Abstract: Provided is an apparatus for producing a three-dimensional structure of the invention that produces a three-dimensional structure by laminating layers using a paste-like composition containing grains, the apparatus including a stage for which the composition is provided and on which the layers are formed; a first layer forming unit that supplies the composition to a forming area on the stage and forms a first layer; and a film thickness adjusting unit that adjusts the film thickness of the first layer and sets the adjusted first layer as a second layer.

Abstract: An apparatus for producing a three-dimensional structure that produces a three-dimensional structure by laminating layers to each other using a paste-like composition containing grains includes a stage for which the composition is provided and on which the layer is formed; and a dispenser that directly supplies the composition to a forming area on the stage.

Abstract: Provided is a three-dimensional structure manufacturing apparatus which manufactures a three-dimensional structure by laminating layers formed using three-dimensional formation compositions containing three-dimensional formation powders, the apparatus including: a formation unit in which the three-dimensional structure is formed; a supply unit which supplies the three-dimensional formation compositions to the formation unit; a layer formation unit which forms the layers configured with the three-dimensional formation compositions on the formation unit; and a discharge unit which discharges a binding solution to the layer, in which the supply unit and the layer formation unit form an n+1 layer on the backside of the discharge unit in a movement direction of the discharge unit, with the operation of discharging the binding solution, while moving the discharge unit relatively to an n-th layer.

Abstract: Provided is a three-dimensional structure manufacturing apparatus which manufactures a three-dimensional structure by laminating layers formed using three-dimensional formation compositions containing three-dimensional formation powders, the apparatus including: a formation unit in which the three-dimensional structure is formed; a first supply unit and a second supply unit which supply the three-dimensional formation compositions to the formation unit; a first squeegee and a second squeegee which form the layers configured with the three-dimensional formation compositions on the formation unit; and a discharge unit which discharges a binding solution for binding the three-dimensional formation compositions to the layer, in which the first supply unit, the first squeegee, the discharge unit, the second squeegee, and the second supply unit are arranged in this order, along a movement direction of the discharge unit.

Abstract: In a three-dimensional shaped object manufacturing device, layers are formed using a three-dimensional shaping composition including three-dimensional shaping powder are laminated to manufacture a three-dimensional shaped object. The three-dimensional shaped object manufacturing device includes a shaping section configured and arranged to shape the three-dimensional shaped object, a layer forming unit configured and arranged to form the layer constituted by the three-dimensional shaping composition on the shaping section, and an inclination measuring unit configured and arranged to measure an inclination of the layer forming unit with respect to a predetermined reference surface.

Abstract: A three-dimensional shaped object manufacturing device is adapted to manufacture a three-dimensional shaped object by laminating a layer formed using a three-dimensional shaping composition including three-dimensional shaping powder. The three-dimensional shaped object manufacturing device includes a shaping section configured and arranged to shape the three-dimensional shaped object, a layer forming unit configured and arranged to form the layer constituted by the three-dimensional shaping composition in the shaping section, and a distance detecting unit configured and arranged to detect a distance from a predetermined reference position to the layer forming unit.

Abstract: A three-dimensional shaped object manufacturing device is adapted to produce a three-dimensional shaped object by laminating layers using a pasty composition containing granular substances. The three-dimensional shaped object manufacturing device includes a stage in which the composition is supplied and the layers are formed, a side surface supporting section arranged on a side surface of the stage, and an adhesion preventing part configured and arranged to prevent adhesion of the composition on a surface of the side surface supporting section. The stage is movable relative to the side surface supporting section in a lamination direction of the layers.

Abstract: An apparatus for manufacturing a three-dimensional shaped object manufactures a three-dimensional shaped object by using a composition in paste form including particles to successively lay down layers, and has a stage where the composition is applied and where the layers are formed, and a side surface support part arranged at a side surface of the stage. The stage and the side surfaces support part are configured and arranged so that the stage moves relative to the side surface support part in a direction of layering of the layers. At least a part of the side surface support part is spaced apart from the side surface of the stage when the stage is moving relative to the side surface support part in the direction of layering of the layers.

Abstract: A three dimensional mold object manufacturing apparatus configured to manufacture a three dimensional mold object by layering layers which are formed using a three dimensional molding composition which includes a three dimensional molding powder, has a molding section configured to mold the three dimensional mold object, a layer forming section configured to form the layers formed by the three dimensional molding composition, on the molding section, and a discharging section configured to discharge bonding liquid, which bonds the three dimensional molding composition, with regard to the layers, and the molding section configured so as to move to a drawing region of the discharging section.

Abstract: A three dimensional mold object manufacturing apparatus configured to manufacture a three dimensional mold object by layering unit layers which are formed using a three dimensional molding composition which includes a three dimensional molding powder, has a molding section configured to mold the three dimensional mold object, and a first layer forming section and a second layer forming section configured to mold form layers, which are configured using the three dimensional molding composition, on the molding section.

Abstract: An apparatus for manufacturing a three-dimensional shaped object manufactures a three-dimensional shaped object by successively laying down unit layers formed using a three-dimensional shaping composition including a three-dimensional shaping powder, and has a shaping part where the three-dimensional shaped object is shaped, a layer forming part that forms layers constituted of the three-dimensional shaping composition on the shaping part, and a removal part that removes the three-dimensional shaping composition that has stuck to the layer forming part.

Abstract: A three dimensional mold object manufacturing apparatus is adapted to manufacture a three dimensional mold object by repeatedly forming and layering layers using a composition including particles. The apparatus includes a layer forming section which forms the layers using the composition, a binding liquid applying part which applies a binding liquid for bonding the particles in a predetermined region of the layer, and a modifying part which carries out modification processing with respect to the layer where the binding liquid is to be applied.

Abstract: A three dimensional mold object manufacturing apparatus is adapted to manufacture a three dimensional mold object by repeatedly forming and layering layers using a composition including particles. The apparatus includes a layer forming section which forms the layers using the composition, a bonded section forming part which bonds the particles included in a predetermined region of the layer and forms a bonded section, and a modifying part which carries out modification processing with regard to the layer where the bonded section is formed before a subsequent layer is formed on the layer where the bonded section is formed.

Abstract: A three dimensional mold object manufacturing apparatus is adapted to manufacture a three dimensional mold object by repeatedly forming and layering layers using a composition including particles. The apparatus includes a layer forming section configured to form the layers using the composition and a bulge detecting unit configured to detect a bulge on the layers. When the bulge detecting unit detects the bulge with a height equal to or more than a predetermined height formed on one of the layers, the layer forming section is configured and arranged to adjust a thickness of a subsequent one of the layers, which is provided directly on the one of the layers where the bulge is detected.

Abstract: A data generating method includes: inputting parameter values to an input screen unit having an input box for inputting parameter values that prescribe the image data; and displaying the input parameter values on the auxiliary display screen unit for which the parameter values are displayed as two-dimensional shapes.

Abstract: An image reading device, which includes: an original document reading section that emits light to an original document and in the vicinity of the original document, receives reflected light and outputs image signals; an original document positioning guide that has at least a first color and a second color on a side receiving the light emitted from the original document reading section, and is used for settling a position of the original document; a detection section that monitors a first image signal in a scanning direction from the first color to the original document and a second image signal in a scanning direction from the second color to the original document, and detects a position for extracting image signals corresponding to the light reflected on the original document on the basis of a change occurring in either of the first image signal or the second image signal.

Abstract: A method of placing integrated circuit chips on a wafer uses a library of average delay time values of logic gates. Exposure-dependent delay time values of the logic gates, which result from exposure of a unit area to a beam of radiation, are additionally stored in the library. These delay time values are detected by successively exposing unit areas of a test wafer to a beam of radiation as a function of relative positions of each integrated circuit chip within the unit exposure area. In a modified embodiment, only one integrated circuit chip within each unit area is exposed to the radiation beam, and the exposure-dependent delay time values are detected as a function of position within the exposed integrated circuit chip or as a function of distance from the center of the each unit area.

Abstract: A method of placing integrated circuit chips on a wafer uses a library of average delay time values of logic gates. Exposure-dependent delay time values of the logic gates, which result from exposure of a unit area to a beam of radiation, are additionally stored in the library. These delay time values are detected by successively exposing unit areas of a test wafer to a beam of radiation as a function of relative positions of each integrated circuit chip within the unit exposure area. In a modified embodiment, only one integrated circuit chip within each unit area is exposed to the radiation beam, and the exposure-dependent delay time values are detected as a function of position within the exposed integrated circuit chip or as a function of distance from the center of the each unit area.

Abstract: The critical area calculation means (4), by accessing the relationship between the mask layout data of the target LSI device included in the design data (3) and the size and density of the extraneous materials including in the extraneous material distribution information (6), calculates the critical area of the failure node candidate, the results of this calculation being displayed by the critical area information display means (5). The displayed critical area information is support information, which indicates to be checked by physical means, of the failure node candidates.

Abstract: A capacitance (1) is charged by making a switching means (2) conductive and by shutting down the switching means (2), the capacitance (1) is discharged through a measuring object device (6). A voltage comparing means (3) detects that a voltage Vc of the capacitance (1) is lower than a reference voltage Vr and outputs a comparison result. Because the larger the discharge current, the shorter a time until the voltage Vc of the capacitance (1) drops below the reference voltage Vr is, the magnitude of current is evaluated depending on a length of voltage fall time Tf.