Abstract: A glenoid baseplate and, more specifically, to a glenoid baseplate of an artificial shoulder joint, includes: a base which is mounted on the glenoid fossa of the scapula and has a first surface; an augment disposed on the first surface; and a stem extended from the first surface while having a center axis, wherein one surface of the augment forms a contact surface with the first surface, at least a portion of the contact surface forms a predetermined angle, that is not a right angle, with respect to the center axis of the stem, and the augment includes a first wedge having a second surface extended from a first boundary and a second wedge having a third surface bent and extended from the second surface, and thus the present invention compensates for bone defects, minimizes bone cutting, and has a simple shape so as to facilitate manufacturing.

Abstract: The present disclosure relates to an animal knee joint implant that reflects an anatomical structure of an animal. More particularly, the present disclosure relates to an animal knee joint implant that reflects the anatomical structure of an animal, wherein the knee joint implant is capable of being used for diseases, which are accompanied by bone loss, damage to surrounding muscles, ligaments, and the like and are thus more complex than general knee joint diseases such as rheumatoid arthritis and degenerative arthritis, and wherein the animal knee joint implant is capable of reinforcing stability against varus and valgus as well as stability against flexion and extension, and capable of easily complementing gaps that may occur when the bones of a joint are cut.

Abstract: A glenoid baseplate and, more specifically, to a glenoid baseplate of an artificial shoulder joint, includes: a base seated on the glenoid cavity of the scapula; an augment formed on one surface of the base; and a stem extending from the base to one side while having a central axis, wherein the augment comprises a plate having a second surface extending from one end of the plate in one direction. The plate extends from one end of the base through the central axis to a point spaced apart by a first length from the central axis, and the wedge extends from one end of the plate in a first direction such that the thickness thereof gradually decreases. Accordingly, it is possible to minimize bone cutting and correct an insertion axis of the baseplate.

Abstract: An acetabular cup impactor includes: a body provided so as to apply force to an acetabular cup and having one end extending toward one side of the acetabular cup; an impactor having a coupling part formed around an axis extending from one side of the body; an alignment guide indicating an impacting direction; and an anteversion guide having a coupling mechanism coupled to the impactor at one end which extends a predetermined distance from the alignment guide, wherein the coupling mechanism of the anteversion guide is provided so as to be detachably coupled to the coupling part of the impactor, and the direction of the force applied by the coupling mechanism to the coupling portion is perpendicular to the extension direction of the impactor while a recess formed on the surface of the coupling part and the surface of the coupling part are gripped in various directions during coupling of the coupling mechanism.

Abstract: A femoral stem design method includes: a data collection step of collecting femur data from a plurality of patients; a measurement standard setting step of setting a standard for designing a femoral stem with respect to the femur data of the plurality of patients; a measurement step of measuring a predetermined part of a femur from the plurality of femur data; a dimension determination step of determining dimensions of each part of a plurality of implants to be inserted into the femur; and a shape determination step of determining shapes of the plurality of implants according to the dimensions of the plurality of implants, wherein the measurement standard setting step includes a boundary setting step of setting a boundary that distinguishes cortical bone and cancellous bone from the femur data of the plurality of patients, and an axis setting step of setting an axis extending from the proximal part to the distal part of the femur.

Abstract: Proposed is an augment implant to which different types of porous structures are applied and, more specifically, an augment implant to which different types of porous structures are applied in which a porous structure of an irregular shape is formed on the outer side of the augment implant and a porous structure of a regular shape is formed on the inner side of the augment implant, thereby ensuring an initial fixing power by means of a rough surface, inducing bone ingrowth to provide a long-term biological fixing power, making the augment implant lightweight, enabling a structure thereof to be shaped with a remarkably low amount of data, reinforcing the strength of a body part having a porous structure through a frame part having a nonporous structure, and facilitating the discharge of remaining inner powder through a powder hole.

Abstract: Proposed is a modular augment, and, more specifically, a modular augment in which an additional unit is separably coupled to a center unit so as to selectively couple the additional unit to the center unit according to the degree of a patient's bone loss so that the degree of bone reinforcement can be easily adjusted, and thus a manufacturer is capable of covering various types of patients even though the types of units are minimized, thereby reducing manufacturing costs, the number of products to be prepared for surgery by a user such as a hospital is remarkably reduced, thereby preventing the unnecessary costs and facilitating inventory management, and a patient can receive an optimal augment that is appropriate for the patient' condition.

Abstract: Proposed is an augment implant and, more specifically, is an augment implant, in which a body part of the porous structure is combined with a frame part of a non-porous structure to increase the mechanical strength of the body part and to prevent damage to the body part due to external forces, bone ingrowth is maximized by minimizing the area of the frame part, the augment implant can be inserted in various directions, not just in a specific direction, and when the augment implant is manufactured by 3D printing, a support is connected to the frame part so that in a process of removing the support, the support can be easily removed without damage to the porous structure.

Abstract: The present disclosure relates to an animal knee joint implant that reflects an anatomical structure of an animal. More particularly, the present disclosure relates to an animal knee joint implant that reflects the anatomical structure of an animal, wherein the knee joint implant is capable of being used for diseases, which are accompanied by bone loss, damage to surrounding muscles, ligaments, and the like and are thus more complex than general knee joint diseases such as rheumatoid arthritis and degenerative arthritis, and wherein the animal knee joint implant is capable of reinforcing stability against varus and valgus as well as stability against flexion and extension, and capable of easily complementing gaps that may occur when the bones of a joint are cut.

Abstract: A patient-customized surgical instrument used to form a surgical site in a tibia for implantation of an implant into the tibia, and a surgical module using the same. A body part is coupled to the tibia to surround a portion of the tibia. A cutting-member insertion window is formed through a side of the body part to receive a cutting member that is inserted to form a cutting plane of the tibia. A position setting hole is formed through the upper side of the body part to receive and guide a post recess forming member that is used to form a post recess in the tibia. A post of the tibia element is received in the post recess. A surgical site can be accurately and easily formed in a damaged tibia.

Abstract: A semiconductor light emitting device includes: a package body having a cavity, and having a first wiring electrode and a second wiring electrode disposed on a bottom surface of the cavity; a light emitting diode (LED) chip having a first surface with a first electrode and a second electrode thereon, a second surface, and lateral surfaces, the LED chip being mounted in the cavity such that the first surface faces the bottom surface, a wavelength conversion film on the second surface of the LED chip, and including a first wavelength conversion material, and a reflective resin portion in the cavity that surrounds the LED chip.

Abstract: A semiconductor light-emitting device may include an emission structure, a protection pattern layer on a limited region of the emission structure, and an insulating pattern layer on the emission structure. The protection pattern layer may expose a separate remaining region of the emission structure, and the first insulating pattern layer may cover at least the remaining region of the emission structure. The insulating layer may include an opening that exposes at least a portion of a surface of the protection pattern layer, such that the emission structure remains covered by at least one of the insulating layer and the protection pattern layer.

Abstract: A light emitting device package includes a package body having a mounting region including a mounting surface for a light emitting device, a groove portion, and a bottom surface lower than the mounting surface, and a lead frame supported by the package body, a portion of the lead frame being disposed on the bottom surface and a portion of the lead frame being exposed by the groove portion. The light emitting device has a first plane on which an electrode pad is disposed, a second plane opposite the first plane, and a third plane disposed between the first plane and the second plane to connect the first plane to the second plane. The light emitting device is to be disposed in the mounting region such that the first plane is in contact with the mounting surface and the electrode pad is in the groove portion.

Abstract: A semiconductor light emitting device includes: a package body having a cavity, and having a first wiring electrode and a second wiring electrode disposed on a bottom surface of the cavity; a light emitting diode (LED) chip having a first surface with a first electrode and a second electrode thereon, a second surface, and lateral surfaces, the LED chip being mounted in the cavity such that the first surface faces the bottom surface, a wavelength conversion film on the second surface of the LED chip, and including a first wavelength conversion material, and a reflective resin portion in the cavity that surrounds the LED chip.

Abstract: Disclosed herein is a method for manufacturing an implant that is to be surgically inserted in vivo, such as in an artificial knee or artificial hip. According to the method, the porous layer contains pores that have a vertically curved shape with a radius of 100 to 300 ?m, thus allowing a bond to grow into the pores to enhance bond adhesion, and an interconnection space is formed between turning points in adjacent unit base layers to increase the ratio of interconnection between pores, whereby bones are allowed to grow into the pores to increase bone adhesion.

Abstract: A semiconductor light-emitting device may include an emission structure, a protection pattern layer on a limited region of the emission structure, and an insulating pattern layer on the emission structure. The protection pattern layer may expose a separate remaining region of the emission structure, and the first insulating pattern layer may cover at least the remaining region of the emission structure. The insulating layer may include an opening that exposes at least a portion of a surface of the protection pattern layer, such that the emission structure remains covered by at least one of the insulating layer and the protection pattern layer.

Abstract: A light emitting device package includes a package body having a mounting region including a mounting surface for a light emitting device, a groove portion, and a bottom surface lower than the mounting surface, and a lead frame supported by the package body, a portion of the lead frame being disposed on the bottom surface and a portion of the lead frame being exposed by the groove portion. The light emitting device has a first plane on which an electrode pad is disposed, a second plane opposite the first plane, and a third plane disposed between the first plane and the second plane to connect the first plane to the second plane. The light emitting device is to be disposed in the mounting region such that the first plane is in contact with the mounting surface and the electrode pad is in the groove portion.

Abstract: A semiconductor light emitting device may include a substrate including: a first region having a first pattern; and a second region having a second pattern surrounding the first pattern, the second pattern being different from the first pattern; and a light emitting structure disposed on the first and second regions and including: a first conductive semiconductor layer; an active layer; and a second conductive semiconductor layer.

Abstract: A nanostructure semiconductor light-emitting device includes a base layer formed of a first conductivity-type semiconductor, a first material layer disposed on the base layer and including a plurality of openings, a plurality of light-emitting nanostructures, each of which extends through each of the plurality of openings and includes a nanocore formed of a first conductivity-type semiconductor, an active layer and a second conductivity-type semiconductor shell layer, sequentially disposed on the nanocore, a filling layer disposed on the first material layer, wherein the filling layer fills spaces between the plurality of light-emitting nanostructures and a portion of each of the plurality of light-emitting nanostructures is exposed by the filling layer, a second conductivity-type semiconductor extension layer disposed on the filling layer and covering the exposed portion of each of the plurality of light-emitting nanostructures, and a contact electrode layer disposed on the second conductivity-type semicondu