Abstract: The present invention relates to an integrated connector and a heat exchanger including the same, in which a connector main body is formed by pressing one pipe, a cap is press-fitted into the connector main body, such that the integrated connector is formed so that an interior of the connector main body is blocked by the cap. Therefore, the number of components used to manufacture a connector, which connects and securely couples a header tank and a gas-liquid separator, may be reduced, the integrated connector may be easily manufactured, and a brazing defect may be reduced at portions where the integrated connector is joined to the header tank and the gas-liquid separator of the heat exchanger.

Abstract: Methods of manufacturing a semiconductor chip are provided. The methods may include providing a semiconductor substrate including integrated circuit regions and a cut region. The cut region may be between the integrated circuit regions. The methods may also include forming a modified layer by emitting a laser beam into the semiconductor substrate along the cut region, polishing an inactive surface of the semiconductor substrate to propagate a crack from the modified layer, and separating the integrated circuit regions along the crack. The cut region may include a plurality of multilayer metal patterns on an active surface of the semiconductor substrate, which is opposite to the inactive surface of the semiconductor substrate. The plurality of multilayer metal patterns may form a pyramid structure when viewed in cross section.

Abstract: A display device is provided including a substrate. A second semiconductor layer is disposed on the substrate. The second semiconductor layer includes Si. A second gate lower electrode overlaps a channel region of the second semiconductor layer. A second gate insulating layer is disposed on the second gate lower electrode. A second gate upper electrode and a light blocking layer are disposed on the second gate insulating layer. A first auxiliary layer is disposed on the second gate upper electrode and the light blocking layer. A first semiconductor layer overlaps the light blocking layer. The first semiconductor layer includes an oxide semiconductor. A first gate electrode overlaps a channel region of the first semiconductor layer. The first auxiliary layer includes an insulating layer including at least one compound selected from SiNx, SiOx, and SiON, and at least one material selected from F, Cl, and C.

Abstract: Disclosed herein are an apparatus and method for updating an Internet-based malware detection engine using virtual machine scaling. The method may include creating a scaling group and an update group set based on a first virtual machine image, creating a second virtual machine image for a running virtual machine in response to occurrence of a snapshot event in the virtual update group run based on the first virtual machine image, modifying the scale-out image of the scaling group to the second virtual machine image, updating the scaling group by triggering a scale-out event and a scale-in event in the scaling group in response to occurrence of an update event, and modifying the scale-in image of the scaling group to the second virtual machine image.

Abstract: A seat for a vehicle, includes a second row center seat and a second row side seat provided on a partition wall positioned rearward of a driver seat, the second row center seat may move leftward or rightward, and an interval between the seats may be increased in a state in which the second row center seat is moved in a right direction away from the second row side seat, which makes it possible to maximally prevent body contact between a passenger in the second row center seat and a passenger in the second row side seat.

Abstract: A supporting device capable of being easily assembled and commonly supporting a washing machine, a dryer, and the like having different leg sizes and a laundry treating apparatus having the same. The laundry treating apparatus includes a laundry treating apparatus main body, a supporting device main body configured to support the laundry treating apparatus main body, a leg coupled to a bottom of the laundry treating apparatus main body, and a supporter installed in the supporting device main body, wherein the supporter includes a guide member configured to accommodate the leg and including an insertion groove, and a fixing member including a fixing protrusion to be inserted into the insertion groove, the fixing member being coupled to the guide member to fix the leg.

Abstract: A low-noise amplifier in a receiver supporting a beam forming function may selectively change a phase shift for beam steering. The low-noise amplifier may include first and second transistors and a variable capacitance circuit connected to a gate of the second transistor. The variable capacitance circuit may selectively change capacitance thereof based on a capacitance control signal applied thereto according to beam-forming information, where the changed capacitance correspondingly causes a phase change in an output signal of the low-noise amplifier. A similar scheme may be employed for amplifiers in transmit signal paths to steer a transmit beam.

Abstract: The present disclosure relates to a vehicle rear seat including: a center seat; and side seats located on the left and right of the center seat, wherein, the center seat is capable of protruding by moving the center seat forward with respect to the side seats, and in the state in which the center seat protrudes forward, it is possible to increase an inter-passenger distance so that physical contact between the passenger of the center seat and the passenger of each of the side seats can be prevented as much as possible.

Abstract: An optical sensor includes a substrate, a photoelectric element disposed on the substrate and that includes a first electrode, an intermediate layer disposed on the first electrode, and a second electrode disposed on the intermediate layer, a barrier layer disposed on the second electrode, an insulating layer that covers the photoelectric element and the barrier layer, and a bias electrode disposed on the insulating layer and electrically connected to the second electrode. The barrier layer is spaced apart from the first electrode.

Abstract: A method of manufacturing a laser irradiation device for oral treatment includes (a) molding a base frame having a tongue fixing frame part convexly formed upward so that the tongue is inserted into a lower space thereof and a teeth seating part concavely formed so that human teeth are seated therein, (b) assembling an LED strip with respect to the base frame, the LED strip having a plurality of laser diodes installed on a flexible circuit board to correspond to the shape of the base frame, (c) injecting a liquid light-transparent resin material into an upper light-transparent cover and a lower light-transparent cover respectively corresponding to the shapes of upper and lower parts of the base frame, and (d) respectively pressing the upper light-transparent cover and the lower light-transparent cover vertically upward and downward with respect to the base frame.

Abstract: Proposed is an augment implant to which different types of porous structures are applied and, more specifically, an augment implant to which different types of porous structures are applied in which a porous structure of an irregular shape is formed on the outer side of the augment implant and a porous structure of a regular shape is formed on the inner side of the augment implant, thereby ensuring an initial fixing power by means of a rough surface, inducing bone ingrowth to provide a long-term biological fixing power, making the augment implant lightweight, enabling a structure thereof to be shaped with a remarkably low amount of data, reinforcing the strength of a body part having a porous structure through a frame part having a nonporous structure, and facilitating the discharge of remaining inner powder through a powder hole.

Abstract: Proposed is a modular augment, and, more specifically, a modular augment in which an additional unit is separably coupled to a center unit so as to selectively couple the additional unit to the center unit according to the degree of a patient's bone loss so that the degree of bone reinforcement can be easily adjusted, and thus a manufacturer is capable of covering various types of patients even though the types of units are minimized, thereby reducing manufacturing costs, the number of products to be prepared for surgery by a user such as a hospital is remarkably reduced, thereby preventing the unnecessary costs and facilitating inventory management, and a patient can receive an optimal augment that is appropriate for the patient' condition.

Abstract: Proposed is an augment implant and, more specifically, is an augment implant, in which a body part of the porous structure is combined with a frame part of a non-porous structure to increase the mechanical strength of the body part and to prevent damage to the body part due to external forces, bone ingrowth is maximized by minimizing the area of the frame part, the augment implant can be inserted in various directions, not just in a specific direction, and when the augment implant is manufactured by 3D printing, a support is connected to the frame part so that in a process of removing the support, the support can be easily removed without damage to the porous structure.

Abstract: The present disclosure relates to an animal knee joint implant that reflects an anatomical structure of an animal. More particularly, the present disclosure relates to an animal knee joint implant that reflects the anatomical structure of an animal, wherein the knee joint implant is capable of being used for diseases, which are accompanied by bone loss, damage to surrounding muscles, ligaments, and the like and are thus more complex than general knee joint diseases such as rheumatoid arthritis and degenerative arthritis, and wherein the animal knee joint implant is capable of reinforcing stability against varus and valgus as well as stability against flexion and extension, and capable of easily complementing gaps that may occur when the bones of a joint are cut.

Abstract: A patient-customized surgical instrument used to form a surgical site in a tibia for implantation of an implant into the tibia, and a surgical module using the same. A body part is coupled to the tibia to surround a portion of the tibia. A cutting-member insertion window is formed through a side of the body part to receive a cutting member that is inserted to form a cutting plane of the tibia. A position setting hole is formed through the upper side of the body part to receive and guide a post recess forming member that is used to form a post recess in the tibia. A post of the tibia element is received in the post recess. A surgical site can be accurately and easily formed in a damaged tibia.

Abstract: A semiconductor light emitting device includes: a package body having a cavity, and having a first wiring electrode and a second wiring electrode disposed on a bottom surface of the cavity; a light emitting diode (LED) chip having a first surface with a first electrode and a second electrode thereon, a second surface, and lateral surfaces, the LED chip being mounted in the cavity such that the first surface faces the bottom surface, a wavelength conversion film on the second surface of the LED chip, and including a first wavelength conversion material, and a reflective resin portion in the cavity that surrounds the LED chip.

Abstract: A semiconductor light-emitting device may include an emission structure, a protection pattern layer on a limited region of the emission structure, and an insulating pattern layer on the emission structure. The protection pattern layer may expose a separate remaining region of the emission structure, and the first insulating pattern layer may cover at least the remaining region of the emission structure. The insulating layer may include an opening that exposes at least a portion of a surface of the protection pattern layer, such that the emission structure remains covered by at least one of the insulating layer and the protection pattern layer.

Abstract: A light emitting device package includes a package body having a mounting region including a mounting surface for a light emitting device, a groove portion, and a bottom surface lower than the mounting surface, and a lead frame supported by the package body, a portion of the lead frame being disposed on the bottom surface and a portion of the lead frame being exposed by the groove portion. The light emitting device has a first plane on which an electrode pad is disposed, a second plane opposite the first plane, and a third plane disposed between the first plane and the second plane to connect the first plane to the second plane. The light emitting device is to be disposed in the mounting region such that the first plane is in contact with the mounting surface and the electrode pad is in the groove portion.

Abstract: A semiconductor light emitting device includes: a package body having a cavity, and having a first wiring electrode and a second wiring electrode disposed on a bottom surface of the cavity; a light emitting diode (LED) chip having a first surface with a first electrode and a second electrode thereon, a second surface, and lateral surfaces, the LED chip being mounted in the cavity such that the first surface faces the bottom surface, a wavelength conversion film on the second surface of the LED chip, and including a first wavelength conversion material, and a reflective resin portion in the cavity that surrounds the LED chip.