2025Inventors: ZIH-I CHUANG, YUN-JUNG WU, E-MING HO
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Publication number: 20250070007Abstract: A method includes bonding a top die to a bottom die, depositing a first dielectric liner on the top die, and depositing a gap-fill layer on the first dielectric liner. The gap-fill layer has a first thermal conductivity value higher than a second thermal conductivity value of silicon oxide. The method further includes etching the gap-fill layer and the first dielectric liner to form a through-opening, wherein a metal pad in the bottom die is exposed to the through-opening, depositing a second dielectric liner lining the through-opening, filling the through-opening with a conductive material to form a through-via connecting to the metal pad, and forming a redistribution structure over and electrically connecting to the top die and the through-via.Type: ApplicationFiled: November 21, 2023Publication date: February 27, 2025Inventors: Ping-Jung Wu, Ken-Yu Chang, Hao-Wen Ko, Tsang-Jiuh Wu
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Publication number: 20250071345Abstract: Disclosed is a method that includes receiving an image frame having a plurality of coded blocks, determining a prediction unit (PU) from the plurality of coded blocks, determining one or more motion compensation units arranged in an array within the PU, and applying a filter to one or more boundaries of the one or more motion compensation units. Also disclosed is a method that includes receiving a reference frame that includes a reference block, determining a timing for deblocking a current block, performing motion compensation on the reference frame to obtain a predicted frame that includes a predicted block, performing reconstruction on the predicted frame to obtain a reconstructed frame that includes a reconstructed PU, and applying, at the timing for deblocking the current block, a deblocking filter based on one or more parameters to the reference block, the predicted block, or the reconstructed PU.Type: ApplicationFiled: November 12, 2024Publication date: February 27, 2025Inventors: Yixin Du, Alexandros Tourapis, Alican Nalci, Guoxin Jin, Hilmi Enes Egilmez, Hsi-Jung Wu, Jun Xin, Yeqing Wu, Yunfei Zheng
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Publication number: 20250070010Abstract: A method includes bonding a top die to a bottom die, depositing a first dielectric liner on the top die, and depositing a gap-fill layer on the first dielectric liner. The gap-fill layer has a first thermal conductivity value higher than a second thermal conductivity value of silicon oxide. The method further includes etching the gap-fill layer and the first dielectric liner to form a through-opening, wherein a metal pad in the bottom die is exposed to the through-opening, depositing a second dielectric liner lining the through-opening, filling the through-opening with a conductive material to form a through-via connecting to the metal pad, and forming a redistribution structure over and electrically connecting to the top die and the through-via.Type: ApplicationFiled: July 25, 2024Publication date: February 27, 2025Inventors: Ping-Jung Wu, Ken-Yu Chang, Hao-Wen Ko, Tsang-Jiuh Wu
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Publication number: 20250070085Abstract: A method includes: forming first bond pads along a wafer; bonding a first die to a first set of the first bond pads, the first die being electrically connected to the wafer; depositing a gap-fill dielectric over the wafer and around the first die; forming openings in the gap-fill dielectric; forming first active through vias in physical contact with the second set of the first bond pads and first dummy through vias in physical contact with the third set of the first bond pads, the first active through vias being electrically connected to the wafer, the first dummy through vias being electrically isolated from the wafer; forming second bond pads along the first die, the first active through vias, and the first dummy through vias; and bonding a second die to the first die and to a first active via of the first active through vias.Type: ApplicationFiled: January 2, 2024Publication date: February 27, 2025Inventors: Tsang-Jiuh Wu, Shih-Che Lin, Cheng-Chun Tsai, Ping-Jung Wu, Hao-Wen Ko
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Patent number: 12233177Abstract: A method of externally sterilizing a drug delivery device utilizing Nitrogen Dioxide (NO2) is provided, including placing the drug delivery device in a sterilization chamber, introducing into the chamber a dose of NO2 having a concentration of between about 2 and 20 milligrams per Liter by applying a vacuum level of between about 10 and 600 Torr and holding the vacuum level for a dwell time of between about 2 and 20 minutes, repeating the step of introducing into the chamber a dose of NO2 for a number of pulses between about 1 and 24, purging the sterilization chamber of at least substantially all of the NO2, and aerating the sterilization chamber.Type: GrantFiled: September 16, 2020Date of Patent: February 25, 2025Assignee: AMGEN INC.Inventors: Wael Mismar, Jessica Hai Liu, Chia-Jung Wu, Shermeen A. Abbas, Shaun Devitt, Kenneth G. Schalhoub, Anthony Bitong, Mads Schjoth Due, Malak Guirguis, Rami Saifan
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Publication number: 20250054798Abstract: Disclosed are a bonding system and a bonding method. In one embodiment, the bonding system includes a chamber, first and second electrostatic chucks, a visible light sensor module and a nonvisible light module. The chamber is configured to provide a vacuum state. The first electrostatic chuck is configured to hold a first substrate having a first alignment mark in the chamber, wherein the first electrostatic chuck has a first window. The second electrostatic chuck is configured to hold a second substrate having a second alignment mark in the chamber, wherein the second electrostatic chuck has a second window. The visible light sensor module is configured to capture images of the first and the second alignment marks. The nonvisible light module is configured to capture a combined image of the first and second alignment marks via the first and second windows overlapping each other in the vacuum state.Type: ApplicationFiled: August 8, 2023Publication date: February 13, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Ling Hwang, Chung-Jung Wu, Tung Li Wu, Wei-Chih Chen, Hsu-Chin Tseng, Jeng-Nan Hung
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Patent number: 12192440Abstract: Systems and methods disclosed for video compression, utilizing neural networks for predictive video coding. Processes employed combine multiple banks of neural networks with codec system components to carry out the coding and decoding of video data.Type: GrantFiled: January 4, 2022Date of Patent: January 7, 2025Assignee: APPLE INC.Inventors: Jiefu Zhai, Xingyu Zhang, Xiaosong Zhou, Jun Xin, Hsi-Jung Wu, Yeping Su
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Patent number: 12183589Abstract: Tin oxide films are used as mandrels in semiconductor device manufacturing. In one implementation the process starts by patterning a tin oxide layer using at least one of a hydrogen-based etch chemistry and a chlorine-based etch chemistry, and using patterned photoresist as a mask, thereby providing a substrate having a plurality of protruding tin oxide features (mandrels). Next, a conformal layer of spacer material is formed both on the horizontal surfaces and on the sidewalls of the mandrels. The spacer material is then removed from the horizontal surfaces exposing the tin oxide material of the mandrels, without fully removing the spacer material residing at the sidewalls of the mandrels. Next, mandrels are selectively removed (e.g., using hydrogen-based etch chemistry), while leaving the spacer material that resided at the sidewalls of the mandrels. The resulting spacers can be used for patterning underlying layers on the substrate.Type: GrantFiled: May 13, 2021Date of Patent: December 31, 2024Assignee: Lam Research CorporationInventors: Jengyi Yu, Samantha S. H. Tan, Seongjun Heo, Boris Volosskiy, Sivananda Krishnan Kanakasabapathy, Richard Wise, Yang Pan, Hui-Jung Wu
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Publication number: 20240420661Abstract: A protocol conversion circuit and a protocol conversion method are provided. The protocol conversion circuit includes a DisplayPort™ (DP) receiver, a control analysis circuit, a downstream transmitter and a frame buffer. The DP receiver analyzes a DP signal to obtain video data and packet information. The control analysis circuit determines whether the packet information indicates that a live function or a panel replay (PR) function is activated, and controls, in response to determining that the live function is activated, the frame buffer to store received current video data and transmits it to the downstream transmitter; and controls the frame buffer to discard the received current video data, or update previous video data stored in the frame buffer with a specified range in the current video data, and sends latest video data to the downstream transmitter, so as to output a target signal to the second electronic device.Type: ApplicationFiled: April 17, 2024Publication date: December 19, 2024Inventors: CHUN-CHIEH CHAN, HUNG-SHAO CHEN, TAI-JUNG WU, Wen-Hsia Kung
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Patent number: 12166300Abstract: An electrical connector for mounting on an external circuit board includes: an insulating body having an upper receiving space and a lower receiving space; a terminal module assembled on the insulating body and including plural pin terminals, each pin terminal having a pin for mounting on the external circuit board, wherein the terminal module is capable of being modified to support 1G or 2.5G or 5G or 10G or 25G or 40G signal transmission while keeping arrangement pattern of the pins unchanged in order to be mounted on the same external circuit board.Type: GrantFiled: March 25, 2022Date of Patent: December 10, 2024Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITEDInventors: Sheng-Pin Gao, Yong-Chun Xu, Hung-Chi Yu, Chih-Ching Hsu, Jie Zhang, Chin-Jung Wu