Patents by Inventor Jung-Yoon Kim
Jung-Yoon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250235818Abstract: A device for carbon capture from a CO2 containing source includes a cathode compartment including a cathode electrode, an anode compartment including an anode electrode, a middle compartment which includes an ion conducting layer, a cation exchange membrane, and an anion exchange membrane. The middle compartment is separated from the cathode and anode by the anion and cation exchange membranes. A method for carbon capture from a CO2 containing source includes providing the device, supplying the CO2 containing source to the cathode, reacting the CO2 from the source with an electrochemically generated species from the cathode to form a carbon species or directly reducing the CO2 at the cathode to form the carbon species, driving the carbon species to the middle compartment, and reacting, in the middle compartment, the carbon species with an oxidation product from the anode to form an exit product comprising CO2.Type: ApplicationFiled: April 14, 2023Publication date: July 24, 2025Applicant: William Marsh Rice UniversityInventors: Haotian Wang, Jung Yoon Kim, Peng Zhu
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Patent number: 12247141Abstract: The present invention relates to a polishing slurry composition. A polishing slurry composition according to an embodiment of the present disclosure comprises: a nonionic polymer having at least one amide bond; a selectivity control agent; and abrasive particles.Type: GrantFiled: November 4, 2019Date of Patent: March 11, 2025Assignee: KCTECH CO., LTD.Inventors: Nak Hyun Choi, Jung Yoon Kim, Hae Won Yang, Soo Wan Choi
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Publication number: 20240382111Abstract: A computer program stored on a computer-readable storage medium may be provided.Type: ApplicationFiled: July 16, 2024Publication date: November 21, 2024Inventors: Jung Yoon KIM, Hyeon Seok YOU, Eun Kyung BAE
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Patent number: 12031062Abstract: The present disclosure relates to a polishing slurry composition for an STI process and, more specifically, to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a polymer having an amide bond, and a polysilicon film polishing barrier inclusive of a monomer having three or more chains linked to one or more atoms.Type: GrantFiled: July 11, 2019Date of Patent: July 9, 2024Assignee: KCTECH CO., LTD.Inventors: Jung Yoon Kim, Jun Ha Hwang, Kwang Soo Park, Hae Won Yang
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Publication number: 20230212429Abstract: Provided is a slurry composition for a metal film for a contact process. A polishing slurry composition includes abrasive particles, a compound including one or more functional groups capable of hydrogen bonding, a nonionic polymer including one or more hydrophilic functional groups in a repeating unit structure, and an oxidizer.Type: ApplicationFiled: December 25, 2022Publication date: July 6, 2023Applicant: KCTECH CO., LTD.Inventors: Jung Yoon KIM, In Seol HWANG, Hyun Goo KONG
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Patent number: 11392674Abstract: An electronic device is disclosed. The electronic device may include a memory, and a processor electrically connected with the memory. The processor may be configured to install an application, allocate identification information, which is included in a preset range, to the installed application, store, at a first address of the memory, the identification information for indicating access privilege to a system resource, monitor the first address during running of a first process of the application, and terminate the first process, when the identification information stored at the first address is not included in the preset range. Moreover, various embodiment found through the disclosure are possible.Type: GrantFiled: December 29, 2017Date of Patent: July 19, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Jin Mo Yang, Jung Yoon Kim, Hee Kwan Lee
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Patent number: 11384255Abstract: The present invention relates to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a nitride film polishing barrier inclusive of a polymer having an amide bond.Type: GrantFiled: November 13, 2018Date of Patent: July 12, 2022Assignee: KCTECH CO., LTD.Inventors: Hae Won Yang, Jun Ha Hwang, Jung Yoon Kim, Kwang Soo Park
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Publication number: 20220177727Abstract: The present disclosure relates to a polishing slurry composition for an STI process and, more specifically, to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a polymer having an amide bond, and a polysilicon film polishing barrier inclusive of a monomer having three or more chains linked to one or more atoms.Type: ApplicationFiled: July 11, 2019Publication date: June 9, 2022Applicant: KCTECH CO., LTD.Inventors: Jung Yoon KIM, Jun Ha HWANG, Kwang Soo PARK, Hae Won YANG
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Patent number: 11332641Abstract: A polishing slurry composition enabling implementation of multi-selectivity is provided. The polishing slurry composition includes: a polishing liquid including abrasive particles; and an additive liquid, in which the additive liquid includes a polymer having an amide bond, and a cationic polymer.Type: GrantFiled: December 16, 2020Date of Patent: May 17, 2022Assignee: KCTECH CO., LTD.Inventors: Gi Joo Shin, Jung Yoon Kim, Kwang Soo Park, Soo Wan Choi
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Publication number: 20220064489Abstract: The present invention relates to a polishing slurry composition. A polishing slurry composition according to an embodiment of the present disclosure comprises a polishing solution containing polishing particles; and an additive solution containing a non-ionic polymer and a polishing selectivity controller. The polishing slurry composition of the present disclosure has a high polishing rate for silicon oxide films and polysilicon films, leaves no residues after shallow trench isolation (STI) polishing of semiconductor devices, and can reduce the amount of silicon oxide film dishing and decrease scratches.Type: ApplicationFiled: July 3, 2019Publication date: March 3, 2022Applicant: KCTECH CO., LTD.Inventors: Soo Wan CHOI, Jung Yoon KIM, Nak Hyun CHOI, Hae Won YANG
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Publication number: 20220064488Abstract: The present invention relates to a polishing slurry composition. A polishing slurry composition according to an embodiment of the present disclosure comprises: a nonionic polymer having at least one amide bond; a selectivity control agent; and abrasive particles.Type: ApplicationFiled: November 4, 2019Publication date: March 3, 2022Applicant: KCTECH CO., LTD.Inventors: Nak Hyun CHOI, Jung Yoon KIM, Hae Won YANG, Soo Wan CHOI
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Publication number: 20210189178Abstract: A polishing slurry composition enabling implementation of multi-selectivity is provided. The polishing slurry composition includes: a polishing liquid including abrasive particles; and an additive liquid, in which the additive liquid includes a polymer having an amide bond, and a cationic polymer.Type: ApplicationFiled: December 16, 2020Publication date: June 24, 2021Applicant: KCTECH CO., LTD.Inventors: Gi Joo SHIN, Jung Yoon KIM, Kwang Soo PARK, Soo Wan CHOI
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Publication number: 20210179891Abstract: A polishing slurry composition for a shallow trench isolation (STI) process is provided. The polishing slurry composition includes abrasive particles, a nonionic polymer, and a polar amino acid.Type: ApplicationFiled: December 15, 2020Publication date: June 17, 2021Applicant: KCTECH CO., LTD.Inventors: Kwang Soo PARK, Jun Ha HWANG, Jung Yoon KIM, Nak Hyun CHOI
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Publication number: 20210163785Abstract: The present invention relates to a polishing slurry composition for an STI process and, more particularly, to a polishing slurry composition for an STI process, the composition comprising: a polishing solution including polishing particles; and an additive solution containing a polysilicon film polishing barrier inclusive of a polymer having an amide bond.Type: ApplicationFiled: November 13, 2018Publication date: June 3, 2021Applicant: KCTECH CO., LTD.Inventors: Jung Yoon KIM, Jun Ha HWANG, Kwang Soo PARK, Hae Won YANG
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Publication number: 20210079262Abstract: The present invention relates to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a nitride film polishing barrier inclusive of a polymer having an amide bond.Type: ApplicationFiled: November 13, 2018Publication date: March 18, 2021Applicant: KCTECH CO., LTD.Inventors: Hae Won YANG, Jun Ha HWANG, Jung Yoon KIM, Kwang Soo PARK
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Publication number: 20200071566Abstract: A slurry composition for a chemical mechanical polishing (CMP) process includes about 0.1% by weight to about 10% by weight of polishing particles, about 0.001% by weight to about 1% by weight of an amine compound, about 0.001% by weight to about 1% by weight of a first cationic compound that is amino acid, about 0.001% by weight to about 1% by weight of a second cationic compound that is organic acid, and about 1% by weight to about 5% by weight of polyhydric alcohol including at least two hydroxyl groups.Type: ApplicationFiled: August 28, 2019Publication date: March 5, 2020Applicant: KCTECH CO., LTD.Inventors: Sang-hyun Park, Hyo-san Lee, Won-ki Hur, Jung-yoon Kim, Jun-ha Hwang, Chang-gil Kwon, Sung-pyo Lee
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Patent number: 10546126Abstract: An electronic device is provided. The electronic device includes a memory configured to store an application and first unique information of the application, and at least one processor operatively connected with the memory. The at least one processor is configured to divide code of the application into a plurality of segments, select at least one segment among the plurality of segments, create second unique information in relation to the at least one segment, compare the first unique information and the second unique information, and determine whether the code of the application has been tampered with, based on a result of the comparison of the first unique information and the second unique information.Type: GrantFiled: June 5, 2017Date of Patent: January 28, 2020Assignee: Samsung Electronics Co., Ltd.Inventor: Jung Yoon Kim
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Publication number: 20190377866Abstract: An electronic device is disclosed. The electronic device may include a memory, and a processor electrically connected with the memory. The processor may be configured to install an application, allocate identification information, which is included in a preset range, to the installed application, store, at a first address of the memory, the identification information for indicating access privilege to a system resource, monitor the first address during running of a first process of the application, and terminate the first process, when the identification information stored at the first address is not included in the preset range. Moreover, various embodiment found through the disclosure are possible.Type: ApplicationFiled: December 29, 2017Publication date: December 12, 2019Inventors: Jin Mo YANG, Jung Yoon KIM, Hee Kwan LEE
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Publication number: 20190316003Abstract: The present invention relates to a slurry composition for polishing a high stepped region. The slurry composition for polishing a high stepped region according to an embodiment of the present invention comprises: a polishing liquid containing metal oxide abrasive particles dispersed by positive charges; and an additive liquid containing a polymer comprising at least one element capable of being activated as a positive charge, wherein the polishing selection ratio of the stepped region removal rate in an oxide film pattern wafer having convex portions and concave portions and the stepped region removal rate in an oxide film flat wafer is at least 5:1.Type: ApplicationFiled: April 14, 2017Publication date: October 17, 2019Applicant: KCTECH CO., LTD.Inventors: Jung Yoon KIM, Jun Ha HWANG, Sun Kyoung KIM, Kwang Soo PARK
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Patent number: 10428240Abstract: The present invention relates to a method for preparing a slurry composition and a slurry composition prepared thereby, and has advantages of reducing scratches and residual particles, which are considered to be one of the biggest factors contributing to the decline in yield due to macroparticles and aggregated particles, while maintaining a high polishing rate, in a semiconductor CMP process. Furthermore, the present invention can achieve excellent results in the application to various patterns required in the ultra-large scale integration semiconductor process, the wafer non-uniformity (WIWNU) exhibiting a polishing rate, polishing selectivity, and polishing uniformity, which meet the needs, and the micro-scratch minimization.Type: GrantFiled: January 23, 2015Date of Patent: October 1, 2019Assignee: KCTECH CO., LTD.Inventors: Jang Kuk Kwon, Chan Un Jeon, Ki Hwa Jung, Jung Yoon Kim, Nak Hyun Choi, Seong Pyo Lee, Bo Hyeok Choi