Abstract: The present invention is to provide a kind of multilayer microstructure macrocapacitor, wherein on one side of an electrode substrate after it forms slots with an appropriate aspect ratio, sequentially forms a high dielectric layer and a conducting material layer to give a basic composition unit, laminates the conducting material layers of two groups of basic composition unit to form a monolayer microstructure macrocapacitor, and stacking laminates the plural groups of the monolayer microstructure macrocapacitor to obtain a multilayer microstructure macrocapacitor; on two sides of an electrode substrate it forms a basic composition unit of a microstructure macrocapacitor through the process described above, and laminates the plural groups of the monolayer microstructure macrocapacitor to obtain a multilayer microstructure macrocapacitor.

Abstract: The invention discloses a micro-structure capacitor formed by joining the metal layer of a multi-porous micro-structure. A substrate is used as an etching stop layer when producing the capacitor. Therefore, pores with low aspect ratio and uniform size are formed on the surface of the substrate. The efficiency of the subsequent thin film coating process is increased. The porous three-dimensional structure increases the capacitance. Micro-structures are stacked up so the capacitor produced features small size and high capacitance.