Patents by Inventor Jung Yi

Jung Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180249460
    Abstract: Provided are a method for a terminal transmitting uplink control information (UCI) through a physical uplink control channel (PUCCH) in a wireless communication system, and a terminal using the method. A transmission power to be applied to the uplink control channel is determined on the basis of a value subordinate to a PUCCH format, and at least one type of UCI is transmitted from the physical uplink control channel by using the transmission power that is determined, wherein when the PUCCH format is PUCCH format 3, and the at least one type of UCI includes acknowledgement/negative-acknowledgement (ACK/NACK) and periodic channel state information (CSI), the value subordinate to the PUCCH format is determined on the basis of the number of bits of the ACK/NACK and the number of bits of the periodic CSI.
    Type: Application
    Filed: April 30, 2018
    Publication date: August 30, 2018
    Applicant: LG ELECTRONICS INC.
    Inventors: Dong Youn SEO, Joon Kui AHN, Yun Jung YI, Suck Chel YANG, Bong Hoe KIM
  • Patent number: 10058007
    Abstract: A water-cooling radiator unit and a water-cooling module using same are disclosed. The water-cooling radiator unit includes a main body divided into a first section, a second section and a transit zone, which are fluidly communicable with one another. The first section has a first flow passage system and an inlet formed thereon, the second section has a second flow passage system and an outlet formed thereon. The main body is internally filled with a cooling fluid, and the transit zone has a pump mounted therein. The water-cooling radiator unit can be fluidly connected to a water block via two tubes to form a water-cooling module. The pump drives the cooling fluid to circulate in the main body and between the water-cooling radiator unit and the water block, enabling the water-cooling module to provide upgraded heat-dissipation performance while the water block has a reduced volume.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: August 21, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Patent number: 10041468
    Abstract: A low-head and high flow water turbine machine comprises a water-guiding base having a top plate, a bottom plate, an accommodating space defined therein, an inlet and an outlet respectively arranged at upstream side and downstream side, and a first and a second lateral plates respectively having a first and a second water-guiding walls that are respectively extending inward toward circumference of the accommodating space, a water turbine arranged in the accommodating space and having multiple blades, and a cylindrical-shaped gate shell passing through the top plate and slidably coupled to circumference of water turbine around upstream side wherein an opening degree is adjusted through sliding the gate shell for adjusting cross-sectional area of stream thereby controlling stream discharge entering to the water turbine, switching off rotation of the water turbine, and adjusting water level at high water level state at upstream side according to the stream discharge requirement.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: August 7, 2018
    Inventor: Jung-Yi Lai
  • Publication number: 20180213678
    Abstract: A water cooling heat dissipation structure includes a first and a second plate, a water cooling heat dissipation body, which is composed of a plurality of stacked heat dissipation members. The first plate, the heat dissipation members, and the second plate are in sequence stacked up into one and another to integrally form the water cooling heat dissipation structure by heat treatment. The water cooling heat dissipation body has a top side attached to one side of the first plate and a bottom side thereof attached to the second plate, so as to secure two sides of a flow passage of the water cooling heat dissipation body. A first and a second connecting portion is respectively provided on two sides of the first plate or the water cooling heat dissipation body, and the first and the second connecting portion is communicable with the flow passage.
    Type: Application
    Filed: March 20, 2018
    Publication date: July 26, 2018
    Inventors: Jung-Yi CHIU, Fu-Kuei CHANG
  • Patent number: 10033499
    Abstract: A method for uplink transmission in a wireless communication system. A user equipment (UE) determines whether to transmit or drop a sounding reference signal (SRS) on a last symbol in a ith subframe. The SRS is dropped if multiple timing advance groups (TAGs) are configured, if a portion of the last symbol of the ith subframe for transmitting the SRS toward a first serving cell in a first TAG is overlapped with an (i+1)th subframe for transmitting an uplink channel toward a second serving cell in a second TAG and if a total power of the SRS and the uplink channel exceeds a maximum value on the overlapped portion of the last symbol.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: July 24, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Joon Kui Ahn, Suck Chel Yang, Yun Jung Yi, Dong Youn Seo
  • Patent number: 10004156
    Abstract: A heat radiation fin structure includes a main body, composed of a plurality of stacked laminations, and each the lamination has at least one heat dissipation section and at least one heat absorption section. The heat dissipation section is composed of a plurality of extended portions, which are outwardly extended from the heat absorption section. Two adjacent laminations are crossly stacked or arranged, such that a plurality of passages are formed in the extended portions, and the heat dissipation section is connected to the heat absorption section. With these arrangements, the heat radiation fin structure can generate a vortex flow when a cooling air flow is blown through the heat radiation fins and further to achieve greatly improved heat dissipation efficiency.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: June 19, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Patent number: 10004159
    Abstract: A water-cooling radiator unit and a device thereof. The water-cooling radiator unit includes a main body, a working fluid, a first plate body, a second plate body and a pump. The main body is composed of a first sheet body, a second sheet body and a third sheet body stacked on and assembled with each other to form a flow way set, a conversion sink, a first sink and a second sink. The conversion sink and a partitioning section together divide the main body into a first portion and a second portion. A first flow guide passage and a second flow guide passage are formed on outer side of the conversion sink. The wall faces of the first flow guide passage and the conversion sink of the second portion and the second flow guide passage are respectively formed with multiple first, second and third orifices.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: June 19, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Publication number: 20180167934
    Abstract: Provided are a method and an apparatus for transmitting uplink control information performed by a user equipment in a wireless communication system. The method comprises the steps of: receiving a first parameter for indicating whether to simultaneously transmit a first combination of an acknowledgement/negative-acknowledgement (ACK/NACK) and a channel quality indicator (CQI), and a second parameter for indicating whether to multiplex a second combination of an ACK/NACK and the CQI and transmitting same as a second physical uplink control channel (PUCCH) format; and multiplexing the first combination of the ACK/NACK or the second combination of ACK/NACK with the CQI and transmitting same as a first PUCCH format or the second PUCCH format, based on the first parameter and the second parameter.
    Type: Application
    Filed: January 25, 2018
    Publication date: June 14, 2018
    Applicant: LG ELECTRONICS INC.
    Inventors: Dong Youn SEO, Joon Kui AHN, Suck Chel YANG, Yun Jung YI
  • Patent number: 9999035
    Abstract: Provided are a method for a terminal transmitting uplink control information (UCI) through a physical uplink control channel (PUCCH) in a wireless communication system, and a terminal using the method. A transmission power to be applied to the uplink control channel is determined on the basis of a value subordinate to a PUCCH format, and at least one type of UCI is transmitted from the physical uplink control channel by using the transmission power that is determined, wherein when the PUCCH format is PUCCH format 3, and the at least one type of UCI includes acknowledgement/negative-acknowledgement(ACK/NACK) and periodic channel state information (CSI), the value subordinate to the PUCCH format is determined on the basis of the number of bits of the ACK/NACK and the number of bits of the periodic CSI.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: June 12, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Dong Youn Seo, Joon Kui Ahn, Yun Jung Yi, Suck Chel Yang, Bong Hoe Kim
  • Patent number: 9987259
    Abstract: A pyridone derivative compound and a pharmaceutically acceptable salt, isomer, solvate or hydrate thereof, and a preventive or therapeutic pharmaceutical composition for cognitive disorders that includes the pyridone derivative compound or a pharmaceutically acceptable salt, isomer, solvate or hydrate thereof.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: June 5, 2018
    Assignee: SK BIOPHARMACEUTICALS CO., LTD.
    Inventors: Cheol Young Maeng, Young Koo Jang, Su Bong Cha, Hye Won Shin, Chan Mi Joung, Eun Jung Yi
  • Patent number: 9991999
    Abstract: A method is provided for uplink transmission in a wireless communication system. A user equipment (UE) determines whether to transmit both a physical uplink shared channel (PUSCH) and a sounding reference signal (SRS), or drop the SRS and transmit only the PUSCH but dropping the SRS when the UE determines satisfaction of all of at least three conditions including: a first condition specifying that a plurality of timing advance groups (TAGs) including a first TAG and a second TAG are configured, a second condition specifying that at least one symbol of a subframe n which is used to transmit the SRS toward a first cell belonging to the first TAG is overlapped with a subframe n+1 on which the PUSCH is transmitted toward a second cell belonging to the second TAG and a third condition specifying that a total uplink transmission power exceeds a maximum value.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: June 5, 2018
    Assignee: LG Electronics Inc.
    Inventors: Joon Kui Ahn, Suck Chel Yang, Yun Jung Yi, Dong Youn Seo
  • Patent number: 9986661
    Abstract: A water cooling heat radiation device and module thereof includes a body structure, composed of a plurality of laminations, a top and a bottom sheet body, and a water pump. Each the lamination has a plurality of radial extended portions and a spiral raised portion. The laminations are stacked to form the body structure, such that the radial extended portions and the spiral raised portions form a plurality of radiation fins and a spiral flow passage, respectively. The spiral flow passage has a water inlet in a water inlet part, and a water outlet, respectively, provided on two ends thereof. The top and the bottom sheet body correspondingly secure a top and a bottom side of the spiral flow passage of the body structure. The water pump is located in the water inlet part, and forms a water cooling heat radiation module with a first and a second pipe.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: May 29, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Publication number: 20180130822
    Abstract: A process for fabricating a 3D memory is shown. Linear stacks, each of which includes alternately stacked gate lines and insulating layers, are formed. A charge trapping layer is formed covering the linear stacks. An amorphous semiconductor layer is formed on the charge trapping layer. An ultra-thin cap layer is formed on the amorphous semiconductor layer. The amorphous semiconductor layer is annealed to form a crystalline channel layer, wherein agglomeration of the material of the amorphous semiconductor layer is suppressed by then ultra-thin cap layer.
    Type: Application
    Filed: January 5, 2018
    Publication date: May 10, 2018
    Applicant: MACRONIX International Co., Ltd.
    Inventors: Jung-Yi Guo, Chun-Min Cheng
  • Publication number: 20180092248
    Abstract: A water-cooling radiator structure includes at least one first and at least one second sealing element and a first water-cooling radiator main body formed by a plurality of stacked first radiator elements. The second sealing element, the first radiator elements and the first sealing element are sequentially stacked and then integrally connected together through heat treating. The first and the second sealing element have one side connected to an upper and a lower side, respectively, of the first water-cooling radiator main body to seal a top and a bottom, respectively, of at least one first flow passage defined on the first water-cooling radiator main body. At least one first and second coupling section are optionally provided on the first sealing element or at two opposite ends of the first flow passage; and the first and the second coupling section are fluidly communicable with the first flow passage.
    Type: Application
    Filed: September 26, 2016
    Publication date: March 29, 2018
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Publication number: 20180092249
    Abstract: A water-cooling radiator unit and a water-cooling module using same are disclosed. The water-cooling radiator unit includes a main body divided into a first section, a second section and a transit zone, which are fluidly communicable with one another. The first section has a first flow passage system and an inlet formed thereon, the second section has a second flow passage system and an outlet formed thereon. The main body is internally filled with a cooling fluid, and the transit zone has a pump mounted therein. The water-cooling radiator unit can be fluidly connected to a water block via two tubes to form a water-cooling module. The pump drives the cooling fluid to circulate in the main body and between the water-cooling radiator unit and the water block, enabling the water-cooling module to provide upgraded heat-dissipation performance while the water block has a reduced volume.
    Type: Application
    Filed: September 26, 2016
    Publication date: March 29, 2018
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Publication number: 20180092245
    Abstract: A water cooling heat radiation device and module thereof includes a body structure, composed of a plurality of laminations, a top and a bottom sheet body, and a water pump. Each the lamination has a plurality of radial extended portions and a spiral raised portion. The laminations are stacked to form the body structure, such that the radial extended portions and the spiral raised portions form a plurality of radiation fins and a spiral flow passage, respectively. The spiral flow passage has a water inlet in a water inlet part, and a water outlet, respectively, provided on two ends thereof. The top and the bottom sheet body correspondingly secure a top and a bottom side of the spiral flow passage of the body structure. The water pump is located in the water inlet part, and forms a water cooling heat radiation module with a first and a second pipe.
    Type: Application
    Filed: September 26, 2016
    Publication date: March 29, 2018
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Publication number: 20180092244
    Abstract: A water cooling heat dissipation structure includes a first and a second plate, a water cooling heat dissipation body, which is composed of a plurality of stacked heat dissipation members. The first plate, the heat dissipation members, and the second plate are in sequence stacked up into one and another to integrally form the water cooling heat dissipation structure by heat treatment. The water cooling heat dissipation body has a top side attached to one side of the first plate and a bottom side thereof attached to the second plate, so as to secure two sides of a flow passage of the water cooling heat dissipation body. A first and a second connecting portion is respectively provided on two sides of the first plate or the water cooling heat dissipation body, and the first and the second connecting portion is communicable with the flow passage.
    Type: Application
    Filed: September 26, 2016
    Publication date: March 29, 2018
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Publication number: 20180092246
    Abstract: A water-cooling radiator assembly includes at least one first and one second sealing element and a water-cooling radiator main body formed of a plurality of stacked radiator elements. The second sealing element, the radiator elements and the first sealing element are sequentially stacked from bottom to top and integrally connected through heat treating to form the water-cooling radiator assembly. The first and second sealing elements have one side connected to an upper and a lower side, respectively, of the water-cooling radiator main body to seal a top and a bottom of a helical flow passage in the water-cooling radiator main body. A first and a second coupling section are optionally provided on the first and the second sealing element, respectively, or at a first and a second end of the helical flow passage, respectively; and the first and second coupling sections are fluidly communicable with the helical flow passage.
    Type: Application
    Filed: September 26, 2016
    Publication date: March 29, 2018
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Publication number: 20180092247
    Abstract: A water-cooling radiator unit and a device thereof. The water-cooling radiator unit includes a main body, a working fluid, a first plate body, a second plate body and a pump. The main body is composed of a first sheet body, a second sheet body and a third sheet body stacked on and assembled with each other to form a flow way set, a conversion sink, a first sink and a second sink. The conversion sink and a partitioning section together divide the main body into a first portion and a second portion. A first flow guide passage and a second flow guide passage are formed on outer side of the conversion sink. The wall faces of the first flow guide passage and the conversion sink of the second portion and the second flow guide passage are respectively formed with multiple first, second and third orifices.
    Type: Application
    Filed: September 26, 2016
    Publication date: March 29, 2018
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Publication number: 20180092242
    Abstract: A heat radiation fin structure includes a main body, composed of a plurality of stacked laminations, and each the lamination has at least one heat dissipation section and at least one heat absorption section. The heat dissipation section is composed of a plurality of extended portions, which are outwardly extended from the heat absorption section. Two adjacent laminations are crossly stacked or arranged, such that a plurality of passages are formed in the extended portions, and the heat dissipation section is connected to the heat absorption section. With these arrangements, the heat radiation fin structure can generate a vortex flow when a cooling air flow is blown through the heat radiation fins and further to achieve greatly improved heat dissipation efficiency.
    Type: Application
    Filed: September 26, 2016
    Publication date: March 29, 2018
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang